Knowledge-Based Models for Data Centers

• US 20120284216A1
• Filed: 07/14/2012
• Published: 11/08/2012
• Est. Priority Date: 08/12/2009
• Status: Abandoned Application

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Hamann, Hendrik F., Lloyd, Raymond, Min, Wanli
• Application Number:
  US13/549,428
• Publication Number:
  US 20120284216A1
• Time in Patent Office: Days
• US Class Current: 706/12
• CPC Class Codes: G06F 1/206 comprising thermal management
• CPC Class Codes: G06N 3/02 Neural networks
• CPC Class Codes: H05K 7/20836 Thermal management, e.g. server temperature control
• CPC Class Codes: Y02D 10/00 Energy efficient computing, e.g. low power processors, power management or thermal management

Abstract

Techniques for data center analysis are provided. In one aspect, a method for modeling thermal distributions in a data center includes the following steps. Vertical temperature distribution data is obtained for a plurality of locations throughout the data center and is plotted as an s-curve, wherein the vertical temperature distribution data reflects physical conditions at each of the locations which is reflected in a shape of the s-curve. Each of the s-curves is represented with a set of parameters that characterize the shape of the s-curve, wherein the s-curve representations make up a knowledge base model of predefined s-curve types from which thermal distributions and associated physical conditions at the plurality of locations throughout the data center can be analyzed. The set of parameters that characterize the shape of the s-curve are associated with the physical conditions at the plurality of locations throughout the data center using a machine-learning model.

Claims

1. A method for modeling thermal distributions in a data center, comprising the steps of:

obtaining vertical temperature distribution data for a plurality of locations throughout the data center;

plotting the vertical temperature distribution data for each of the locations as an s-curve, wherein the vertical temperature distribution data reflects physical conditions at each of the locations which is reflected in a shape of the s-curve;

representing each of the s-curves with a set of parameters that characterize the shape of the s-curve, wherein the s-curve representations make up a knowledge base model of predefined s-curve types from which thermal distributions and associated physical conditions at the plurality of locations throughout the data center can be analyzed; and

associating the set of parameters that characterize the shape of the s-curve and the physical conditions at the plurality of locations throughout the data center using a machine-learning model.

2. The method of claim 1, further comprising the step of:

forming the machine-learning model using training data.

3. The method of claim 1, wherein the machine-learning model comprises a neural network which is used to associate the set of parameters that characterize the shape of the s-curve and the physical conditions at the plurality of locations throughout the data center.

4. The method of claim 3, further comprising the step of:

forming the neural network using training data.

4-1. The method of claim 1, wherein the temperature distribution data is obtained using mobile measurement technology (MMT).

6. The method of claim 1, wherein the parameters include one or more of a lower plateau of the s-curve, an upper plateau of the s-curve, s-shape-ness in an upper part of the s-curve, s-shape-ness in a lower part the s-curve and height at which a half point of the s-curve is reached.

7. The method of claim 1, wherein the set of parameters further includes one or more parameters describing a particular location in the data center for which the s-curve is a plot of the vertical temperature distribution data.

8. The method of claim 1, wherein the data center comprises server racks and a raised-floor cooling system with one or more computer air conditioning units configured to take in hot air from the server racks and to exhaust cooled air into a sub-floor plenum that is delivered to the server racks through a plurality of perforated tiles in the raised floor.

9. The method of claim 8, further comprising the step of:

obtaining the vertical temperature distribution data at an air inlet side of each of one or more of the server racks in the data center.

10. The method of claim 8, wherein the physical conditions comprise one or more of server rack locations in the data center, distance of a server rack to air conditioning units, server rack height, thermal footprint, server rack exposure, ceiling height, distance to nearest tile, air flow delivered to the server rack from the air conditioning units, openings within the server rack, power consumption of the server rack and air flow demand of the server rack.

11. The method of claim 1, wherein the vertical temperature distribution data is obtained for a time T=0, the method further comprising the steps of:

obtaining real-time temperature data for a time T=1, wherein the real-time data is less spatially dense than the data obtained for time T=0; and

interpolating the real-time data onto the data obtained for time T=0 to obtain updated vertical temperature distribution data for the plurality of locations.

12. The method of claim 11, further comprising the steps of:

plotting the updated vertical temperature distribution data for each of the locations as an updated s-curve, wherein the updated vertical temperature distribution data reflects updated physical conditions at each of the locations which is reflected in a shape of the updated s-curve; and

mating the updated s-curve to the predefined s-curve types in the knowledge base model.

13. The method of claim 1, further comprising the step of:

grouping the predefined s-curve types based on similar parameters.

14. An article of manufacture for modeling thermal distributions in a data center, comprising a machine-readable medium containing one or more programs which when executed implement the steps of the method according to claim 1.

15. An apparatus for modeling thermal distributions in a data center, the apparatus comprising:

a memory; and

at least one processor device, coupled to the memory, operative to;

obtain vertical temperature distribution data for a plurality of locations throughout the data center;

plot the vertical temperature distribution data for each of the locations as an s-curve, wherein the vertical temperature distribution data reflects physical conditions at each of the locations which is reflected in a shape of the s-curve;

represent each of the s-curves with a set of parameters that characterize the shape of the s-curve, wherein the s-curve representations make up a knowledge base model of predefined s-curve types from which thermal distributions and associated physical conditions at the plurality of locations throughout the data center can be analyzed; and

associate the set of parameters that characterize the shape of the s-curve and the physical conditions at the plurality of locations throughout the data center using a machine-learning model.

16. The apparatus of claim 15, wherein the data center comprises server racks and a raised-floor cooling system with one or more computer air conditioning units configured to take in hot air from the server racks and to exhaust cooled air into a sub-floor plenum that is delivered to the server racks through a plurality of perforated tiles in the raised floor.

17. The apparatus of claim 16, wherein the at least one processor device is further operative to:

obtain vertical temperature distribution data at an air inlet side of each of one or more of the server racks in the data center.

18. The apparatus of claim 15, wherein the vertical temperature distribution data is obtained for a time T=0, and wherein the at least one processor device is further operative to:

obtain real-time temperature data for a time T=1, wherein the real-time data is less spatially dense than the data obtained for time T=0; and

interpolate the real-time data onto the data obtained for time T=0 to obtain updated vertical temperature distribution data for the plurality of locations.

19. The apparatus of claim 18, wherein the at least one processor device is further operative to:

plot the updated vertical temperature distribution data for each of the locations as an updated s-curve, wherein the updated vertical temperature distribution data reflects updated physical conditions at each of the locations which is reflected in a shape of the updated s-curve; and

mate the updated s-curve to the predefined s-curve types in the knowledge base model.

20. The apparatus of claim 15, wherein the at least one processor device is further operative to:

group the predefined s-curve types based on similar parameters.