Mask Frame Assembly for Thin Film Deposition

• US 20120266813A1
• Filed: 09/22/2011
• Published: 10/25/2012
• Est. Priority Date: 04/25/2011
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Hong, Jeremy
• Granted Patent: US 8,881,676 B2
• Time in Patent Office: Days
• US Class Current: 118/505
• CPC Class Codes: B05C 21/005 Masking devices stencils B05C17/06; masking devices for which the means for applying liquids or other fluent material is spraying or is not important B05B12/20
• CPC Class Codes: C23C 14/04 Coating on selected surface areas, e.g. using masks
• CPC Class Codes: C23C 14/042 using masks
• CPC Class Codes: C23C 14/044 using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
• CPC Class Codes: C23C 14/12 Organic material
• CPC Class Codes: C23F 1/02 Local etching
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

A mask frame assembly for depositing a deposition material on a deposition substrate comprises a mask frame including an opening and frames surrounding the opening, and a mask coupled on the mask frame. A deformation prevention unit is formed on at least one region of the mask. Since the deformation prevention unit is formed on a peripheral portion of a deposition pattern in the mask, deformation of the mask in a vertical direction may be reduced. Accordingly, defective attaching of the mask to the substrate may be reduced.

Claims

1. A mask frame assembly for a thin film deposition, the mask frame assembly comprising:

a mask frame including an opening and frames surrounding the opening; and

a mask coupled to the mask frame;

wherein a deformation prevention unit is formed on at least one region of the mask.

2. The mask frame assembly of claim 1, wherein the mask comprises a plurality of deposition patterns which are separated from each other in a length direction of the mask, and ribs disposed between adjacent deposition patterns for connecting the deposition patterns to each other, and wherein the deformation prevention unit comprises a first dummy pattern formed on each of the ribs.

3. The mask frame assembly of claim 2, wherein the mask further comprises a plurality of second dummy patterns formed on opposite edges of the deposition patterns in a width direction of the deposition patterns.

4. The mask frame assembly of claim 3, wherein the deposition pattern, the first dummy pattern, and the second dummy pattern are formed as out of a dot type slit pattern and a striped slit pattern.

5. The mask frame assembly of claim 2, wherein the mask further comprises half-etching portions formed on opposite edges of the deposition pattern in a width direction of the deposition pattern.

6. The mask frame assembly of claim 5, wherein the half-etching portions are formed by etching the mask so as to have a thickness less than other portions of the mask from a second surface which is opposite a first surface facing a deposition substrate.

7. The mask frame assembly of claim 6, wherein the first surface is a surface contacting the deposition substrate which is to be patterned.

8. The mask frame assembly of claim 1, wherein the mask comprises a plurality of deposition patterns which are separated from each other in a length direction of the mask, and ribs disposed between adjacent deposition patterns for connecting the deposition patterns to each other, and wherein the deformation prevention unit comprises a first half-etching portion formed on each of the ribs.

9. The mask frame assembly of claim 8, wherein the first half-etching portion extends from both sides of the rib toward edges of the mask.

10. The mask frame assembly of claim 9, wherein the first half-etching portion is formed by etching the mask so as to have a thickness less than other portions of the mask from a second surface which is opposite a first surface facing a deposition substrate.

11. The mask frame assembly of claim 8, wherein the mask further comprises second half-etching portions disposed on opposite edges of the deposition patterns in a width direction of the deposition pattern.

12. The mask frame assembly of claim 11, wherein the first half-etching portion and the second half-etching portions are formed by etching the mask so as to have a thickness less than other portions of the mask from a second surface which is opposite a first surface facing a deposition substrate.

13. The mask frame assembly of claim 12, wherein the first surface is a surface contacting the deposition substrate which is to be patterned.

14. The mask frame assembly of claim 1, wherein opposite end portions of the mask are welded to frames which are arranged to face each other in a state where a tensile force is applied to the frames.

15. The mask frame assembly of claim 1, wherein the mask frame comprises:

a plurality of first frames arranged so as to face each other in a first direction; and

a plurality of second frames arranged so as to face each other in a second direction;

wherein the plurality of first frames and the plurality of second frames are connected to each other so as to surround the opening of the mask frame.

16. The mask frame assembly of claim 15, wherein the mask is disposed in parallel with the plurality of first frames, and is arranged successively relative to the plurality of second frames.

17. The mask frame assembly of claim 1, wherein the mask comprises at least one partition mask disposed in a direction so as to cross the opening of the mask frame.