SOI DEVICE WITH DTI AND STI
First Claim
1. An SOI structure comprising:
- a semiconductor on insulator (SOI) substrate including a top semiconductor layer, an intermediate buried oxide (BOX) layer and a bottom substrate;
at least two wells in the bottom substrate;
a deep trench isolation (DTI) separating said two wells, the DTI having a top portion extending through the BOX layer and top semiconductor layer and a bottom portion within the bottom substrate wherein the bottom portion has a width that is larger than a width of the top portion; and
at least two semiconductor devices in the semiconductor layer located over one of the wells, the at least two semiconductor devices being separated by a shallow trench isolation (STI) within the top semiconductor layer.
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Accused Products
Abstract
An SOI structure including a semiconductor on insulator (SOI) substrate including a top silicon layer, an intermediate buried oxide (BOX) layer and a bottom substrate; at least two wells in the bottom substrate; a deep trench isolation (DTI) separating the two wells, the DTI having a top portion extending through the BOX layer and top silicon layer and a bottom portion within the bottom substrate wherein the bottom portion has a width that is larger than a width of the top portion; and at least two semiconductor devices in the silicon layer located over one of the wells, the at least two semiconductor devices being separated by a shallow trench isolation within the top silicon layer.
50 Citations
21 Claims
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1. An SOI structure comprising:
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a semiconductor on insulator (SOI) substrate including a top semiconductor layer, an intermediate buried oxide (BOX) layer and a bottom substrate; at least two wells in the bottom substrate; a deep trench isolation (DTI) separating said two wells, the DTI having a top portion extending through the BOX layer and top semiconductor layer and a bottom portion within the bottom substrate wherein the bottom portion has a width that is larger than a width of the top portion; and at least two semiconductor devices in the semiconductor layer located over one of the wells, the at least two semiconductor devices being separated by a shallow trench isolation (STI) within the top semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of forming an SOI structure comprising:
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providing a semiconductor on insulator (SOI) substrate having an SOI layer, an intermediate buried oxide (BOX) layer and a bottom substrate; patterning the SOI layer to form first and second openings in the SOI layer; extending the first openings into the bottom substrate; enlarging the first openings within the bottom substrate; filling the first and second openings with an insulator material to form deep trench isolations (DTIs) from the first openings and shallow trench isolations (STIs) from the second openings; implanting in the bottom substrate between the DTIs to form wells; and forming semiconductor devices in the SOI layer between the DTIs with each semiconductor device being separated from an adjacent semiconductor device by an STI. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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Specification