PHOSPHOR REFLECTING SHEET, LIGHT EMITTING DIODE DEVICE, AND PRODUCING METHOD THEREOF

• US 20120261700A1
• Filed: 04/13/2012
• Published: 10/18/2012
• Est. Priority Date: 04/14/2011
• Status: Active Grant

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: OOYABU, Yasunari, ITO, Hisataka, NAITO, Toshiki, NISHIOKA, Tsutomu
• Granted Patent: US 9,412,920 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A phosphor reflecting sheet provides a phosphor layer on one side in a thickness direction of a light emitting diode element and provides a reflecting resin layer at the side of the light emitting diode element. The phosphor reflecting sheet includes the phosphor layer and the reflecting resin layer provided on one surface in the thickness direction of the phosphor layer. The reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to the side surface of the light emitting diode element.

Claims

1. A phosphor reflecting sheet, for providing a phosphor layer on one side in a thickness direction of a light emitting diode element and providing a reflecting resin layer at the side of the light emitting diode element, comprising:

the phosphor layer and

the reflecting resin layer provided on one surface in the thickness direction of the phosphor layer, wherein

the reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to a side surface of the light emitting diode element.

2. A method for producing a light emitting diode device comprising the steps of:

providing a reflecting resin layer on one surface in a thickness direction of a phosphor layer to prepare a phosphor reflecting sheet in which the reflecting resin layer is formed corresponding to the light emitting diode element so as to be disposed in opposed relation to the side surface of the light emitting diode element,

providing the light emitting diode element on one surface in the thickness direction of a substrate,

forming a through hole in the substrate such that the through hole extends therethrough in the thickness direction thereof;

laminating the phosphor reflecting sheet on the substrate so as to dispose the reflecting resin layer in opposed relation to the through hole and dispose the phosphor layer in opposed relation to one surface in the thickness direction of the light emitting diode element,

reducing a pressure in the through hole, and

bringing the reflecting resin layer into close contact with a side surface of the light emitting diode element.

3. The method for producing the light emitting diode device according to claim 2, wherein

the substrate is a diode board and

in the step of providing the light emitting diode element on the substrate,

the light emitting diode element is flip mounted on the substrate.

4. The method for producing the light emitting diode device according to claim 2, wherein

the substrate is a release substrate, and

the method for producing the light emitting diode device further comprising the steps of:

peeling off the substrate from the light emitting diode element and the reflecting resin layer and

flip mounting the light emitting diode element on the diode board.

5. A light emitting diode device comprising:

a diode board,

a light emitting diode element flip mounted on the diode board,

a phosphor layer laminated on one surface in a thickness direction of the light emitting diode element, and

a reflecting resin layer in close contact with a side surface of the light emitting diode element.