Touch Fingerprint Sensor Using 1-3 Piezo Composites and Acoustic Impediography Principle
First Claim
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1. A method of making an integrated circuit (IC) device using copper metallization on 1-3 PZT composite, comprising:
- providing an overlay of electroplated immersion gold (Au) to cover copper metal traces, the providing preventing oxidation on the 1;
3 PZT composite with material; and
forming an immersion of Au nickel electrodes on the 1-3 PZT composite to provide pad metallization for external connections of the IC.
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Abstract
Provided herein is a method of making an integrated circuit device using copper metallization on 1-3 PZT composite. The method includes providing an overlay of electroplated immersion of gold (Au) to cover copper metal traces, the overlay preventing oxidation on 1:3 PZT composite with material. Also included is the formation of immersion Au nickel electrodes on the 1-3 PZT composite to achieve pad metallization for external connections.
68 Citations
1 Claim
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1. A method of making an integrated circuit (IC) device using copper metallization on 1-3 PZT composite, comprising:
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providing an overlay of electroplated immersion gold (Au) to cover copper metal traces, the providing preventing oxidation on the 1;
3 PZT composite with material; andforming an immersion of Au nickel electrodes on the 1-3 PZT composite to provide pad metallization for external connections of the IC.
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Specification
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Current AssigneeSonavation, Inc.
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Original AssigneeSonavation, Inc.
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InventorsAliyu, Yakub, Schmitt, Rainer M., Kropp, Ronald A., Liautaud, Christian, Diatezua, Deda, Irving, Richard, Regniere, Louis, Johnson, Theodore M., Abothu, Isaac R., Liufu, De, Brown, Patrick D., Mick, Walter C., Tanubrata, William H., Jahromi, Omid S., Boudreaux, John, Clarke, David B., Chorpenning, Jack S., Barbato, Bryce M., Ulep, Honorio R., Robinson, William R. Jr.
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Application NumberUS13/289,391Publication NumberTime in Patent OfficeDaysField of SearchUS Class Current205/125CPC Class CodesC23C 18/54 Contact plating, i.e. elect...C25D 5/48 After-treatment of electrop...
