Semiconductor substrate, semiconductor device, and manufacturing methods thereof
First Claim
1. A method of fabricating a light emitting device using a recycled substrate, the method comprising:
- forming a plurality of compound semiconductor layers on a first substrate, the compound semiconductor layers comprising a first semiconductor layer;
disposing a second substrate on the plurality of compound semiconductor layers;
separating the first substrate from the plurality of semiconductor layers at the first semiconductor layer, thereby exposing a first surface of the first semiconductor layer; and
flattening the first surface of the first semiconductor layer,wherein separating the first substrate from the plurality of semiconductor layers comprises;
forming a plurality of cavities in the first semiconductor layer; and
etching the first semiconductor layer to increase the volume of each of the plurality of the cavities.
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Abstract
Exemplary embodiments of the present invention provide a method of fabricating a semiconductor substrate, the method including forming a first semiconductor layer on a substrate, forming a metallic material layer on the first semiconductor layer, forming a second semiconductor layer on the first semiconductor layer and the metallic material layer, etching the substrate using a solution to remove the metallic material layer and a portion of the first semiconductor layer, and forming a cavity in the first semiconductor layer under where the metallic material layer was removed.
10 Citations
14 Claims
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1. A method of fabricating a light emitting device using a recycled substrate, the method comprising:
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forming a plurality of compound semiconductor layers on a first substrate, the compound semiconductor layers comprising a first semiconductor layer; disposing a second substrate on the plurality of compound semiconductor layers; separating the first substrate from the plurality of semiconductor layers at the first semiconductor layer, thereby exposing a first surface of the first semiconductor layer; and flattening the first surface of the first semiconductor layer, wherein separating the first substrate from the plurality of semiconductor layers comprises; forming a plurality of cavities in the first semiconductor layer; and etching the first semiconductor layer to increase the volume of each of the plurality of the cavities. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification