FUNCTIONAL ELEMENT, SENSOR ELEMENT, ELECTRONIC APPARATUS, AND METHOD FOR PRODUCING A FUNCTIONAL ELEMENT

• US 20120267150A1
• Filed: 04/18/2012
• Published: 10/25/2012
• Est. Priority Date: 04/20/2011
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: YODA, Mitsuhiro, KAWANO, Shuichi, TAKAGI, Shigekazu, YAMAZAKI, Seiji
• Granted Patent: US 9,068,835 B2
• Time in Patent Office: Days
• US Class Current: 174/257
• CPC Class Codes: G01C 19/5783 Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions

Abstract

A functional element including a substrate having a principal surface, a groove portion (a first groove portion, a second groove portion) disposed on the principal surface, and a fixed electrode section (a first fixed electrode finger, a second fixed electrode finger) laid across the groove portion on the substrate, wherein, in the groove portion, a raised portion formed by using at least one of the substrate and the fixed electrode section is provided in a position overlapping with the fixed electrode section in a plan view, the raised portion has a bonded surface (an end face), a wiring line (a first wiring line, a second wiring line) is disposed on the bonded surface, and the substrate and the fixed electrode section are connected with the wiring line sandwiched between the substrate and the fixed electrode section.

Claims

1. A functional element comprising:

a substrate having a principal surface on which a groove portion is provided, the groove portion in which a wiring line is provided; and

a fixed electrode section laid across the groove portion on the substrate,

wherein

in a connection between the fixed electrode section and the wiring line, a raised portion formed by using at least one of the substrate and the fixed electrode section is disposed.

2. The functional element according to claim 1, wherein

the raised portion is formed integrally with the substrate, and

an end face of the raised portion is flush with the principal surface of the substrate.

3. The functional element according to claim 1, wherein

between the substrate and the fixed electrode section, an insulating film is provided in a region other than the raised portion.

4. The functional element according to claim 1, wherein

on the substrate, a movable section is disposed, and

in the movable section, a movable electrode section is provided in a position facing the fixed electrode section.

5. The functional element according to claim 1, wherein

the substrate is formed of an insulating material, and

the fixed electrode section is formed of a semiconductor material.

6. A sensor element comprising the functional element according to claim 1.

7. An electronic apparatus comprising the functional element according to claim 1.

8. A method for producing a functional element, the method comprising:

forming a groove portion on a principal surface of a substrate and a raised portion in at least part of the inside of the groove portion;

forming a wiring line in the groove portion and on an end face of the raised portion; and

bonding a fixed electrode section to the raised portion with the wiring line sandwiched between the fixed electrode section and the raised portion,

wherein

after the forming of a wiring line, a surface of the wiring line formed on the end face of the raised portion juts to a level higher than a level of the principal surface of the substrate.

9. The method for forming a functional element according to claim 8, further comprising:

forming a buffer film on the wiring line formed on the end face of the raised portion after the forming of a wiring line.

10. The method for forming a functional element according to claim 8, further comprising:

forming an insulating film on the principal surface of the substrate and the insulating film in at least a portion corresponding to the end face of the raised portion is removed after the forming of a wiring line,

wherein

after the forming of an insulating film, the surface of the wiring line formed on the end face of the raised portion juts to a level higher than a level of a surface of the insulating film formed on the principal surface of the substrate.

11. The method for forming a functional element according to claim 8, wherein

the substrate is formed of a material containing an alkali metal ion,

the fixed electrode section is formed of a semiconductor material, and

in the bonding of a fixed electrode section, the substrate and the fixed electrode section are bonded together by anodic bonding.