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METHOD FOR MANUFACTURING FABRIC TYPE CIRCUIT BOARD

  • US 20120255166A1
  • Filed: 04/05/2012
  • Published: 10/11/2012
  • Est. Priority Date: 04/05/2011
  • Status: Active Grant
First Claim
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1. A method for manufacturing a fabric type circuit board, comprising:

  • forming a metal plating layer on a base substrate;

    forming a circuit pattern by etching the metal plating layer;

    bonding a carrier film on the circuit pattern;

    bonding an adhesive film after removing the base substrate; and

    transferring the circuit pattern by bonding the adhesive film to a fabric.

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