METHOD FOR MANUFACTURING FABRIC TYPE CIRCUIT BOARD
First Claim
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1. A method for manufacturing a fabric type circuit board, comprising:
- forming a metal plating layer on a base substrate;
forming a circuit pattern by etching the metal plating layer;
bonding a carrier film on the circuit pattern;
bonding an adhesive film after removing the base substrate; and
transferring the circuit pattern by bonding the adhesive film to a fabric.
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Abstract
An embodiment of the present invention relates to a method for manufacturing a fabric type circuit board and can form a fine pattern by performing the etching process on the metal layer when a circuit pattern is formed, transfer the circuit pattern to the fabric by a thermosetting adhesive film to secure strong durability against flexibility of the fabric and sufficient electric conductivity and maintain ventilation, and apply various mounting methods such as soldering, wire bonding, or the like, when electronic parts are mounted.
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Citations
19 Claims
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1. A method for manufacturing a fabric type circuit board, comprising:
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forming a metal plating layer on a base substrate; forming a circuit pattern by etching the metal plating layer; bonding a carrier film on the circuit pattern; bonding an adhesive film after removing the base substrate; and transferring the circuit pattern by bonding the adhesive film to a fabric. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11)
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2. The method of 1, wherein the base substrate is a polymer film including any one of polyester (PET), polycarbonate (PC) and polypropylene sulfide (PPS).
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12. A method for manufacturing a fabric type circuit board, comprising:
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bonding an adhesive film to a metal thin film; forming a circuit pattern by etching the metal thin film; bonding a carrier film on the circuit pattern; and transferring the circuit pattern by bonding the adhesive film to a fabric. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19)
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Specification