Touch Fingerprint Sensor Using 1-3 Piezo Composites and Acoustic Impediography Principle
First Claim
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1. A method of making an integrated circuit (IC) device using copper metallization on 1-3 PZT composite, comprising:
- providing an overlay of electroplated immersion gold (Au) to cover copper metal traces, the providing preventing oxidation on the 1;
3 PZT composite with material; and
forming an immersion of Au nickel electrodes on the 1-3 PZT composite to provide pad metallization for external connections of the IC.
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Abstract
Provided herein is a method of making an integrated circuit device using copper metallization on 1-3 PZT composite. The method includes providing an overlay of electroplated immersion of gold (Au) to cover copper metal traces, the overlay preventing oxidation on 1:3 PZT composite with material. Also included is the formation of immersion Au nickel electrodes on the 1-3 PZT composite to achieve pad metallization for external connections.
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Citations
1 Claim
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1. A method of making an integrated circuit (IC) device using copper metallization on 1-3 PZT composite, comprising:
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providing an overlay of electroplated immersion gold (Au) to cover copper metal traces, the providing preventing oxidation on the 1;
3 PZT composite with material; andforming an immersion of Au nickel electrodes on the 1-3 PZT composite to provide pad metallization for external connections of the IC.
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Specification