METHODS FOR FORMING A MICRO ELECTRO-MECHANICAL DEVICE
First Claim
1. A method for forming a device, the method comprising:
- providing a conductive substrate;
forming a micro electro-mechanical (MEMS) structure over a first side of the conductive substrate and electrically isolated from the conductive substrate;
forming a plurality of bond pads over the first side of the conductive substrate around the MEMS structure; and
electrically coupling each of the plurality of bond pads to the conductive substrate.
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Abstract
Embodiments include methods for forming a device comprising a conductive substrate, a micro electro-mechanical systems (MEMS) structure, and a plurality of bond pads. The conductive substrate has a first side and a second side, the second side opposite the first side. The MEMS structure is formed over the first side of the conductive substrate. The plurality of bond pads are formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate. The conductive substrate and plurality of bond pads function to provide electrostatic shielding to the MEMS structure.
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Citations
17 Claims
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1. A method for forming a device, the method comprising:
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providing a conductive substrate; forming a micro electro-mechanical (MEMS) structure over a first side of the conductive substrate and electrically isolated from the conductive substrate; forming a plurality of bond pads over the first side of the conductive substrate around the MEMS structure; and electrically coupling each of the plurality of bond pads to the conductive substrate. - View Dependent Claims (2, 3, 4)
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5. A method for forming a device, the method comprising:
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providing a conductive substrate having a first side and a second side, the second side opposite the first side; forming a micro electro-mechanical systems (MEMS) structure over the first side of the conductive substrate; forming a plurality of bond pads formed over the first side of the conductive substrate and electrically coupled to the first side of the conductive substrate; flip-chip mounting the device is flip-chip mounted to a printed circuit board (PCB) that comprises a patterned metal layer and a ground terminal, wherein the patterned metal layer is coupled to the ground terminal; and electrically coupling each of the plurality of bond pads to the ground terminal of the PCB, wherein the patterned metal layer, the plurality of bond pads, and the conductive substrate together form an electrostatic noise shield around the MEMS structure. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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12. A method for forming a device, the method comprising:
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providing a conductive substrate having a first side and a second side, the second side opposite the first side, wherein a cavity is formed in the conductive substrate having an opening on the first side; forming a micro electro-mechanical systems (MEMS) microphone diaphragm over the opening on the first side, the MEMS microphone diaphragm electrically isolated from the conductive substrate; forming a microphone backplate over and electrically isolated from the MEMS microphone diaphragm on the first side of the conductive substrate; forming a plurality of bond pads over the conductive substrate on the first side and around the MEMS microphone diaphragm; electrically coupling each of the plurality of bond pads to the conductive substrate; solder mounting the device to a printed circuit board (PCB) via the plurality of bond pads; and electrically coupling a ground terminal of the PCB to the plurality of bond pads. - View Dependent Claims (13, 14, 15, 16, 17)
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Specification