OXIDE SEMICONDUCTOR DEVICES, METHODS OF MANUFACTURING OXIDE SEMICONDUCTOR DEVICES AND DISPLAY DEVICES HAVING OXIDE SEMICONDUCTOR DEVICES

• US 20120280223A1
• Filed: 11/15/2011
• Published: 11/08/2012
• Est. Priority Date: 05/03/2011
• Status: Abandoned Application

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: KIM, Jeong-Hwan, WANG, Seong-Min, YOON, Joo-Sun
• Application Number:
  US13/296,609
• Publication Number:
  US 20120280223A1
• Time in Patent Office: Days
• US Class Current: 257/43
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

An oxide semiconductor device may include a gate electrode formed on a substrate, and a gate insulation layer formed on the substrate to cover the gate electrode. A channel protection structure may be disposed on the gate insulation layer to expose a portion of the gate insulation layer. A source electrode may be located on a first portion of the channel protection structure. A drain electrode may be disposed on a second portion of the channel protection structure. An active pattern may be positioned on the exposed portion of the gate insulation layer, the source electrode, and the drain electrode.

Claims

1. An oxide semiconductor device, comprising:

a gate electrode disposed on a substrate;

a gate insulation layer disposed on the gate electrode;

a channel protection structure disposed on the gate insulation layer and exposing a portion of the gate insulation layer;

a source electrode disposed on a first portion of the channel protection structure;

a drain electrode disposed on a second portion of the channel protection structure; and

an active pattern disposed on the exposed portion of the gate insulation layer, the source electrode, and the drain electrode.

2. The oxide semiconductor device of claim 1, wherein the gate electrode comprises at least one metal, alloy, metal nitride, and a transparent conductive material.

3. The oxide semiconductor device of claim 1, wherein the gate electrode comprises at least one of a first metal having an electrical conductivity, a second metal having a thermal resistance, and a metal compound having a thermal resistance.

4. The oxide semiconductor device of claim 1, wherein the gate insulation layer has a level upper face or a stepped portion adjacent to the gate electrode.

5. The oxide semiconductor device of claim 4, wherein each of the channel protection structure, the source electrode, and the drain electrode has a level upper face or a stepped portion in accordance with the level upper face or the stepped portion of the gate insulation layer, respectively.

6. The oxide semiconductor device of claim 1, wherein a thickness ratio of the gate insulation layer to the channel protection structure is in a range of about 1.0:

0.003 to about 1.0;

1.0.

7. The oxide semiconductor device of claim 1, wherein the channel protection structure comprises:

a first protection pattern disposed on a first portion of the gate insulation layer; and

a second protection pattern disposed on a second portion of the gate insulation layer, the second protection pattern being separated from the first protection pattern,

wherein the exposed portion of the gate insulation layer is disposed between the first protection pattern and the second protection pattern.

8. The oxide semiconductor device of claim 7, wherein the source electrode and the drain electrode are disposed on the first protection pattern and the second protection pattern, respectively.

9. The oxide semiconductor device of claim 7, wherein each of the first protection pattern and the second protection pattern comprises a semiconductor oxide.

10. The oxide semiconductor device of claim 9, wherein each of the first protection pattern and the second protection pattern further comprises at least one of copper (Cu), germanium (Ge), antimony (Sb), and bismuth (Bi).

11. The oxide semiconductor device of claim 7, wherein the active pattern, the first protection pattern, and the second protection pattern comprise the same material as each other.

12. The oxide semiconductor device of claim 11, wherein each of the active pattern, the first protection pattern, and the second protection pattern comprises at least one of indium-gallium-zinc oxide (IGZO), gallium-zinc oxide (GZO), indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnOx), gallium oxide (GaOx), tin oxide (SnOx), and indium oxide (InOx).

13. The oxide semiconductor device of claim 7, wherein each of the first protection pattern and the second protection pattern comprises an insulation oxide.

14. The oxide semiconductor device of claim 13, wherein each of the first protection pattern and the second protection pattern comprises at least one of silicon oxide (SiOx), hafnium oxide (HfOx), zirconium oxide (ZrOx), and tantalum oxide (TaOx).

15. The oxide semiconductor device of claim 1, wherein the active pattern contacts sidewalls of the source electrode, sidewalls of the drain electrode, and sidewalls of the channel protection structure.

16. The oxide semiconductor device of claim 15, wherein the active pattern has stepped portions adjacent to the sidewalls of the source electrode and the sidewalls of the drain electrode, respectively.

17. A method of manufacturing an oxide semiconductor device, comprising:

forming a gate electrode on a substrate;

forming a gate insulation layer on the gate electrode;

forming a channel protection structure on the gate insulation layer, the channel protection structure exposing a portion of the gate insulation layer;

forming a source electrode on a first portion of the channel protection layer;

forming a drain electrode on a second portion of the channel protection layer; and

forming an active pattern on the exposed portion of the gate insulation layer, the source electrode, and the drain electrode.

18. The method of claim 17, wherein forming the channel protection structure comprises:

forming a channel protection layer on the gate insulation layer; and

etching the channel protection layer to form a first protection pattern on a first portion of the gate insulation layer and to form a second protection pattern on a second portion of the gate insulation layer.

19. The method of claim 18, wherein the channel protection layer is etched after forming the source electrode and the drain electrode.

20. The method of claim 19, wherein forming the active pattern is performed after etching the channel protection layer.