METHOD FOR MANUFACTURING FABRIC TYPE CIRCUIT BOARD

• US 20120255166A1
• Filed: 04/05/2012
• Published: 10/11/2012
• Est. Priority Date: 04/05/2011
• Status: Active Grant

• Current Assignee: Electronics and Telecommunications Research Institute
• Original Assignee: Electronics and Telecommunications Research Institute
• Inventors: Kim, Ji Eun, KIM, Bae Sun, Ki, Yong, Yong, Sung
• Granted Patent: US 8,984,747 B2
• Time in Patent Office: Days
• US Class Current: 29/846
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/068 Features of the lamination press or of the lamination process, e.g. using special separator sheets
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

An embodiment of the present invention relates to a method for manufacturing a fabric type circuit board and can form a fine pattern by performing the etching process on the metal layer when a circuit pattern is formed, transfer the circuit pattern to the fabric by a thermosetting adhesive film to secure strong durability against flexibility of the fabric and sufficient electric conductivity and maintain ventilation, and apply various mounting methods such as soldering, wire bonding, or the like, when electronic parts are mounted.

Claims

1. A method for manufacturing a fabric type circuit board, comprising:

forming a metal plating layer on a base substrate;

forming a circuit pattern by etching the metal plating layer;

bonding a carrier film on the circuit pattern;

bonding an adhesive film after removing the base substrate; and

transferring the circuit pattern by bonding the adhesive film to a fabric.

3. The method of claim 1, wherein the base substrate is a metal foil including any one of stainless steel (SUS), copper foil, nickel foil and aluminum foil.

4. The method of claim 1, wherein the forming of the metal plating layer includes forming a metal seed layer on the base substrate by a vacuum sputtering method.

5. The method of claim 1, wherein the metal plating layer is formed at a thickness of 1 to 35 μ

m by performing wet plating on copper.

6. The method of claim 1, wherein the adhesive film is bonded at a speed of 1 to 1.5 m/min, a pressure of 1.8 to 2.2 kgf/cm², and a temperature of 90°

C. to 110°

C.

7. The method of claim 1, wherein the adhesive film is any one of acrylic-based, urethane-based, polyester-based, and polyimide varnish-based adhesives.

8. The method of claim 1, wherein the forming of the circuit pattern includes bonding an exposure film to the metal plating layer at a speed of 1 to 1.5 m/min, a pressure of 5 to 7 kgf/cm² and a temperature of 100°

C. to 120°

C., exposing the exposure film and spraying an etchant to form the circuit pattern.

9. The method of claim 1, wherein at the transferring of the circuit pattern, a thermal compression apparatus primarily performs thermal compression for 15 to 20 minutes at a pressure of 13 to 16 kgf/cm² and a temperature of 90°

C. to 110°

C. and secondarily performs thermal compression for 40 to 50 minutes at a pressure of 18 to 22 kgf/cm² and a temperature of 150°

C. to 170°

C.

10. The method of claim 1, further comprising forming an anti-oxidation layer on the circuit pattern transferred to the fabric.

11. The method of claim 10, wherein the anti-oxidation layer is formed at 1 μ

m or less by electroless-plating any one of tin, silver and gold.

2. The method of 1, wherein the base substrate is a polymer film including any one of polyester (PET), polycarbonate (PC) and polypropylene sulfide (PPS).

12. A method for manufacturing a fabric type circuit board, comprising:

bonding an adhesive film to a metal thin film;

forming a circuit pattern by etching the metal thin film;

bonding a carrier film on the circuit pattern; and

transferring the circuit pattern by bonding the adhesive film to a fabric.

13. The method of claim 12, wherein the metal thin film is a copper foil of a thickness of 18 μ

m or 35 μ

m.

14. The method of claim 12, wherein the adhesive film is bonded at a speed of 1 to 1.5 m/min, a pressure of 1.8 to 2.2 kgf/cm², and a temperature of 90°

C. to 110°

C.

15. The method of claim 12, wherein the adhesive film is any one of acrylic-based, urethane-based, polyester-based, and polyimide varnish-based adhesives.

16. The method of claim 12, wherein the forming of the circuit pattern includes bonding an exposure film to the metal thin film at a speed of 1 to 1.5 m/min, a pressure of 5 to 7 kgf/cm² and a temperature of 100°

C. to 120°

C., exposing the exposure film and spraying an etchant to form the circuit pattern.

17. The method of claim 12, wherein at the transferring of the circuit pattern, a thermal compression apparatus primarily performs thermal compression for 15 to 20 minutes at a pressure of 13 to 16 kgf/cm² and a temperature of 90°

C. to 110°

C. and secondarily performs thermal compression for 40 to 50 minutes at a pressure of 18 to 22 kgf/cm² and a temperature of 150°

C. to 170°

C.

18. The method of claim 12, further comprising forming an anti-oxidation layer on the circuit pattern transferred to the fabric.

19. The method of claim 18, wherein the anti-oxidation layer is formed at 1 μ

m or less by electroless-plating any one of tin, silver and gold.