THERMAL INTERFACE MATERIALS AND SYSTEMS AND DEVICES CONTAINING THE SAME

• US 20120263940A1
• Filed: 04/16/2012
• Published: 10/18/2012
• Est. Priority Date: 04/14/2011
• Status: Active Grant

• Current Assignee: Delta Design Incorporated (COHU Incorporated)
• Original Assignee: ADA Technologies, Inc.
• Inventors: Arzberger, Steven C., Campbell, Douglas, Naha, Sayangdev
• Granted Patent: US 9,346,991 B2
• Time in Patent Office: Days
• US Class Current: 428/328
• CPC Class Codes: B32B 2307/302 Conductive
• CPC Class Codes: B82Y 30/00 Nanotechnology for materials or surface science, e.g. nanocomposites
• CPC Class Codes: C09K 5/14 Solid materials, e.g. powdery or granular
• CPC Class Codes: H01B 1/02 mainly consisting of metals or alloys
• CPC Class Codes: H01B 1/04 mainly consisting of carbon-silicon compounds, carbon or silicon
• CPC Class Codes: Y10T 428/25 Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
• CPC Class Codes: Y10T 428/256 Heavy metal or aluminum or compound thereof
• CPC Class Codes: Y10T 428/259 Silicic material

Abstract

This disclosure relates generally to thermally conductive polymer composites and particularly to thermal interface materials.

Claims

1. A composition, comprising:

a conductive, percolated network having elongated, thermally conductive particles distributed throughout a matrix material.

2. The composition of claim 1, wherein the elongated, thermally conductive particles comprise no more than about 20 volume % of the composition and wherein the elongated, thermally conductive particles have an average aspect ratio of at least about 25:

1.

3. The composition of claim 1, wherein the aspect ratio is greater than about 40:

1.

4. The composition of claim 1, wherein the aspect ratio is greater than about 100:

1.

5. The composition of claim 1, wherein the elongated, thermally conductive particles have at least one of an average diameter and thickness from about 0.1 to about 500 nanometers.

6. The composition of claim 1, wherein the elongated, thermally conductive particles have an average length from about 10 to about 1,000 microns.

7. The composition of claim 1, wherein the percolated network is a three-dimension network, and wherein the elongated, thermally conductive particles are distributed in an isotropic manner throughout the matrix material.

8. The composition of claim 1, wherein the conductive, percolated network has a plurality of low resistance pathways, and wherein the low resistance pathways have low thermal boundary resistance.

9. The composition of claim 1, wherein at least some of the elongated, thermally conductive particles forming the percolated network have at least two low resistance pathways per elongated, thermally conductive particle, wherein the at least two low resistance pathways are between one elongated, thermally conductive particle and at least two other elongate, thermally conductive particles.

10. The composition of claim 1, wherein the conductive, percolated network is thermally conductive.

11. The composition of claim 1, wherein the composition has a thermal conductivity of at least about 2 Wm⁻

1K<sup>−

1</sup>.

12. The composition of claim 1, wherein the conductive, percolated network comprises one or both of a charge carrier and phonon conductive network.

13. The composition of claim 1, wherein the matrix material comprises at least about 80 volume % of the composition.

14. The composition of claim 1, wherein the matrix material is selected from the group consisting essentially of organic materials, organic polymeric materials, inorganic materials, inorganic polymeric materials, ceramics, organometallic materials, polymeric organometallic materials and combinations thereof.

15. The composition of claim 14, wherein the organic polymeric material is selected from the group consisting essentially of homo-polymers, block co-polymers, polymeric mixtures and blends, polymeric alloys, and copolymers of polyolefins, polystyrenes, polyvinyls, polyacrylics, polyhalo-olefins, polydienes, polyoxides/ethers/acetals, polysulfides, polyesters/thioesters, polyamides/thioamides, polyurethanes/thiourethanes, polyureas/thioureas, polyimides/thioimides, polyanhydrides/thianhydrides, polycarbonates/thiocarbonates, polyimines, polyketones/thioketones, polysulfones/sulfoxides/sulfonates/sulfonamides, polyphenylenes, and mixtures thereof.

16. The composition of claim 1, wherein the elongated, thermally conductive particles are selected from the group consisting essentially of metallic nano-wires, metallic carbon nano-tubes, coated-elongated particles, and combinations and/or mixtures thereof.

17. The composition of claim 16, wherein the coated-elongated particles are selected from the group consisting essentially of coated carbon nano-tubes, coated graphene sheets, coated-elongated graphite particles and mixtures thereof.

18. The composition of claim 16, wherein the coated-elongated particles are coated with a coating material containing one or more of Ge, Si, Ga, As, In, Sb, Bi, Te, Cd, S, Cd, Se, Hg, P, In, Pb, Te, Hg, Te, Sn, Pb, In, Cu, Ag, Au, binary combinations in any atomic ratio thereof, tertiary combinations in any atomic ratio thereof, and other combinations thereof.

19. The composition of claim 18, wherein the coating has a short electron-phonon coupling length.

20. The composition of claim 18, wherein the coating has an electron-phonon coupling length of no more than about 10⁻

2 cm.

21. The composition of claim 17, wherein one or both of the metallic carbon nano-tubes and the coated carbon nano-tubes comprise one of single-walled carbon nano-tubes, double-walled carbon nano-tubes, few-walled carbon nano-tubes, and/or multi-walled carbon nano-tubes, or a mixture of single- and multi-walled carbon nano-tubes.

26. The composition of claim 1, wherein the matrix material is selected from the group consisting essentially of organic materials, organic polymeric materials, inorganic materials, inorganic polymeric materials, ceramics, organometallic materials, polymeric organometallic materials and combinations thereof.

27. The composition of claim 26, wherein the organic polymeric material is selected from the group consisting essentially of homo-polymers, block co-polymers, polymeric mixtures and blends, polymeric alloys, and copolymers of polyolefins, polystyrenes, polyvinyls, polyacrylics, polyhalo-olefins, polydienes, polyoxides/ethers/acetals, polysulfides, polyesters/thioesters, polyamides/thioamides, polyurethanes/thiourethanes, polyureas/thioureas, polyimides/thioimides, polyanhydrides/thianhydrides, polycarbonates/thiocarbonates, polyimines, polyketones/thioketones, polysulfones/sulfoxides/sulfonates/sulfonamides, polyphenylenes, and mixtures thereof.

22. A composition, comprising:

a conductive, percolated network comprising carbon nano-tubes coated with a coating having a short electron-phonon coupling length, wherein coated carbon nano-tubes are isotropically distributed throughout a matrix material, wherein the coated carbon nano-tubes comprise no more than about 20 volume % of the composition.

23. The composition of claim 22, wherein the coated nano-tubes have an average aspect ratio of at least about 25:

1, wherein the percolated network is a three-dimension network, wherein at least some of the coated nano-tubes forming the percolated network have at least two low resistance pathways per coated nano-tube, wherein the at least two low resistance pathways are between one coated nano-tube and at least two other coated nano-tubes.

24. The composition of claim 22, wherein the composition has a thermal conductivity of at least about 2 Wm⁻

1K<sup>−

1</sup>.

25. The composition of claim 22, wherein the conductive, percolated network comprises one or both of a charge carrier network and phonon conductive network, wherein the matrix material comprises at least about 80 volume % of the composition.

28. A system, comprising,

a composite having a conductive, percolated network having elongated, thermally conductive particles distributed throughout a matrix material, the matrix material is positioned between first and second surfaces.

29. The system of claim 28, wherein the elongated, thermally conductive particles are are selected from the group consisting essentially of metallic nano-wires, metallic carbon nano-tubes, coated-elongated particles, and combinations and/or mixtures thereof, wherein at least one of the following is true:

i) the elongated, thermally conductive particles comprise no more than 20 volume % of the composite;

ii) the elongated, thermally conductive particles have an average aspect ratio of at least about 25;

1;

iii) the elongated, thermally conductive particles have at least one of an average diameter and thickness form about 0.1 to about 500 nanometers; and

iv) the elongated, thermally conductive particles have an average lenmgth from about 10 to about 1,000 microns.

30. The system of claim 29, wherein the coated-elongated particles are coated with a coating material containing one or more of Ge, Si, Ga, As, In, Sb, Bi, Te, Cd, S, Cd, Se, Hg, P, In, Pb, Te, Hg, Te, Sn, Pb, In, Cu, Ag, Au, binary combinations in any atomic ratio thereof, tertiary combinations in any atomic ratio thereof, and other combinations thereof, wherein the coating has a short electron-phonon coupling length, wherein the coating has an electron-phonon coupling length of no more than about 10⁻

2 cm.

31. The system of claim 28, wherein the matrix material comprises at least about 80 volume % of the composite, wherein the matrix material is selected from the group consisting essentially of organic materials, organic polymeric materials, inorganic materials, inorganic polymeric materials, ceramics, organometallic materials, polymeric organometallic materials and combinations thereof.

32. The system of claim 31, wherein the organic polymeric material is selected from the group consisting essentially of homo-polymers, block co-polymers, polymeric mixtures and blends, polymeric alloys, and copolymers of polyolefins, polystyrenes, polyvinyls, polyacrylics, polyhalo-olefins, polydienes, polyoxides/ethers/acetals, polysulfides, polyesters/thioesters, polyamides/thioamides, polyurethanes/thiourethanes, polyureas/thioureas, polyimides/thioimides, polyanhydrides/thianhydrides, polycarbonates/thiocarbonates, polyimines, polyketones/thioketones, polysulfones/sulfoxides/sulfonates/sulfonamides, polyphenylenes, and mixtures thereof.

33. The system of claim 28, wherein the percolated network is a three-dimension network, wherein the conductive, percolated network has a plurality of low resistance pathways, and wherein the low resistance pathways have low thermal boundary resistance, wherein at least some of the elongated, thermally conductive particles forming the percolated network have at least two low resistance pathways per elongated, thermally conductive particle, wherein the at least two low resistance pathways are between one elongated, thermally conductive particle and at least two other elongated, thermally conductive particles.

34. The system of claim 28, wherein the conductive, percolated network is thermally conductive, wherein the composite has a thermal conductivity of at least about 2 Wm⁻

1K<sup>−

1</sup>, wherein the conductive, percolated network comprises one or both of a charge carrier and phonon conductive network.

35. The system of claim 28, wherein the system comprises one of a power electronics system, insulated gate bipolar transistor, a computer system, an integrated circuit chip, a central processing unit, integrated circuit, a field programmable gate array, a graphics processing unit, a microprocessor grid array, a flip chip bell grid array, a photovoltaic cell, a transistor, an audio amplifier, a heat pipe joint, a travelling wave tube amplifier, a power electronics components, a remotely piloted aircraft, an unmanned air vehicle, a micro air vehicle, a F-22 air-craft system, a F-35 air-craft system, a metal-oxide-semiconductor field-effect transistor, a directed energy weapons, a solid state laser system, a high-voltage electronic component system, a laser system, a solid state relay, a high power laser system, a high power radar system, a high power vehicle radiator system, a complementary metal-oxide semiconductor system, a telecommunication system, an active sensing system, an imaging system, LED fixture system, a housing and/or enclosure system for electrical and electronic components, a housing and/or enclosure system for electrical and electronic components, an electrical connector system, an under-hood cooling system for an automobile, a radiator end cap system for high performance vehicles, a fuel pump system, pipe and/or tubing system for transporting hot fluids, an IGBT/CMOS cooling application system in electric vehicles, a capacitor system, an ultracapacitor system, a thermally conductive adhesive system, and combinations thereof.

36. The system of claim 28, wherein the first surface has a temperature greater than the second surface.

37. The system of claim 28, wherein the second surface is at least one of

a heat sink, a heat spreader or combination thereof, wherein the first surface is at least one of:

a) bipolar transistor;

b) copper layer;

c) transistor base plate;

d) integrated circuit processor;

e) central processing unit;

f)) an integrated circuits;

g) a gate arrays;

h) a graphics processing unit;

i) a microprocessor chip;

j) a flip chip bell grid array;

k) a photovoltaic cells;

l) a heated pipe;

m) travelling wave tube amplifier and travelling wave tube amplifier housing;

n) a power electronics component;

o) a metal-oxide-semiconductor field-effect transistor;

p) a conductive nanocomposite;

q) one or more of a solid state laser component, casing, and high-voltage electronic components driving the laser;

r) a solid state relay;

s) a high power electronic component;

t) a complementary metal-oxide semiconductor;

u) an LED fixture, component and/or housing;

v) an electrical and electronic component;

housing and/or enclosure;

w) an automotive component; and

x) a capacitor and ultracapacitor.

42. The device of claim 34, wherein the organic polymeric material is selected from the group consisting essentially of homo-polymers, block co-polymers, polymeric mixtures and blends, polymeric alloys, and copolymers of polyolefins, polystyrenes, polyvinyls, polyacrylics, polyhalo-olefins, polydienes, polyoxides/ethers/acetals, polysulfides, polyesters/thioesters, polyamides/thioamides, polyurethanes/thiourethanes, polyureas/thioureas, polyimides/thioimides, polyanhydrides/thianhydrides, polycarbonates/thiocarbonates, polyimines, polyketones/thioketones, polysulfones/sulfoxides/sulfonates/sulfonamides, polyphenylenes, and mixtures thereof.

38. A device, comprising,

a first component;

a second component, wherein the second component is a thermal energy dissipating component; and

a composite positioned between the first and second components, the composite comprises a conductive, percolated network having elongated, thermally conductive particles distributed throughout a matrix material, the matrix material being positioned between first and second components.

39. The device of claim 38, wherein the elongated, thermally conductive particles are are selected from the group consisting essentially of metallic nano-wires, metallic carbon nano-tubes, coated-elongated particles, and combinations and/or mixtures thereof, wherein at least one of the following is true:

i) the elongated, thermally conductive particles comprise no more than 20 volume % of the composite;

ii) the elongated, thermally conductive particles have an average aspect ratio of at least about 25;

1;

iii) the elongated, thermally conductive particles have at least one of an average diameter and thickness form about 0.1 to about 500 nanometers; and

iv) the elongated, thermally conductive particles have an average lenmgth from about 10 to about 1,000 microns.

