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APPARATUS FOR DEPOSITION OF MATERIALS ON A SUBSTRATE

  • US 20120270384A1
  • Filed: 07/27/2011
  • Published: 10/25/2012
  • Est. Priority Date: 04/22/2011
  • Status: Abandoned Application
First Claim
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1. An apparatus for processing a substrate, comprising:

  • a process chamber having a temperature-controlled reaction volume including interior surfaces comprising quartz and having a substrate support disposed within the temperature-controlled reaction volume to support a processing surface of a substrate;

    a heating system disposed below the substrate support to provide heat energy to the substrate support;

    an injector disposed to a first side of the substrate support and having a first flow path to provide a first process gas and a second flow path to provide a second process gas independent of the first process gas, wherein the injector is positioned to provide the first and second process gases across the processing surface of the substrate;

    a showerhead disposed above the substrate support to provide the first process gas to the processing surface of the substrate; and

    a heated exhaust manifold disposed to a second side of the substrate support, opposite the injector, to exhaust the first and second process gases from the process chamber.

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