THROUGH VIA INDUCTOR OR TRANSFORMER IN A HIGH RESISTANCE SUBSTRATE WITH PROGRAMMABILITY

• US 20120274436A1
• Filed: 05/15/2012
• Published: 11/01/2012
• Est. Priority Date: 06/01/2010
• Status: Abandoned Application

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Li, Xia, Kim, Jonghae, Lo, Chi Shun
• Application Number:
  US13/471,856
• Publication Number:
  US 20120274436A1
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 21/08 by varying the permeability of the core, e.g. by varying magnetic bias
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0251 related to vias or transitions between vias and transmission lines
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor

Abstract

A through via inductor or transformer in a high-resistance substrate in an electronic package. The package may comprise a target inductor which includes a through-via formed in the substrate through which a signal passes and a tuner inductor which includes a through-via formed in the substrate such that the through-via has an independent signal passing therethrough. The direction of the signal passing through the tuner inductor can be independently controlled to adjust the total inductance of the target inductor. A transformer can comprise a primary loop and a secondary loop, each of which includes through-vias coupled to conductive traces. The primary loop forms a first continuous conductive path and the secondary loop forms a second continuous conductive path. A signal passing through the primary loop can induce a signal in the secondary loop such that the induced signal is dependent on the transformer ratio.

Claims

1. An inductor formed in a high-resistance substrate, the inductor comprising:

a plurality of through-vias in the high-resistance substrate;

a plurality of conductive traces on the top surface of the substrate, each conductive trace coupling one of the through-vias to another of the through-vias; and

a plurality of conductive traces on the bottom surface of the substrate, each conductive trace coupling one of the through-vias to another of the through-vias;

wherein, the plurality of conductive traces on the top and bottom surfaces and the plurality of through-vias form a continuous conductive path.

2. The inductor of claim 1, wherein the plurality of through-vias form an array of through-vias.

3. The inductor of claim 1, wherein the plurality of through-vias are orthogonal to the top and bottom surfaces of the substrate.

4. The inductor of claim 1, wherein as a signal passes through the conductive path, the mutual inductance impact of the plurality of through-vias is negligible.

5. The inductor of claim 1 incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.

6. A transformer in a high-resistance substrate, comprising:

a primary loop having a plurality of through-vias disposed in the substrate, the plurality of through-vias coupled to conductive traces at the top and bottom surfaces of the substrate to form a first continuous conductive path; and

a secondary loop having a plurality of through-vias disposed in the substrate, the plurality of through-vias coupled to different conductive traces at the top and bottom surfaces of the substrate to form a second continuous conductive path, the second continuous conductive path being independent of the first continuous conductive path;

Wherein, a signal passing through the primary loop induces a signal in the secondary loop, the signal in the secondary loop being dependent on the quantity of through-vias in the primary and secondary loops.

7. The transformer of claim 6, wherein as the signal passes through one of the plurality of through-vias of the primary or secondary loop, the direction of the signal is orthogonal to the top and bottom surfaces of the substrate.

8. The transformer of claim 6, wherein the plurality of through-vias of the primary and secondary loops forms an array of through vias.

9. The transformer of claim 6, wherein when the number of through-vias of the primary loop exceeds the number of through-vias of the secondary loop, the induced signal decreases.

10. The transformer of claim 6, wherein when the number of through-vias of the secondary loop exceeds the number of through-vias of the primary loop, the induced signal increases.

11. The transformer of claim 6 incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.

12. A method of transferring energy in a high resistance substrate, comprising:

passing a first signal through a primary loop disposed in the substrate, the primary loop including a plurality of through-vias coupled to conductive traces at the top and bottom surfaces of the substrate to form a first continuous conductive path;

inducing a second signal in a secondary loop disposed in the substrate, the secondary loop including a plurality of through-vias coupled to different conductive traces at the top and bottom surfaces of the substrate to form a second continuous conductive path, where the second continuous conductive path is independent of the first continuous conductive path; and

transferring energy between the primary loop and secondary loop in the substrate;

wherein, the second signal is dependent on the ratio of through-vias in the primary and secondary loops.

13. The method of claim 12, further comprising increasing the induced second signal by decreasing the number of through-vias in the primary loop compared to the number of through-vias in the secondary loop.

14. The method of claim 12, further comprising decreasing the induced second signal by increasing the number of through-vias in the primary loop compared to the number of through-vias in the secondary loop.

15. The method of claim 12, further comprising passing the first signal through one of the plurality of through-vias of the primary loop in a direction substantially orthogonal to a top and bottom surface of the substrate.

16. The method of claim 12, further comprising passing the second signal through one of the plurality of through-vias of the secondary loop in a direction substantially orthogonal to a top and bottom surface of the substrate.

17. The method of claim 12 incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.

18. A method of transferring energy in an integrated circuit, comprising:

providing a primary loop and a secondary loop in a high-resistance substrate, the primary loop having a plurality of through-vias coupled to conductive traces at the top and bottom surfaces of the substrate to form a first continuous conductive path and the secondary loop having a plurality of through-vias coupled to different conductive traces at the top and bottom surfaces of the substrate to form a second continuous conductive path, the second continuous conductive path being independent of the first continuous conductive path; and

step for inducing a signal in the secondary loop;

wherein, the induced signal is dependent on the quantity of through-vias in the primary and secondary loops.

19. The method of claim 18, wherein the step for inducing comprises passing a different signal through the primary loop.

20. The method of claim 18, further comprising increasing the induced signal by decreasing the number of through-vias in the primary loop compared to the number of through-vias in the secondary loop.

21. The method of claim 18, further comprising decreasing the induced signal by increasing the number of through-vias in the primary loop compared to the number of through-vias in the secondary loop.

22. The method of claim 18 incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.

23. An inductor formed in a high-resistance substrate, comprising:

a plurality of means for conducting a signal between a top surface and a bottom surface of the substrate;

a plurality of means for coupling one of the means for conducting to another of the means for conducting, wherein the means for coupling is disposed on the top surface of the substrate and the bottom surface of the substrate;

wherein, the plurality of means for coupling on the top and bottom surfaces and the plurality of means for conducting form a continuous conductive path.

24. The inductor of claim 23, wherein the plurality of means for conducting forms an array of means for conducting.

25. The inductor of claim 23, wherein the plurality of means for conducting is orthogonal to the top and bottom surfaces of the substrate.

26. The inductor of claim 23, wherein as a signal passes through the conductive path, the mutual inductance impact of the plurality of means for conducting is negligible.

27. The inductor of claim 23 incorporated into a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a personal digital assistant (PDA), a fixed location data unit, and a computer.