ATTACHMENT DEVICES AND METHODS FOR LIGHT EMITTING DEVICES
First Claim
Patent Images
1. A light emitting device comprising:
- a submount;
a light emission area disposed over the submount; and
at least one attachment member provided on the submount for engaging an electrical component and providing a solder free connection for attachment of the electrical component to the attachment member.
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Accused Products
Abstract
Attachment devices and methods for use with light emitting devices are provided. In one aspect, the light emitting device can include a submount and a light emission area disposed over the submount. The device can further include at least one attachment member provided on the submount. The attachment member can engage an electrical component thereby providing a gas-tight, solder free connection between the attachment member and electrical component.
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Citations
69 Claims
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1. A light emitting device comprising:
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a submount; a light emission area disposed over the submount; and at least one attachment member provided on the submount for engaging an electrical component and providing a solder free connection for attachment of the electrical component to the attachment member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of providing external electrical current to a light emitting device, the method comprising:
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providing the light emitting device, the device comprising; a submount; a light emission area disposed over the submount; and at least one attachment member on the submount, wherein the attachment member releasably engages an electrical component thereby providing a solder free connection; attaching the electrical component into the attachment member of the device to physically and electrically connect the electrical component to the device. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A light emitting device comprising:
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a submount; a light emission area disposed over the submount; and at least one attachment member attached to the submount, the attachment member comprising a portion for receiving an electrical connector and maintaining the electrical connector a distance spaced apart from the submount. - View Dependent Claims (29, 30, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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31. The light emitting device of claim 31, wherein the retention material comprises a dispensed retention material on the submount.
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41. A light emitting device comprising:
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a submount; at least one electrical trace electrically connected with the submount; an array of LEDs electrically connected with the at least one electrical trace; and at least one attachment member attached to the submount, the attachment member comprising a portion for receiving an electrical connector and maintaining the electrical connector a distance spaced apart from the submount. - View Dependent Claims (42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53)
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54. A method for fabricating a light emitting device, the method comprising:
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providing a submount comprising one or more light emitting diodes (LEDs) disposed over the submount, the submount comprising an attachment member in electrically communication with the one or more LEDs; and electrically connecting the attachment member to an external electrical component such that the electrical component is maintained a distance spaced apart from the submount. - View Dependent Claims (55, 56, 57, 58, 59, 60, 61, 62)
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63. A device comprising:
a wire attachment surface on a device surface comprising an attachment member spaced apart from the device surface to receive a wire for bonding to the wire attachment surface and electrically coupling the wire to the device. - View Dependent Claims (64, 65, 66, 67, 68)
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69. A device comprising:
a wire attachment surface on a device surface comprising an attachment member adapted to receive a wire for bonding and a pad portion electrically coupled to the device, the attachment member providing electrical connection between the wire and the device while reducing the thermal coupling between the wire and the pad portion relative to the pad portion and the device surface.
Specification