40. The device of claim 39, wherein the coated-elongated particles are coated with a coating material containing one or more of Ge, Si, Ga, As, In, Sb, Bi, Te, Cd, S, Cd, Se, Hg, P, In, Pb, Te, Hg, Te, Sn, Pb, In, Cu, Ag, Au, binary combinations in any atomic ratio thereof, tertiary combinations in any atomic ratio thereof, and other combinations thereof, wherein the coating has a short electron-phonon coupling length, wherein the coating has an electron-phonon coupling length of no more than about 10⁻

2 cm.

41. The device of claim 38, wherein the matrix material comprises at least about 80 volume % of the composite, wherein the matrix material is selected from the group consisting essentially of organic materials, organic polymeric materials, inorganic materials, inorganic polymeric materials, ceramics, organometallic materials, polymeric organometallic materials and combinations thereof.

43. The device of claim 38, wherein the percolated network is a three-dimension network, wherein the conductive, percolated network has a plurality of low resistance pathways, and wherein the low resistance pathways have low thermal boundary resistance, wherein at least some of the elongated, thermally conductive particles forming the percolated network have at least two low resistance pathways per elongated, thermally conductive particle, wherein the at least two low resistance pathways are between one elongated, thermally conductive particle and at least two other elongated, thermally conductive particles.

44. The device of claim 38, wherein the conductive, percolated network is thermally conductive, wherein the composite has a thermal conductivity of at least about 2 Wm⁻

1K<sup>−

1</sup>, wherein the conductive, percolated network comprises one or both of a charge carrier and phonon conductive network.

45. The device of claim 38, wherein the device is a thermal interface component of one of a power electronics system, insulated gate bipolar transistor, a computer system, an integrated circuit chip, a central processing unit, integrated circuit, a field programmable gate array, a graphics processing unit, a microprocessor grid array, a flip chip bell grid array, a photovoltaic cell, a transistor, an audio amplifier, a heat pipe joint, a travelling wave tube amplifier, a power electronics components, a remotely piloted aircraft, an unmanned air vehicle, a micro air vehicle, a F-22 air-craft system, a F-35 air-craft system, a metal-oxide-semiconductor field-effect transistor, a directed energy weapons, a solid state laser system, a high-voltage electronic component system, a laser system, a solid state relay, a high power laser system, a high power radar system, a high power vehicle radiator system, a complementary metal-oxide semiconductor system, a telecommunication system, an active sensing system, an imaging system, LED fixture system, a housing and/or enclosure system for electrical and electronic components, a housing and/or enclosure system for electrical and electronic components, an electrical connector system, an under-hood cooling system for an automobile, a radiator end cap system for high performance vehicles, a fuel pump system, pipe and/or tubing system for transporting hot fluids, an IGBT/CMOS cooling application system in electric vehicles, a capacitor system, an ultracapacitor system, a thermally conductive adhesive system, and combinations thereof.

46. The system of claim 38, wherein the second component is at least one of a heat sink, a heat spreader, or combination thereof, wherein the first component is at least one of:

a) bipolar transistor;

b) copper layer;

c) transistor base plate;

d) integrated circuit processor;

e) central processing unit;

f)) an integrated circuits;

g) a gate arrays;

h) a graphics processing unit;

i) a microprocessor chip;

j) a flip chip bell grid array;

k) a photovoltaic cells;

l) a heated pipe;

m) travelling wave tube amplifier and travelling wave tube amplifier housing;

n) a power electronics component;

o) a metal-oxide-semiconductor field-effect transistor;

p) a conductive nanocomposite;

q) one or more of a solid state laser component, casing, and high-voltage electronic components driving the laser;

r) a solid state relay;

s) a high power electronic component;

t) a complementary metal-oxide semiconductor;

u) an LED fixture, component and/or housing;

v) an electrical and electronic component;

housing and/or enclosure;

w) an automotive component; and

x) a capacitor and ultracapacitor.

47. A composition, comprising:

a conductive, percolated network having elongated, thermally conductive particles distributed throughout a short electron-phonon coupling length material.

48. The composition of claim 47, wherein the elongated, thermally conductive particles comprise no more than about 20 volume % of the composition and wherein the elongated, thermally conductive particles have an average aspect ratio of at least about 25:

1.

49. The composition of claim 47, the short electron-phonon coupling length material contains one or more of Ge, Si, Ga, As, In, Sb, Bi, Te, Cd, S, Cd, Se, Hg, P, In, Pb, Te, Hg, Te, Sn, Pb, In, Cu, Ag, Au, binary combinations in any atomic ratio thereof, tertiary combinations in any atomic ratio thereof, and other combinations thereof.