TEST STRUCTURE FOR PARALLEL TEST IMPLEMENTED WITH ONE METAL LAYER
First Claim
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1. An integrated test circuit, comprising:
- a plurality of pads of a padset for testing multiple device under test units (MDUTs), the MDUTs each including a plurality of devices under test (DUTs); and
a first integrated test circuit metal layer patterned to connect the pads to N MDUTs such that a first set of the plurality of pads are employed for enabling testing of each MDUT and a second set of the plurality of pads are designated for testing individual DUTs associated with the enabled MDUTs such that N parallel tests may be concurrently performed.
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Abstract
An integrated test circuit includes pads of a padset for testing multiple device under test units (MDUTs). The MDUTs each include devices under test (DUTs). A first integrated test circuit metal layer is patterned to connect the pads to N MDUTs such that a first set of pads are employed for enabling testing of each MDUT and a second set of pads are designated for testing individual DUTs associated with the enabled MDUTs such that N parallel tests may be concurrently performed.
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Citations
23 Claims
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1. An integrated test circuit, comprising:
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a plurality of pads of a padset for testing multiple device under test units (MDUTs), the MDUTs each including a plurality of devices under test (DUTs); and a first integrated test circuit metal layer patterned to connect the pads to N MDUTs such that a first set of the plurality of pads are employed for enabling testing of each MDUT and a second set of the plurality of pads are designated for testing individual DUTs associated with the enabled MDUTs such that N parallel tests may be concurrently performed. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A system for testing integrated circuits, comprising:
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a plurality of pads of a padset for testing N multiple device under test units (MDUTs), the MDUTs each including a plurality of devices under test (DUTs); parallel wiring formed in a first metal layer and configured to selectively enable each MDUT through a first set of the plurality of pads, the parallel wiring further configured to enable individual DUT tests through a second set of the plurality of pads; and a parallel tester configured to generate signals on the padset such that in conjunction with the parallel wiring, N parallel tests may be concurrently performed. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for testing a test structure, comprising:
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contacting a plurality of pads of a padset for testing multiple device under test units (MDUTs), the MDUTs each including a plurality of devices under test DUTs; generating signals to a first integrated test circuit metal layer patterned to connect the pads to test N MDUTs such that a first set of the plurality of pads are employed for enabling testing of each MDUT and a second set of the plurality of pads are designated for testing individual DUTs associated with the enabled MDUTs; and concurrently performing N parallel tests to test the DUTs. - View Dependent Claims (19, 20, 21, 22, 23)
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Specification