ASSEMBLY OF TWO SUBSTRATES BONDED BY A RIGID POLYMER, AND METHODS FOR ASSEMBLY AND DISMANTLING BY MEANS OF MIGRATION OF SAID BONDED ASSEMBLY

• US 20120258315A1
• Filed: 12/24/2010
• Published: 10/11/2012
• Est. Priority Date: 12/29/2009
• Status: Abandoned Application

• Current Assignee: RESCOLL Sarl (Applus Services SA)
• Original Assignee: RESCOLL Sarl (Applus Services SA)
• Inventors: Olive, Maxime, Foulc, Marie-Pierre, Bergara, Tomas
• Application Number:
  US13/517,311
• Publication Number:
  US 20120258315A1
• Time in Patent Office: Days
• US Class Current: 428/416
• CPC Class Codes: C08J 5/08 glass fibres
• CPC Class Codes: C09J 2301/502 process for debonding adherents
• CPC Class Codes: C09J 2433/00 Presence of (meth)acrylic polymer
• CPC Class Codes: C09J 2463/00 Presence of epoxy resin
• CPC Class Codes: C09J 5/06 involving heating of the applied adhesive
• CPC Class Codes: Y02P 20/582 Recycling of unreacted starting or intermediate materials
• CPC Class Codes: Y10T 156/1153 Temperature change for delamination [e.g., heating during delaminating, etc.]
• CPC Class Codes: Y10T 428/31522 Next to metal

Abstract

An assembly (20) includes a first substrate (10) and a second substrate (12) bonded by at least one joint (14), characterized in that the joint (14) is made of a polymer material with a Young modulus tensile value at 25° C. of 500 MPa to 5 GPa, and includes at least one migrating agent suitable for migrating up to at least two interfaces of the joint (14) in order to generate interfacial detachment. A composition suitable for bonding the assembly, a method for assembling the assembly by bonding and a method for dismantling the bonded assembly via migration and creation of an interfacial detachment by heating the body thereof are also described.

Claims

1. Assembly (20), which can be disassembled by heating in its entirety, comprising a first substrate (10) and a second substrate (12) that are bonded with at least one seal (14), characterized in that said seal (14) consists of polymer material that has a Young'"'"'s modulus value of tensile strength at 25°

C. of between 500 MPa and 5 GPa, and comprises at least one migrating agent that can migrate up to at least one of the interfaces of the seal (14) to generate an interfacial detachment under the action of heat.

2. Composition that is designed to be used as a seal (14) for the assembly (20) according to claim 1, wherein it comprises:

A polymer base that has a Young'"'"'s modulus of tensile strength at 25°

C. of between 500 MPa and 5 GPa, and

At least one migrating agent in a proportion of between 5 and 50% by weight of the polymer base.

3. Composition according to claim 2, wherein the migrating agent is a polycarboxylic acid.

4. Composition according to claim 2, wherein the migrating agent is azodicarbonamide.

5. Composition according to claim 2, wherein the polymer base is an epoxy matrix.

6. Composition according to claim 2, wherein the polymer base is an acrylate matrix.

7. Method for assembling an assembly (20) according to claim 1, which comprises carrying out the series of the following stages:

Placing at least one composition comprising a polymer base having a Young'"'"'s modulus of tensile strength at 25°

C. of between 500 MPa and 5 GPa, and at least one migrating agent in a proportion of between 5 and 50% by weight of the polymer base, between a first substrate (10) and a second substrate (12),

Pressing the two substrates (10, 12) against one another, and

Polymerizing the composition to form a seal (14) and to produce the bonded assembly of the two substrates (10, 12).

8. Method for disassembling an assembly (20) according to claim 1, comprising the following stages:

Heating the assembly (20) with heating in its entirety at the decomposition temperature of the migrating agent that is incorporated into the seal (14) so as to be able to generate gases and cause their migration up to an interface of the seal (14) with a substrate (10, 12), thus producing an interfacial detachment, and

Separating the elements facing the interfacial detachment.

9. Composition according to claim 3, wherein the polymer base is an epoxy matrix.

10. Composition according to claim 4, wherein the polymer base is an epoxy matrix.

11. Composition according to claim 3, wherein the polymer base is an acrylate matrix.

12. Composition according to claim 4, wherein the polymer base is an acrylate matrix.

13. The method according to claim 7, wherein the migrating agent is a polycarboxylic acid.

14. The method according to claim 7, wherein the migrating agent is azodicarbonamide.

15. The method according to claim 7, wherein the polymer base is an epoxy matrix.

16. The method according to claim 7, wherein the polymer base is an acrylate matrix.