Contact Processing Using Multi-Input/Multi-Output (MIMO) Models

• US 20120253497A1
• Filed: 03/31/2011
• Published: 10/04/2012
• Est. Priority Date: 03/31/2011
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Prager, Daniel J., Funk, Merritt, Biolsi, Peter, Shimizu, Ryukichi
• Granted Patent: US 8,532,796 B2
• Time in Patent Office: Days
• US Class Current: 700/104
• CPC Class Codes: H01J 37/32082 Radio frequency generated discharge H01J37/32357, H01J37/32366, H01J37/32394 and H01J37/32403 take precedence
• CPC Class Codes: H01J 37/3266 Magnetic control means
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/823871 interconnection or wiring or contact manufacturing related aspects
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention provides a systems and methods for creating Double Pattern (DP) structures on a patterned wafer in real-time using Dual Pattern Contact-Etch (DPCE) processing sequences and associated Contact-Etch-Multi-Input/Multi-Output (CE-MIMO) models. The DPCE processing sequences can include one or more contact-etch procedures, one or more measurement procedures, one or more contact-etch modeling procedures, and one or more contact-etch verification procedures. The CE-MIMO model uses dynamically interacting behavioral modeling between multiple layers and/or multiple contact-etch procedures. The multiple layers and/or the multiple contact-etch procedures can be associated with the creation of lines, trenches, vias, spacers, contacts, and gate structures that can be created during Double Patterning (DP) procedures.

Claims

1. A method for processing a wafer comprising:

receiving, by a processing system, a first set of patterned wafers and associated contact-etch (CE) data, each patterned wafer having a plurality transistor stacks and a plurality of additional layers thereon;

selecting a first patterned wafer from the first set of patterned wafers;

establishing a first double-pattern-contact-etch (DPCE) processing sequence for the selected first patterned wafer using the CE data;

determining if the first DPCE processing sequence includes a first contact-etch procedure;

performing the first contact-etch procedure when the first DPCE processing sequence includes the first contact-etch procedure, wherein a second set of patterned wafers is created when the first contact-etch procedure is performed using the first set of patterned wafers; and

performing a first corrective action when the first DPCE processing sequence does not include the first contact-etch procedure.

2. The method of claim 1, further comprising:

positioning the selected patterned wafer on a first wafer holder in a first process chamber;

creating a first contact-etch plasma in the first process chamber;

processing the selected patterned wafer using the first contact-etch plasma; and

obtaining first process sensor data while the selected patterned wafer is processed, wherein a first process sensor is coupled to the first process chamber and is configured to obtain the first process sensor data.

3. The method of claim 1, wherein performing the first corrective action comprises:

selecting a new patterned wafer from the first set of patterned wafers;

positioning the new patterned wafer on a new wafer holder in a new process chamber;

creating a new contact-etch plasma in the new process chamber;

processing the new patterned wafer using the new contact-etch plasma; and

obtaining new process sensor data while the new patterned wafer is processed, wherein a new process sensor is coupled to the new process chamber and is configured to obtain the new process sensor data.

4. The method of claim 1, further comprising:

determining if the first DPCE processing sequence includes a second contact-etch procedure;

performing the second contact-etch procedure when the first DPCE processing sequence includes the second contact-etch procedure, wherein the second contact-etch procedure uses a second etch subsystem having a second process chamber configured therein; and

performing a second corrective action when the first DPCE processing sequence does not include the second contact-etch procedure.

5. The method of claim 4, wherein performing the second contact-etch procedure comprises:

selecting an etched patterned wafer from a first set of etched patterned wafers;

positioning the selected etched patterned wafer on a second wafer holder in the second process chamber;

creating a second contact-etch plasma in the second process chamber;

processing the selected etched patterned wafer using the second contact-etch plasma; and

obtaining second process sensor data while the selected etched patterned wafer is processed, wherein a second process sensor is coupled to the second process chamber and is configured to obtain the second process sensor data.

6. The method of claim 4, wherein performing the second corrective action comprises:

selecting a new patterned wafer from the first set of patterned wafers;

positioning the new patterned wafer on a new wafer holder in a new process chamber;

creating a new contact-etch plasma in the new process chamber;

processing the new patterned wafer using the new contact-etch plasma; and

obtaining new process sensor data while the new patterned wafer is processed, wherein a new process sensor is coupled to the new process chamber and is configured to obtain the new process sensor data.

7. The method of claim 1, further comprising:

creating first simulation data for the first contact-etch procedure using a first Contact-Etch Multi-Input/Multi-Output (CE-MIMO) model, wherein the first CE-MIMO model includes a first number (N_a) of first Controlled Variables (CV_1a, CV_2a, . . . CV_Na), a second number (M_a) of first Manipulated Variables (MV_1a, MV_2a, . . . MV_Ma), and a third number (L_a) of first Disturbance Variables (DV_1a, DV_2a, . . . DV_La), wherein (L_a, M_a, and N_a) are integers greater than one;

obtaining first sensor data during the first contact-etch procedure, wherein a first sensor is coupled to a first process chamber;

establishing first difference data by comparing the first simulation data to the first sensor data;

verifying the first contact-etch procedure when the first difference data is less than or equal to first threshold data; and

storing the first simulation data and/or the first sensor data when the first difference data is greater than the first threshold data.

