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Semiconductor Device and Method of Forming Dummy Pillars Between Semiconductor Die and Substrate for Maintaining Standoff Distance

  • US 20120286418A1
  • Filed: 05/13/2011
  • Published: 11/15/2012
  • Est. Priority Date: 05/13/2011
  • Status: Active Grant
First Claim
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1. A method of making a semiconductor device, comprising:

  • providing a semiconductor die;

    forming a first insulation layer over an active surface of the semiconductor die;

    forming a conductive layer over the first insulating layer electrically connected to the active surface of the semiconductor die;

    forming a plurality of conductive pillars over the conductive layer;

    forming a plurality of dummy pillars over the first insulating layer electrically isolated from the conductive layer and conductive pillars;

    providing a substrate; and

    mounting the semiconductor die to the substrate with the dummy pillars maintaining a standoff distance between the semiconductor die and substrate.

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