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Method for Fabricating Heat Dissipation Substrate

  • US 20120255165A1
  • Filed: 01/18/2012
  • Published: 10/11/2012
  • Est. Priority Date: 04/08/2011
  • Status: Active Grant
First Claim
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1. A method for fabricating a heat dissipation substrate, the method comprising:

  • providing a substrate, wherein the substrate comprises a metal layer, an insulation layer, and a first conductive layer;

    the insulation layer is positioned between the metal layer and the first conductive layer, and the metal layer is thicker than the first conductive layer;

    removing the partial metal layer for forming a metal bulk;

    providing an adhesive layer, wherein the adhesive layer comprises an opening, and the opening corresponds to the metal bulk;

    providing a second conductive layer;

    laminating the second conductive layer, the adhesive layer, and the substrate, wherein the adhesive layer is positioned above the substrate, and the second conductive layer is above the adhesive layer;

    forming a hole in the insulation layer and the first conductive layer, wherein the hole is positioned under the metal bulk; and

    at least forming a third conductive layer in the hole.

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