8. The method of claim 7, further comprising;

determining risk data for the first contact-etch procedure using the first difference data;

identifying the first contact-etch procedure as a verified contact-etch procedure when the risk data is less than a first risk limit; and

identifying the first contact-etch procedure as a non-verified contact-etch procedure when the risk data is not less than the first risk limit.

9. The method of claim 4, further comprising:

creating second simulation data for the second contact-etch procedure using a second Contact-Etch Multi-Input/Multi-Output (CE-MIMO) model, wherein the second CE-MIMO model includes a new first number (N_b) of new first Controlled Variables (CV_1b, CV_2b, . . . CV_Nb), a new second number (M_a) of new first Manipulated Variables (MV_1b, MV_2b, . . . MV_Mb), and a new third number (L_b) of new first Disturbance Variables (DV_1b, DV_2b, . . . DV_Lb), wherein (L_b, M_b, and N_b) are integers greater than one;

obtaining second sensor data during the second contact-etch procedure, wherein a second sensor is coupled to the second process chamber;

establishing second difference data by comparing the second simulation data to the second sensor data;

verifying the second contact-etch procedure when the second difference data is less than or equal to second threshold data; and

storing the second simulation data and/or the second sensor data when the second difference data is greater than the second threshold data.

10. The method of claim 9, further comprising;

determining second risk data for the second contact-etch procedure using the second difference data;

identifying the second contact-etch procedure as a verified contact-etch procedure when the second risk data is less than a second risk limit; and

identifying the second contact-etch procedure as a non-verified contact-etch procedure when the second risk data is not less than the second risk limit.

11. The method of claim 6, further comprising:

determining if the second (DPCE) sequence includes a new first contact-etch (CE) procedure;

performing the new first CE procedure when the second (DPCE) sequence includes the new first CE procedure, wherein the new first CE procedure uses a new first etch subsystem having a new first process chamber configured therein and a new first MIMO controller coupled thereto; and

performing a new first validation procedure when the second (DPCE) sequence does not include the new first CE procedure.

12. The method of claim 1, further comprising:

determining if the first DPCE processing sequence includes an Ion Energy Optimized (IEO)-etch procedure;

performing the IEO-etch procedure when the first DPCE processing sequence includes the IEO-etch procedure, wherein the IEO-etch procedure uses a new etch subsystem having a new process chamber configured therein; and

performing a new corrective action when the first DPCE processing sequence does not include the IEO-etch procedure.

13. The method of claim 12, wherein performing the IEO-etch procedure comprises:

positioning the selected patterned wafer on a wafer holder in a process chamber;

creating an IEO-etch plasma in the process chamber;

processing the selected second patterned wafer using the IEO-etch plasma; and

obtaining process sensor data while the selected patterned wafer is processed, wherein a second process sensor is coupled to the process chamber and is configured to obtain the process sensor data.

14. The method of claim 2, wherein creating the first contact-etch plasma comprises:

establishing a first chamber pressure in the first process chamber, wherein the first chamber pressure ranges from about 12 mT to about 18 mT;

establishing a first edge temperature and a first center temperature for the first wafer holder, the first center temperature being between about 12 degrees Celsius and about 20 degrees Celsius, the first edge temperature being between about 8 degrees Celsius and about 12 degrees Celsius;

establishing a first edge backside pressure and a first center backside pressure using a dual backside gas system in the first wafer holder, the first center backside pressure being between about 15 Torr and about 25 Torr, the first edge backside pressure being between about 27 Torr and about 33 Torr;

providing a first process gas into the first process chamber during the first time, wherein the first process gas includes CF₄ and CHF₃, a CF₄ flow rate varying between about 60 sccm and about 100 sccm and a first CHF₃ flow rate varying between about 40 sccm and about 60 sccm, wherein a gas plenum in the first process chamber is configured to provide the first process gas to one or more areas of a processing region;

providing a first radio frequency (RF) power to a center region in the first process chamber and providing a second RF power to an edge region in the first process chamber using a first power splitter coupled to two upper electrodes in the first process chamber, wherein a first RF source is coupled to the first power splitter, the first RF source operating in a frequency range from about 0.1 MHz. to about 200 MHz, the first RF power ranging from about 450 watts to about 550 watts and the second RF power ranging from about 10 watts to about 100 watts during the first time; and

providing a lower radio frequency (RF) power to a lower electrode in the first wafer holder using an RF generator and an impedance match network, the RF generator operating in a first frequency range from about 0.1 MHz. to about 200 MHz, the lower RF power ranging from about 90 watts to about 110 watts during the first time.

