DEFECT INSPECTION METHOD AND DEVICE THEREOF

• US 20120294507A1
• Filed: 02/04/2011
• Published: 11/22/2012
• Est. Priority Date: 02/08/2010
• Status: Abandoned Application

• Current Assignee: Hitachi High-Technologies Corporation (Hitachi, Ltd.)
• Original Assignee: Hitachi High-Technologies Corporation (Hitachi, Ltd.)
• Inventors: Sakai, Kaoru, Maeda, Shunji
• Application Number:
  US13/520,227
• Publication Number:
  US 20120294507A1
• Time in Patent Office: Days
• US Class Current: 382/149
• CPC Class Codes: G01N 2021/8854 Grading and classifying of flaws
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14

Abstract

Disclosed is a defect inspection device that can highly accurately distinguish between true defects and noise/nuisance defects by means of integrating inspection results from different lighting conditions or detection conditions. Further disclosed is a method thereof. The defect inspection device—which is provided with: a lighting optical system that illuminates an inspected object under predetermined optical conditions; and a detection optical system that detects scattered light from the inspected object under predetermined detection conditions, and acquires image data—is characterized by being provided with: a defect candidate detection arbitrary unit that detects defect candidates from a plurality of image data acquired by the aforementioned detection optical system under differing optical conditions or image data acquisition conditions; and a post-inspection processing unit that integrates information about defect candidates detected from said plurality of image data, and differentiates defects from noise.

Claims

1. A defect inspection device that inspects a pattern formed on a sample, comprising:

table means that holds the sample thereon and is capable of continuously moving in at least one direction;

image acquiring means that images the sample held on the table means and acquires an image of the pattern formed on the sample;

pattern arrangement information extracting means that extracts arrangement information of the pattern from the image of the pattern that has been acquired by the image acquiring means;

reference image generating means that generates a reference image from the arrangement information of the pattern and the image of the pattern, the arrangement information being extracted by the pattern arrangement information extracting means, the image of the pattern being acquired by the image acquiring means; and

defect candidate extracting means that compares the reference image generated by the reference image generating means with the image of the pattern that has been acquired by the image acquiring means thereby extracting a defect candidate of the pattern.

2. The defect inspection device according to claim 1,

wherein the image acquiring means divides the acquired image of the pattern and outputs divided images,

wherein the pattern arrangement information extracting means extracts arrangement information of the pattern from the divided images output from the image acquiring means,

wherein the reference image generating means generates reference images corresponding to the divided images, and

wherein the defect candidate extracting means compares the reference images generated by the reference image generating means and corresponding to the divided images with the divided images output from the image acquiring means thereby extracting a defect candidate of the pattern.

3. The defect inspection device according to claim 1,

wherein the image acquiring means includes an illumination optical system for irradiating the sample with light, and a reflected light detection optical system for detecting light reflected from the sample that is irradiated with the light by the illumination optical system.

4. The defect inspection device according to claim 1, further comprising

defect classifying/dimension estimating means that excludes a nuisance defect and noise from the defect candidate extracted by the defect candidate extracting means, classifies a remaining defect on the basis of the type of the remaining defect, and estimates a dimension of the remaining defect.

5. A defect inspection device that inspects patterns that have been repetitively formed on a sample and originally need to have the same shape, comprising:

table means that holds the sample thereon and is capable of continuously moving in at least one direction;

image acquiring means that images the sample held on the table means and sequentially acquires images of the patterns that have been repetitively formed on the sample and originally need to have the same shape;

standard image generating means that generates a standard image from the images of the patterns that have been sequentially acquired by the image acquiring means that have been repetitively formed and originally need to have the same shape;

pattern arrangement information extracting means that extracts, from the standard image generated by the standard image generating means, arrangement information of the patterns that originally need to have the same shape;

reference image generating means that generates a reference image using the arrangement information of the patterns extracted by the pattern arrangement information extracting means, and an image of a pattern to be inspected among the images of the patterns sequentially acquired by the image acquiring means that originally need to have the same shape, or the standard image generated by the standard image generating means; and

defect candidate extracting means that compares the reference image generated by the reference image generating means with the image of the pattern to be inspected among the images of the patterns sequentially acquired by the image acquiring means that originally need to have the same shape thereby extracting a defect candidate of the pattern to be inspected.

