MICROELECTROMECHANICAL SYSTEMS (MEMS) RESONATORS AND RELATED APPARATUS AND METHODS
First Claim
Patent Images
1. A packaged micromechanical resonator, comprising:
- a substrate;
a cap lacking integrated circuitry;
a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume;
a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume; and
a second portion of the electrically conductive material between the substrate and the cap and configured to conduct a signal between the micromechanical resonator and the cap.
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Accused Products
Abstract
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
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Citations
46 Claims
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1. A packaged micromechanical resonator, comprising:
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a substrate; a cap lacking integrated circuitry; a first portion of an electrically conductive material between the substrate and the cap, disposed such that the substrate, the cap, and the first portion of the electrically conductive material define a sealed, enclosed volume; a micromechanical resonator comprising a piezoelectric material disposed within the enclosed volume; and a second portion of the electrically conductive material between the substrate and the cap and configured to conduct a signal between the micromechanical resonator and the cap. - View Dependent Claims (2, 3, 4, 5)
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6. An apparatus, comprising:
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a suspended, substantially rectangular, piezoelectric microelectromechanical systems (MEMS) resonator coupled to a first substrate, the suspended piezoelectric MEMS resonator comprising an active layer of a piezoelectric material, a multi-layered temperature compensation structure coupled to a first surface of the active layer, and a plurality of electrodes disposed adjacent a second surface of the active layer opposite the first surface, wherein the piezoelectric MEMS resonator is configured to exhibit in-plane Lamb wave vibration in response to application of an electric field thereto by the plurality of electrodes; and a cap bonded to the MEMS resonator via a eutectic bond, the cap lacking integrated circuitry and forming a hermetic seal with the first substrate. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A capped microelectromechanical systems (MEMS) resonator, comprising:
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a piezoelectric microelectromechanical systems (MEMS) resonating structure formed on a first wafer; and a cap wafer capping the piezoelectric MEMS resonating structure, wherein the cap wafer comprises no integrated circuitry. - View Dependent Claims (23, 24, 25, 26)
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27. A capped microelectromechanical systems (MEMS) resonator, comprising:
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a piezoelectric microelectromechanical systems (MEMS) resonating structure formed on a first wafer, the piezoelectric MEMS resonating structure comprising a resonating body including a piezoelectric material active layer and a layer of silicon; and a cap wafer capping the piezoelectric MEMS resonating structure, wherein the cap wafer comprises no integrated circuitry. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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41. An apparatus, comprising:
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a first microelectromechanical systems MEMS wafer comprising a first MEMS device; a second MEMS wafer comprising a second MEMS device, wherein the second MEMS wafer is configured to cap the first MEMS wafer. - View Dependent Claims (42, 43, 44, 45, 46)
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Specification