MEDICAL IMPLANT DEVICE

• US 20120253468A1
• Filed: 10/20/2010
• Published: 10/04/2012
• Est. Priority Date: 10/22/2009
• Status: Active Grant

• Current Assignee: Depuy International Limited (Johnson & Johnson)
• Original Assignee: Depuy International Limited (Johnson & Johnson)
• Inventors: Brooks, James
• Granted Patent: US 8,632,604 B2
• Time in Patent Office: Days
• US Class Current: 623/23.5
• CPC Class Codes: A61F 2/30767 Special external or bone-contacting surface, e.g. coating for improving bone ingrowth
• CPC Class Codes: A61F 2/30771 applied in original prostheses, e.g. holes or grooves
• CPC Class Codes: A61F 2002/30136 undulated or wavy, e.g. serpentine-shaped or zigzag-shaped
• CPC Class Codes: A61F 2002/30769 madreporic
• CPC Class Codes: A61F 2002/30968 Sintering
• CPC Class Codes: A61F 2230/0004 Rounded shapes, e.g. with rounded corners

Abstract

A medical implant device comprises a substrate (10) having an undulating surface provided by peaks (12) which are separated by recesses (14). The device includes a porous coating layer provided on the undulating surface of the substrate which comprises a plurality of particles (16). The spacing between adjacent peaks on the surface of the substrate is less than the particle size of the particles. The particles are bonded to the peaks on the surface of the substrate and adjacent particles are bonded to one another.

Claims

1. A medical implant device, comprising a substrate having an undulating surface provided by peaks that are separated by recesses, wherein the device includes a porous coating layer provided on the undulating surface of the substrate and the porous coating layer includes a plurality of particles, wherein the spacing between adjacent peaks on the surface of the substrate is less than the particle size of the particles, and wherein particles are bonded to at least some of the peaks on the surface of the substrate and adjacent particles are bonded to one another.

2. The device of claim 1, wherein the peaks are spaced apart regularly on the surface of the substrate.

3. The device of claim 1, wherein the peaks comprise ridges, each ridge having a width and a length, the length being greater than the width, and wherein the recesses comprise troughs.

4. The device of claim 1, wherein the recesses comprise troughs and wherein the peaks are surrounded by the troughs.

5. The device of claim 1, wherein the surface of the substrate is provided by a metal and wherein the particles are formed from a metal.

6. The device of claim 5, wherein the particles are bonded to the peaks on the surface of the substrate and to one another by means of a sintering process.

7. The device of claim 1, wherein the particles have an approximately spherical shape.

8. The device of claim 1, wherein at least some of the recesses have a base and wherein the bases between adjacent peaks are rounded.

9. The device of claim 8, wherein the portions of the bases of the recesses that are rounded have an approximately constant radius.

11. The device of claim 1, wherein the peaks are rounded.

12. The device of claim 11, wherein the portions of the peaks that are rounded have an approximately constant radius.

13. The device of claim 12, wherein the ratio of the radius of the peaks to the size of the particles that are bonded to the peaks is not more than about 0.7.

14. The device of claim 1, further comprising a cover layer that overlies the porous coating layer and which includes a plurality of cover layer particles, wherein the cover layer particles are bonded to the particles of the coating layer and adjacent particles of the cover layer are bonded to one another, and wherein the particles of the coating layer are approximately spherical and the particles of the cover layer are aspherical.

10. (canceled)

15. A method of making a medical implant device, comprising:

a. forming a substrate having an undulating surface provided by peaks which are separated by recesses,

b. applying a layer of particles on the said surface of the substrate, wherein the spacing between adjacent peaks on the surface of the substrate is less than the particle size of the particles, and

c. bonding (i) particles to the peaks on the surface of the substrate and (ii) adjacent particles to one another.