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ASSEMBLY OF TWO SUBSTRATES BONDED BY A RIGID POLYMER, AND METHODS FOR ASSEMBLY AND DISMANTLING BY MEANS OF MIGRATION OF SAID BONDED ASSEMBLY

  • US 20120258315A1
  • Filed: 12/24/2010
  • Published: 10/11/2012
  • Est. Priority Date: 12/29/2009
  • Status: Abandoned Application
First Claim
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1. Assembly (20), which can be disassembled by heating in its entirety, comprising a first substrate (10) and a second substrate (12) that are bonded with at least one seal (14), characterized in that said seal (14) consists of polymer material that has a Young'"'"'s modulus value of tensile strength at 25°

  • C. of between 500 MPa and 5 GPa, and comprises at least one migrating agent that can migrate up to at least one of the interfaces of the seal (14) to generate an interfacial detachment under the action of heat.

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