Method for Fabricating Heat Dissipation Substrate

• US 20120255165A1
• Filed: 01/18/2012
• Published: 10/11/2012
• Est. Priority Date: 04/08/2011
• Status: Active Grant

• Current Assignee: Unimicron Technology Corporation
• Original Assignee: Unimicron Technology Corporation
• Inventors: Chang, Chen-Chuan
• Granted Patent: US 9,247,631 B2
• Time in Patent Office: Days
• US Class Current: 29/829
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the printed circuit board [PCB]
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB
• CPC Class Codes: H05K 2203/0323 Working metal substrate or core, e.g. by etching, deforming
• CPC Class Codes: H05K 2203/061 of previously made multilayered subassemblies
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: H05K 3/4046 using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A method for fabricating a heat dissipation substrate is disclosed. The method includes the steps of: providing a substrate, wherein the substrate includes a metal layer, an insulation layer, and a first conductive layer, of which the insulation layer is positioned between the metal layer and the first conductive layer, and the metal layer is thicker than the first conductive layer; removing the partial metal layer for forming a metal bulk; providing an adhesive layer, wherein the adhesive layer includes an opening, and the opening is corresponding to the metal bulk; providing a second conductive layer; laminating the second conductive layer, the adhesive layer and the substrate; forming a hole in the insulation layer and the first conductive layer, wherein the hole is positioned under the metal bulk; forming a third conductive layer in the hole.

Claims

1. A method for fabricating a heat dissipation substrate, the method comprising:

providing a substrate, wherein the substrate comprises a metal layer, an insulation layer, and a first conductive layer;

the insulation layer is positioned between the metal layer and the first conductive layer, and the metal layer is thicker than the first conductive layer;

removing the partial metal layer for forming a metal bulk;

providing an adhesive layer, wherein the adhesive layer comprises an opening, and the opening corresponds to the metal bulk;

providing a second conductive layer;

laminating the second conductive layer, the adhesive layer, and the substrate, wherein the adhesive layer is positioned above the substrate, and the second conductive layer is above the adhesive layer;

forming a hole in the insulation layer and the first conductive layer, wherein the hole is positioned under the metal bulk; and

at least forming a third conductive layer in the hole.

2. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein the step of providing a substrate further comprises:

providing a composite board, wherein the composite board comprises a thin metal layer, the insulation layer and the first conductive layer, wherein the insulation layer is positioned between the thin metal layer and the first conductive layer; and

thickening the thin metal layer, allowing the thin metal layer to form the metal layer, and the composite board to form the substrate.

3. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein the step of providing a substrate further comprises:

providing a composite board, wherein the composite board comprises two metal conductive layers and a resin carrier, wherein the resin carrier is positioned between each of the metal conductive layers;

laminating a composite board on the outside of each of the metal conductive layers, wherein the composite board comprises an insulation layer and a thin metal layer, and each of the insulation layers is positioned between each of the metal conductive layers and the metal conductive layers;

thickening each of the thin metal layers; and

removing the resin carrier for forming the second substrate, wherein the metal conductive layer forms the first conductive layer, and the thin metal layer becomes thicker to form the metal layer.

4. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein the thickness of the metal layer is substantially between 38 and 65 micrometers.

5. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein the thickness of the insulation layer is substantially between 5 and 25 micrometers.

6. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein the thickness of the first conductive layer is substantially between 10 and 38 micrometers.

7. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein a material of the insulation layer comprises polypropene or resin.

8. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein a material of the adhesive layer comprises polypropene or resin.

9. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein the metal bulk comprises an upper surface and a lower surface;

the lower surface is connected to the insulation layer, and an area of the lower surface is larger than an area of the upper surface.

10. The method for fabricating the heat dissipation substrate as claimed in claim 9, wherein a ratio value range of the area of the upper surface to the area of the lower surface is substantially between 25% and 95%.

11. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein a method of the step of removing the partial metal layer comprises lithography and etching.

12. The method for fabricating the heat dissipation substrate as claimed in claim 1, wherein a method of the step of forming the third conductive layer in the hole comprises chemical plating or electroplating.