15. A method for processing a wafer using an Ion Energy (IE) controlled processing chamber, the method comprising:

receiving, by a processing system, a first set of patterned wafers and associated Ion Energy (IE) data, each patterned wafer having a first patterned etch-mask layer and a plurality of additional layers thereon;

determining an IE-related process sequence for the first set of patterned wafers using the IE data;

determining a first set of subsystems configured to perform the IE-related process sequence, wherein the first set of subsystems includes an etch subsystem having a first Ion Energy Controlled (IEC) process chamber configured therein and a Multi-Input/Multi-Output (MIMO) controller coupled thereto;

positioning a first patterned wafer on a first wafer holder in a first process chamber;

creating a first Ion Energy Optimized (IEO) plasma in the first process chamber; and

creating a new patterned wafer using a first contact-etch plasma, wherein first IE-sensor data is obtained while the new patterned wafer is created, wherein a first Ion Energy (IE) sensor is coupled to the first process chamber and is configured to obtain the first IE-sensor data. [there are many different “

chambers”

in this claim. Is the IEC process chamber the same as the first process chamber?]

16. The method as claimed in claim 15, wherein

establishing first difference data by comparing the first IE-sensor data to historical IE-sensor data;

continuing to process the first patterned wafer when the first difference data is less than or equal to first threshold data; and

stopping the IE-related process sequence when the first difference data is greater than the first threshold data.

17. A method for establishing a Contact-Etch Multi-Input/Multi-Output (CE-MIMO) model for creating a plurality of Double Pattern (DP) structures on a patterned wafer, the method comprising:

selecting a first Double Pattern Contact-Etch (DPCE) processing sequence and a first CE-MIMO model, a first contact-etch procedure in the first DPCE processing sequence being configured to create a plurality of contact structures on a second set of wafers using a patterned etch-mask layer on a first set of wafers, wherein the first CE-MIMO model is configured to simulate the first contact-etch procedure in the first DPCE processing sequence and includes a plurality of first Controlled Variables (CVs), a plurality of first Manipulated Variables (MVs), and a plurality of first Disturbance Variables (DVs);

determining a first number (N_a) of first Disturbance Variables (DV_1a, DV_2a, . . . DV_Na) associated with the first CE-MIMO model, wherein N_a is an integer greater than one and at least one first contact-etch procedure is configured to provide one or more of the first (DV_1a, DV_2a, . . . DV_Na);

determining a first number (L_a) of first (CV_1a, CV_2a, . . . CV_La), associated with the first CE-MIMO model and ranges associated with the first (CV_1a, CV_2a, . . . CV_La), wherein La is an integer greater than one and the first (CV_1a, CV_2a, . . . CV_La), include a first etch-mask width;

establishing a first number (M_a) of first (MV_1a, MV_2a, . . . MV_Ma) associated with the first CE-MIMO model using one or more candidate process chambers, wherein M_a is an integer greater than one and the first (MV_1a, MV_2a, . . . MV_Ma), include one or more Within-Wafer Manipulated Variables (WiW-MVs) configured to change while a wafer is being processed, and one or more Wafer-to-Wafer-Manipulated Variables (W2W-MVs) configured to change after the wafer has been processed;

analyzing the first CE-MIMO model, wherein one or more statistical models are selected, one or more ranges are provided for the first (CV_1a, CV_2a, . . . CV_La) and the first (MV_1a, MV₂, . . . MV_Ma), and one or more statistical analysis procedures are performed to establish Design of Experiments (DOE) data, wherein the statistical models are configured to associate one or more of the first (MV_1a, MV₂, . . . MV_Ma), with one or more of the first (CV_1a, CV_2a, . . . CV_La);

determining one or more stability conditions for the first CE-MIMO model; and

optimizing the first CE-MIMO model using performance parameters associated with a first set of processing tools configured to perform the first DPCE processing sequence.

18. The method of claim 17, further comprising:

creating one or more steady-state linear gain matrices (G) using the DOE data associated with the first DPCE processing sequence, wherein each gain matrix includes two or more of the first (MV_1a, MV₂, . . . MV_Ma), and two or more of the first (CV_1a, CV_2a, . . . CV_La);

calculating one or more Relative Gain Arrays (RGA) using one or more steady-state linear gain matrices (G), wherein RGA=G(G<sup>−

1</sup>)^T and denotes element-by-element multiplication; and

optimizing one or more sets of first (MV_1a, MV_2a, . . . MV_Ma), using one or more pairing rules.

19. The method of claim 17, wherein the calculating one or more Relative Gain Arrays (RGA) comprises:

20. The method of claim 17, wherein the one or more stability conditions are determined using a Niederlinski Stability Theorem wherein: