SYSTEM AND METHOD FOR DEPOSITING MATERIAL ON A PIEZOELECTRIC ARRAY

• US 20120288641A1
• Filed: 04/09/2012
• Published: 11/15/2012
• Est. Priority Date: 04/08/2011
• Status: Abandoned Application

• Current Assignee: Sonavation, Inc.
• Original Assignee: Sonavation, Inc.
• Inventors: Williams, Roland, Diatezua, Deda Mampuya, Schmitt, Rainer
• Application Number:
  US13/442,380
• Publication Number:
  US 20120288641A1
• Time in Patent Office: Days
• US Class Current: 427/555
• CPC Class Codes: H10N 30/06 Forming electrodes or interconnections, e.g. leads or terminals
• CPC Class Codes: H10N 30/092 Forming composite materials
• CPC Class Codes: H10N 30/852 Composite materials, e.g. having 1-3 or 2-2 type connectivity

Abstract

A system having a print head for depositing material on a piezoelectric array, where the print head and array are moveable with respect to each other, and a computer for controlling movement of the print head and array with respect to each other to locations along the array, and controlling the print head to dispense the material onto the array at such locations. The print head deposits a pre-determined amount of material in one of dots, or in a line with movement of the print head and array with respect to each other. The system enables deposit of conductive material for electrical connections to array elements. Non-conductive polymer material may be deposited on the array before depositing conductive material to create barriers avoiding unintended connection of array elements by the conductive material. The system may also be used for fabricating a piezoelectric array by depositing electro-ceramic material.

Claims

1. A system for depositing material on a piezoelectric array of elements composed of electro-ceramic composite material comprising:

a print head for depositing a material on the array;

means for moving said print head and the array with respect to each other; and

a computer system for controlling said means to move said print head and the array with respect to each other to locations along the array, and controlling said print head to dispense said material onto the array at the locations.

2. The system according to claim 1 wherein said material is one of a conductive fluid or a non-conductive fluid.

3. The system according to claim 1 wherein said material is conductive ink and said print head deposition at said locations provides traces along the array in a first layer.

4. The system according to claim 3 wherein said print head deposition at said locations further provide contact points upon each of the elements of the array in a second layer in connection to traces of said first layer.

5. The system according to claim 1 wherein said material is a conductive material and said print head deposits conductive elements along the array to provide connections at said locations along said array.

6. The system according to claim 1 wherein said material is non-conductive material and said print head deposits said material at said locations between adjacent ones of said array elements.

7. The system according to claim 1 wherein said material has viscosity enabling dispensing via said print head.

8. The system according to claim 1 wherein said system has first and second modes, and in said first mode said material is non-conductive material and said print head deposits said material at a first plurality of said locations represent locations between adjacent different ones of said array elements, and then in said second mode said material is a conductive material and said print head deposits conductive elements along the array in one or more of traces or drops to provide connections at a second plurality of said locations representing locations along different ones of said elements of said array, in which said non-conductive material deposited prevents unintended connection of deposited conductive material to one or more of said elements of said array.

9. The system according to claim 1 wherein said print head is an ink jet print head.

10. The system according to claim 1 wherein said array has filler material between elements of said array binding said elements of said array.

11. The system according to claim 1 wherein said array is utilized as part of a finger print sensor.

12. The system according to claim 1 further comprising means for facilitating sintering of said material deposited.

13. The system according to claim 1 further comprising means for optically aligning said print head with the elements of said array.

14. A method for depositing material on an array of elements composed of electro-ceramic composite material and binding material between said elements, said method comprising the step of:

printing conductive material along the array to provide conductor elements to different ones of said elements of the array.

15. The method according to claim 14 further comprising the step of printing non-conductive material onto said array prior to said printing conductive material step at locations along the array which prevents unintended connection of said conductive material when said printing conductive material step is carried out.

16. The method according to claim 14 wherein said printing in by an ink jet printer.

17. The method according to claim 14 wherein said printing step is carried out in one or more layers upon the array.

18. The method according to claim 14 wherein said printing step is carrying out by a print head movable along said array, and said method further comprises the step of:

optically aligning said print head to one or more of said array elements prior to carrying out said printing step along said one or more of said array elements.

19. The method according to claim 14 wherein said printing step is carried in one or more of traces along the array and connection points to individual elements of the array.

20. A method for fabricating an electro-ceramic array comprising the steps of:

printing electro-ceramic material in dots upon a substrate at array locations to a height greater than a target thickness to provide elements of said array;

sintering each of the elements of said array;

applying filler material between and over the elements formed by the printing step; and

grinding the array along the top thereof until the target array thickness upon the substrate is reached.

21. The method according to claim 20 further comprising the step of printing conductive material along the array to provide connections along different ones of said elements of said array.

22. The method according to claim 20 further comprising the step of printing non-conductive material between adjacent ones of said array elements.

23. The method according to claim 22 further comprising the step of printing conductive material along the array to provide connections along different ones of said elements of said array in which said non-conductive material deposited prevents unintended connection of deposited conductive material to one or more of said elements of said array.

24. The method according to claim 20 wherein said sintering step is providing by applying a laser to each of the elements of said array.