HEAT DISSIPATION DEVICE AND MANUFACTURING METHOD THEREOF

• US 20120255716A1
• Filed: 04/07/2011
• Published: 10/11/2012
• Est. Priority Date: 04/07/2011
• Status: Abandoned Application

• Current Assignee: Asia Vital Components Company Limited
• Original Assignee: Asia Vital Components Company Limited
• Inventors: Wu, Wen-Yuan, Lu, Chih-Chieh
• Application Number:
  US13/081,834
• Publication Number:
  US 20120255716A1
• Time in Patent Office: Days
• US Class Current: 165/173
• CPC Class Codes: B23P 15/26 heat exchangers or the like making heat exchangers by methods covered by other subclasses B21D53/02
• CPC Class Codes: F28D 1/05366 Assemblies of conduits connected to common headers, e.g. core type radiators
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28D 15/0283 Means for filling or sealing heat pipes
• CPC Class Codes: F28D 15/04 with tubes having a capillary structure
• CPC Class Codes: F28F 1/126 consisting of zig-zag shaped fins F28F1/105 takes precedence
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49389 Header or manifold making

Abstract

A heat dissipation device and a manufacturing method thereof. The heat dissipation device includes a first chamber defining a first cavity, a second chamber defining a second cavity, and multiple connection members each defining a passageway. First and second ends of the connection members are respectively connected with the first and second chambers in communication with the first and second cavities through the passageways. A working fluid is contained in the first cavity. When the working fluid is heated, the working fluid is evaporated into vapor. The vapor passes through the passageways into the second cavity. After reaching the second cavity, the vapor is condensed into liquid state. Then, the liquid goes back into the first cavity through the passageways to complete a working cycle and achieve heat dissipation effect.

Claims

1. A heat dissipation device comprising:

a first chamber defining a first cavity;

a second chamber defining a second cavity; and

multiple connection members each having a first opening, a second opening and at least one passageway, the first and second openings communicating with the passageway, the first and second openings of the connection members being respectively connected with the first and second chambers to communicate with the first and second chambers through the passageways.

2. The heat dissipation device as claimed in claim 1, wherein the first chamber is formed with multiple first perforations corresponding to the first openings in position, the first openings extending to connect with the first perforations or extending through the first perforations into the first cavity.

3. The heat dissipation device as claimed in claim 1, wherein the second chamber is formed with multiple second perforations corresponding to the second openings in position, the second openings extending to connect with the second perforations or extending through the second perforations into the second cavity.

4. The heat dissipation device as claimed in claim 1, wherein the passageways of the connection members communicate with the first and second cavities through the first and second openings.

5. The heat dissipation device as claimed in claim 1, wherein at least one radiating fin assembly is disposed between each two adjacent connection members.

6. The heat dissipation device as claimed in claim 1, wherein at least one capillary structure layer is disposed in the first and second chambers and the connection members and a working fluid is contained in the first and second chambers and the connection members.

7. A manufacturing method of a heat dissipation device, comprising steps of:

providing a first chamber defining a first cavity;

providing a second chamber defining a second cavity;

providing multiple connection members each defining a passageway;

connecting the first and second chambers with each other by means of the connection members with the passageways in communication with the first and second cavities;

providing a conduit and selectively connecting the conduit with the first chamber or second chamber;

evacuating air out of the first cavity, the passageways and the second cavity through the conduit and then filling working fluid into the first cavity or second cavity through the conduit; and

sealing a first end of the conduit.

8. The manufacturing method of the heat dissipation device as claimed in claim 7, wherein at least one radiating fin assembly is disposed between each two adjacent connection members.

9. The manufacturing method of the heat dissipation device as claimed in claim 7, wherein at least one capillary structure layer is disposed on inner wall faces of the first and second cavities and the connection members.

10. The manufacturing method of the heat dissipation device as claimed in claim 7, further comprising a step of removing the conduit after the step of sealing the first end of the conduit.

11. The manufacturing method of the heat dissipation device as claimed in claim 7, wherein the conduit has a first end and a second end, in the case that the conduit is connected with the first chamber, the first end being exposed to outer side of the first chamber, while the second end communicating with the first cavity, in the case that the conduit is connected with the second chamber, the first end being exposed to outer side of the second chamber, while the second end communicating with the second cavity.