6. The defect inspection device according to claim 5,

wherein the image acquiring means divides the images of the patterns that have been repetitively formed and sequentially acquired and originally need to have the same shape, and outputs the divided images,

wherein the standard image generating means generates divided standard images that correspond to the divided images output from the image acquiring means and obtained from the images of the patterns that have been repetitively formed and originally need to have the same shape,

wherein the pattern arrangement information extracting means extracts arrangement information of the patterns from the divided standard images generated by the standard image generating means,

wherein the reference image generating means generates reference images corresponding to the divided images using the arrangement information of the patterns extracted from the divided standard images by the pattern arrangement information extracting means, and the divided images output from the image acquiring means, or the divided standard images generated by the standard image generating means, and

wherein the defect candidate extracting means compares the reference images generated by the reference image generating means and corresponding to the divided images with the divided images output from the image acquiring means thereby extracting a defect candidate of the pattern.

7. The defect inspection device according to claim 5,

wherein the image acquiring means includes an illumination optical system for irradiating the sample with light, and a reflected light detection optical system for detecting light that is reflected from the sample irradiated with the light by the illumination optical system.

8. The defect inspection device according to claim 5, further comprising

defect classifying/dimension estimating means that excludes a nuisance defect and noise from the defect candidate extracted by the defect candidate extracting means, classifies a remaining defect on the basis of the type of the remaining defect, and estimates a dimension of the remaining defect.

9. A defect inspection method for inspecting a pattern formed on a sample, comprising the steps of:

imaging the sample while continuously moving the sample in a direction, and acquiring images of the patterns formed on the sample;

extracting arrangement information of the pattern from the acquired images of the patterns;

generating a reference image from an image to be inspected among the acquired images of the patterns using the extracted arrangement information of the pattern; and

comparing the generated reference image with the image to be inspected thereby extracting a defect candidate of the pattern.

10. The defect inspection method according to claim 9,

wherein in the step of extracting the arrangement information of the pattern, arrangement information of the pattern is extracted from each of images obtained by dividing the acquired images of the patterns,

wherein in the step of generating the reference image, reference images that correspond to the divided images are generated using the divided images and the arrangement information of the pattern extracted from each of the divided images, and

wherein in the step of extracting the defect candidate of the pattern, the defect candidate of the pattern is extracted by comparing the generated reference images corresponding to the divided images with the divided images.

11. The defect inspection method according to claim 9,

Wherein in the step of imaging the sample, the images of the patterns are acquired by irradiating the sample with the light and detecting light reflected from the sample irradiated with the light.

12. The defect inspection method according to claim 9,

wherein the step of extracting the defect candidate of the pattern includes the step of excluding a nuisance defect and noise from the extracted candidate, classifying a remaining defect on the basis of the type of the remaining defect, and estimating a dimension of the remaining defect.

13. A defect inspection method for inspecting patterns that have been repetitively formed on a sample and originally need to have the same shape, comprising the steps of:

imaging the sample while continuously moving the sample in a direction, and sequentially acquiring images of the patterns that have been repetitively formed on the sample and originally need to have the same shape;

generating a standard image from a plurality of images of the patterns that have been sequentially acquired in the step of imaging, said patterns are repetitively formed on the sample and originally need to have the same shape;

extracting, from the generated standard image, arrangement information of the patterns that originally need to have the same shape;

generating a reference image using the extracted arrangement information of the patterns, and an image of a pattern to be inspected among the images of the patterns that have been sequentially acquired that originally need to have the same shape, or the generated standard image; and

comparing the generated reference image with the image of the pattern to be inspected thereby extracting a defect candidate of the pattern to be inspected.

14. The defect inspection method according to claim 13,

wherein in the step of generating the standard image, divided standard images that correspond to images obtained by dividing the images of the patterns that have been repetitively formed on the sample and originally need to have the same shape are generated,

wherein in the step of extracting the arrangement information of the patterns, arrangement information of the patterns is extracted from each of the divided and generated standard images,

wherein in the step of generating the reference image, reference images that correspond to the divided images are generated using the arrangement information that has been extracted from each of the divided standard images and the divided images or the divided standard images, and

wherein in the step of extracting the defect candidate of the pattern, the generated reference images that correspond to the divided images are compared with the divided images, and the defect candidate of the pattern is extracted.

15. The defect inspection method according to claim 13,

Wherein in the step of imaging the sample, the images of the patterns are acquired by irradiating the sample with the light and detecting light reflected from the sample irradiated with the light.

16. The defect inspection method according to claim 13,

wherein the step of extracting the defect candidate of the pattern includes the steps of excluding a nuisance defect and noise from the defect candidate, classifying a remaining defect on the basis of the type of the remaining defect, and estimating a dimension of the remaining defect.