POWER-SUPPLY MODULE

• US 20120262145A1
• Filed: 05/28/2012
• Published: 10/18/2012
• Est. Priority Date: 02/18/2008
• Status: Active Grant

• Current Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Original Assignee: Cyntec Co. Ltd. (Delta Electronics Incorporated)
• Inventors: Chen, Da-Jung, Liu, Chun-Tiao
• Granted Patent: US 9,271,398 B2
• Time in Patent Office: Days
• US Class Current: 323/311
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/1003 Non-printed inductor
• CPC Class Codes: H05K 2201/10515 Stacked components
• CPC Class Codes: H05K 2201/10537 Attached components
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

A power-supply module includes at least one power-supply component, an inductor and a package. The inductor is disposed over the at least one power-supply components, and the at least a power-supply component and the inductor are disposed within the package. Besides, the power-supply module further comprises a printed circuit board, and the at least one power-supply component and the inductor are mounted to the printed circuit board. Moreover, the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

Claims

1. A power-supply module, comprising:

at least one power-supply component;

an inductor disposed over the at least one power-supply component; and

a package, wherein the at least one power-supply component and the inductor are disposed within the package.

2. The power-supply module as claimed in claim 1, wherein the package comprises insulating material to encapsulate the at least one power-supply component and the inductor.

3. The power-supply module as claimed in claim 2, wherein the insulating material includes epoxy resin.

4. The power-supply module as claimed in claim 1, wherein the at least one power-supply component is a controller.

5. The power-supply module as claimed in claim 1, wherein the at least one power-supply component is a transistor.

6. The power-supply module as claimed in claim 1, wherein the at least one power-supply component is a resistor.

7. The power-supply module as claimed in claim 1, wherein the at least one power-supply component is a capacitor.

8. The power-supply module as claimed in claim 1, wherein the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

9. The power-supply module as claimed in claim 1, further comprising:

a platform, wherein the at least one power-supply component and the inductor are mounted to the platform.

10. The power-supply module as claimed in claim 1, further comprising:

a printed circuit board, wherein the at least one power-supply component and the inductor are mounted to the printed circuit board.

11. The power-supply module as claimed in claim 1, further comprising:

a circuit substrate, wherein the at least one power-supply component and the inductor are mounted to the circuit substrate.

12. A system, comprising:

a power-supply module, comprising;

at least one power-supply component;

an inductor, disposed over the power-supply components;

a package, wherein the at least a power-supply component and the inductor are disposed within the package; and

a supply output node; and

an apparatus, coupled to the supply output node.

13. The system as claimed in claim 12, wherein the apparatus comprises an integrated circuit.

14. The system as claimed in claim 13, wherein the integrated circuit comprises a processor.

15. The system as claimed in claim 13, wherein the integrated circuit comprises a memory.

16. A method, comprising the steps of:

a. disposing an inductor over at least one power-supply component; and

b. forming a package encapsulating the inductor and the at least one power-supply component.

17. The method as claimed in claim 16, wherein the step a comprises the sub-steps of:

a1. mounting the at least one power-supply component to a platform; and

a2. mounting the inductor to the platform over the at least one power-supply component.

18. The method as claimed in claim 16, wherein the package comprises epoxy resin.

19. The method as claimed in claim 16, wherein the inductor comprises a plurality of leads that support the inductor over the at least one power-supply component.

20. The method as claimed in claim 17, wherein the platform is a circuit substrate.