HEAT RADIATING SUBSTRATE

• US 20120275116A1
• Filed: 04/18/2012
• Published: 11/01/2012
• Est. Priority Date: 04/28/2011
• Status: Abandoned Application

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: HEO, Cheol Ho
• Application Number:
  US13/449,486
• Publication Number:
  US 20120275116A1
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/641 characterized by the materials

Abstract

Disclosed herein is a heat radiating substrate employed in an LED package. The heat radiating substrate includes a printed circuit board made of a metal material, and having a light emitting device mounted on an upper surface thereof; a heat radiating plate provided on a lower surface of the printed circuit board to receive the heat conducted from the light emitting device to the printed circuit board and radiate the heat to the outside; and a heat radiating layer formed on a lateral surface of the printed circuit board to radiate the heat conducted to the printed circuit board to the outside through the lateral surface of the printed circuit board.

Claims

1. A heat radiating substrate, comprising:

a printed circuit board made of a metal material, and having a light emitting device mounted on an upper surface thereof;

a heat radiating plate provided on a lower surface of the printed circuit board to receive heat conducted from the light emitting device to the printed circuit board and radiate the heat to the outside; and

a heat radiating layer formed on a lateral surface of the printed circuit board to radiate the heat conducted to the printed circuit board to the outside through the lateral surface of the printed circuit board.

2. The heat radiating substrate according to claim 1, wherein the heat radiating layer includes a thin film formed by coating a heat radiating coating agent on the lateral surface of the printed circuit board.

3. The heat radiating substrate according to claim 2, wherein the heat radiating coating agent includes an organic-inorganic complex including a high heat-resistant modified silicon resin for improving the adhesive property with the printed circuit board, a high heat-radiant inorganic filer, and a metal filler.

4. The heat radiating substrate according to claim 1, wherein an upper surface of the printed circuit board is provided with circuit wires and the light emitting device is electrically connected to the circuit wires.

5. The heat radiating substrate according to claim 1, wherein the heat radiating plate includes a heat radiating body installed closely to the lower surface of the printed circuit board and a plurality of heat radiating pins downwardly protruded from the heat radiating body.