×

TRANSPEDICULAR ACCESS TO INTERVERTEBRAL SPACES AND RELATED SPINAL FUSION SYSTEMS AND METHODS

  • US 20120265250A1
  • Filed: 03/16/2012
  • Published: 10/18/2012
  • Est. Priority Date: 03/18/2011
  • Status: Active Grant
First Claim
Patent Images

1. A method of fusing a first vertebra to a second vertebra, said second vertebra being immediately adjacent and above the first vertebra, the method comprising:

  • creating a passage from a posterior end of a pedicle of the first vertebra through a superior endplate of the first vertebra, such that the passage extends into an intervertebral space located generally between the first and second vertebrae;

    removing native tissue located within the intervertebral space by advancing a tissue removal tool through the passage and selectively moving said tissue removal tool within the intervertebral space;

    delivering at least one of an implant and a grafting material through the passage, wherein said implant or grafting material is configured to promote fusion between the superior endplate of the first vertebra and an inferior endplate of the second vertebra; and

    advancing a first bone screw through the passage, such that a distal end of the first bone screw extends at least partially into the intervertebral space.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×