TELEMETRIC ORTHOPAEDIC IMPLANT

• US 20120277746A1
• Filed: 07/16/2012
• Published: 11/01/2012
• Est. Priority Date: 08/23/2005
• Status: Active Grant

• Current Assignee: Smith & Nephew Incorporated (Smith & Nephew PLC)
• Original Assignee: Smith & Nephew Incorporated (Smith & Nephew PLC)
• Inventors: Morgan, Robert L., Wickham, Mark David, Brady, Peter A., Janna, Sied W., Austin, Gene Edward, Wilson, Darren James
• Granted Patent: US 8,721,643 B2
• Time in Patent Office: Days
• US Class Current: 606/62
• CPC Class Codes: A61B 17/72 Intramedullary pins, nails or other devices A61B17/744 takes precedence
• CPC Class Codes: A61B 2017/00004 (bio)absorbable, (bio)resorbable, resorptive for implantable prostheses A61F2210/0004
• CPC Class Codes: A61B 2017/00022 Sensing or detecting at the treatment site
• CPC Class Codes: A61B 2017/00734 battery operated
• CPC Class Codes: A61B 2090/064 for measuring force, pressure or mechanical tension
• CPC Class Codes: A61B 5/0031 Implanted circuitry
• CPC Class Codes: A61B 5/1038 Measuring plantar pressure during gait
• CPC Class Codes: A61B 5/4504 Bones A61B5/4547 takes precedence
• CPC Class Codes: A61F 2002/4666 for measuring force, pressure or mechanical tension
• CPC Class Codes: A61F 2002/4688 having operating or control means

Abstract

An instrumented orthopaedic implant, such as an intramedullary (IM) nail, is disclosed. The implant has the capacity to provide an accurate measurement of the applied mechanical load across the implant. The implant includes sensors and associated electronic components located in recesses on the outer surface of the implant. The implant houses the sensing apparatus, the interface circuitry, the data transmitter, and the power receiver. The hermetically sealed housing is adapted for implantation in the body of a patient. The implant is used with a controller which communicates with it by telemetry, and there is an acting unit connected to the electronic components which is adapted to carry out a function based upon a condition detected by the sensors.

Claims

1. An orthopaedic implant comprising:

a shaft comprising a biodegradable composite; and

a strain sensor;

wherein the orthopaedic implant is configured to alter a degradation rate of the biodegradable composite based on strain data generated by the strain sensor.

2. The orthopaedic implant of claim 1, wherein the orthopaedic implant is configured such that, when implanted in bone, the orthopaedic implant changes a mechanical modulus of the shaft according to a degree of healing of the bone.

3. The orthopaedic implant of claim 1, further comprising a reservoir containing a chemical agent that accelerates degradation of the biodegradable composite;

wherein the orthopaedic implant is configured to release the chemical agent in response to an increase in load bearing capacity of bone near the implant to accelerate degradation of the biodegradable composite.

4. The orthopaedic implant of claim 1, further comprising a reservoir containing a chemical agent that inhibits degradation of the biodegradable composite;

wherein the orthopaedic implant is configured to release the chemical agent to inhibit degradation of the biodegradable composite.

5. The orthopaedic implant of claim 1, wherein the orthopaedic implant is an intramedullary nail.

6. The orthopaedic implant of claim 1, wherein the orthopaedic implant comprises one or more electronic components that comprise degradable porous silicon wafers.

7. The orthopaedic implant of claim 1, further comprising one or more pumps configured to deliver a specific volume of a chemical agent.

8. An orthopaedic implant comprising:

a shaft having an outer surface and defining a recess in the outer surface;

at least one sensor located in the recess;

a microprocessor in communication with the at least one sensor;

a transmitter to transmit data generated by the at least one sensor; and

an acting unit in communication with the microprocessor such that the acting unit is configured to perform an action in response to receiving an input.

9. The orthopaedic implant of claim 8, wherein the acting unit is configured to deploy a stored deliverable based on receiving the input.

10. The orthopaedic implant of claim 9, wherein the stored deliverable comprises one or more of a biological manipulation, an antibiotic, an anti-inflammatory agent, a pain medication, an osteogenic factor, a radio-marker, an angiogenic factor, a vasodilator, and a growth factor.

11. The orthopaedic implant of claim 8, wherein:

the shaft has a longitudinal axis, and the recess has a length along the longitudinal axis of between about 1 millimeter to about 100 millimeters; and

the recess has a depth of between about 0.1 millimeters to about 2.0 millimeters.

12. The orthopaedic implant of claim 11, wherein:

the length of the recess is about 5 millimeters; and

the recess has a width perpendicular to the length and the depth of about 0.5 millimeters.

13. The orthopaedic implant of claim 8, wherein the shaft comprises a composite material.

14. The orthopaedic implant of claim 8, wherein the transmitter is configured to wirelessly transmit the data generated by the at least one sensor.

15. The orthopaedic implant of claim 8, wherein the at least one sensor comprises a plurality of multiaxial strain gauges arranged in a rosette configuration.

16. An orthopaedic implant comprising:

a first portion comprising first electronic components that include at least one passive sensor; and

a second portion removably attachable to the first portion, the second portion comprising second electronic components that include a microprocessor, a transmitter, and a power supply,

the second portion being removeably attachable to the first portion after implantation of the first portion in a bone such that the first electronic components are in communication with the second electronic components when the first portion is attached to the second portion.

17. The orthopaedic implant of claim 16, wherein the first portion is an intramedullary nail and the second portion is a nail head insert.

18. The orthopaedic implant of claim 16, wherein the first portion has a proximal end and defines a hole at the proximal end, and the second portion is configured for attachment to the first portion at the hole.

19. The orthopaedic implant of claim 16, wherein the first portion has an outer surface and defines a recess in the outer surface, and the at least one passive sensor is located in the recess.

20. The orthopaedic implant of claim 16, wherein the first electronic components and the second electronic components are connected by an inductively coupled link or a physical connection.