RFID TAG HAVING ENHANCED DURABILITY

• US 20120273577A1
• Filed: 04/25/2012
• Published: 11/01/2012
• Est. Priority Date: 04/29/2011
• Status: Active Grant

• Current Assignee: Intellectual Discovery Co., Ltd.
• Original Assignee: Samsung Techwin Corporation (Hanwha Corporation)
• Inventors: Kim, Yong-Jun, Nam, Won-Jun
• Granted Patent: US 9,189,726 B2
• Time in Patent Office: Days
• US Class Current: 235/488
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00

Abstract

Provided is a radio frequency identification (RFID) tag including: a pattern layer which includes a first conductor having a pattern and an RFID chip electrically connected to the first conductor; an insulating layer which insulates the pattern layer from the radiation layer; a radiation layer which is attached to the insulating layer, and includes a second conductor having a radiation pattern inductively coupled to the first conductor; a lower protection layer disposed below a combination of the pattern layer, the insulating layer and the radiation layer; and an upper protection layer disposed above the combination of the pattern layer, the insulating layer and the radiation layer.

Claims

1. A radio frequency identification (RFID) tag comprising:

a pattern layer which comprises a first conductor having a pattern, and an RFID chip electrically connected to the first conductor;

an insulating layer which insulates the pattern layer from the radiation layer;

a radiation layer which is attached to the insulating layer, and comprises a second conductor having a radiation pattern inductively coupled to the first conductor;

a lower protection layer disposed below a combination of the pattern layer, the insulating layer and the radiation layer; and

an upper protection layer disposed above the combination of the pattern layer, the insulating layer and the radiation layer.

2. The RFID tag of claim 1, wherein the pattern layer comprises a printed circuit board on which the first conductor is formed.

3. The RFID tag of claim 1, wherein the lower protection layer and the upper protection layer are formed of a flexible material.

4. The RFID tag of claim 1, wherein the radiation layer comprises a printed circuit board on which the second conductor is formed.

5. The RFID tag of claim 1, wherein the insulating layer is formed of silicon.

6. The RFID tag of claim 1, wherein the first conductor induces a first signal generated in the pattern layer to the second conductor, and the second conductor induces a second signal, received from an outside, to the first conductor.

7. The RFID tag of claim 6, wherein the first conductor is a circuit which receives the first signal generated from the RFID in response to the second signal induced from the second conductor, and

wherein the first signal comprises information related to a product to which the RFID tag is attached.

8. The RFID tag of claim 1, wherein the lower protection layer comprises at least one of a first polyamide layer comprising polyamide and a first silicon layer comprising silicon which is attached to the combination of the pattern layer, the insulating layer and the radiation layer, and

wherein the upper protection layer comprises at least one of a second polyamide layer comprising polyamide and a second silicon layer comprising silicon.

9. The RFID tag of claim 1,

wherein the lower protection layer comprises:

a first polyimide layer comprising polyimide; and

a first silicon layer comprising silicon and attached to an upper surface of the first polyimide layer, and

wherein the upper protection layer comprises;

a second silicon layer comprising silicon and attached to an upper surface of the combination of the pattern layer, the insulating layer and the radiation layer; and

a second polyimide layer attached to an upper surface of the second silicon layer and comprising polyimide.

10. The RFID tag of claim 9, wherein the lower protection layer and the upper protection layer are flexible.

11. The RFID of claim 9, wherein at least one of the first and second polyamide layers comprises plastic including aromatic diamine and aromatic tetracarbon acid dianhydride.

12. The RFID tag of claim 9, further comprising a third silicon layer attached to a lower surface of the first polyimide layer and a fourth silicon layer attached to an upper surface of the second silicon layer.

13. The RFID tag of claim 12, wherein at least one of the first and second polyamide layers comprises plastic including aromatic diamine and aromatic tetracarbon acid dianhydride.

14. The RFID tag of claim 1, wherein the first conductor and the second conductor are in a relationship of impedance matching.

15. A radio frequency identification (RFID) tag comprising:

a pattern layer which comprises;

a first conductor having a pattern;

an RFID chip electrically connected to the first conductor; and

a first substrate on which the first conductor and the RFID chip are formed;

a radiation layer which is attached to the first substrate and comprises;

a second conductor having a radiation pattern inductively coupled to the first conductor; and

a second substrate on which the second conductor is formed; and

a protection layer which is disposed above the pattern layer,

wherein the first substrate insulates the pattern layer from the radiation layer.

16. The RFID tag of claim 15,

wherein the second substrate comprises:

a first polyimide layer comprising polyimide; and

a first silicon layer comprising silicon and attached to an upper surface of the first polyimide layer, and

wherein the protection layer comprises;

a second silicon layer comprising silicon and attached to an upper surface of the pattern layer; and

a second polyimide layer attached to an upper surface of the second silicon layer and comprising polyimide.

17. The RFID tag of claim 16, wherein the second substrate and the protection layer are flexible.

18. The RFID of claim 17, wherein at least one of the first and second polyamide layers comprises plastic including aromatic diamine and aromatic tetracarbon acid dianhydride.

19. The RFID of claim 15, wherein the first conductor induces a first signal generated in the pattern layer to the second conductor, and the second conductor induces a second signal, received from an outside, to the first conductor,

wherein the first conductor is a circuit which receives the first signal generated from the RFID in response to the second signal induced from the second conductor, and

wherein the first signal comprises information related to a product to which the RFID tag is attached.

20. The RFID tag of claim 15, wherein the first conductor and the second conductor are in a relationship of impedance matching.