EHF COMMUNICATION WITH ELECTRICAL ISOLATION AND WITH DIELECTRIC TRANSMISSION MEDIUM

• US 20120295539A1
• Filed: 07/03/2012
• Published: 11/22/2012
• Est. Priority Date: 12/23/2008
• Status: Abandoned Application

• Current Assignee: Keyssa, Inc.
• Original Assignee: Waveconnex Inc.
• Inventors: McCormack, Gary D., Kyles, Ian A.
• Application Number:
  US13/541,543
• Publication Number:
  US 20120295539A1
• Time in Patent Office: Days
• US Class Current: 455/39
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H04B 5/48 Transceivers
• CPC Class Codes: H04B 5/72 for local intradevice communication

Abstract

A system for transferring electrical signals while providing electrical isolation may include a first circuit and a second circuit electrically isolated from the first circuit. The first circuit may provide a first electrical signal path for conveying a transmit electrical signal and including a first EHF communication unit. The first EHF communication unit may be configured to receive the transmit electrical signal and to electromagnetically transmit an electromagnetic EHF signal representative of the electrical signal. The second circuit may provide a second electrical signal path and including a second EHF communication unit. The second EHF communication unit may be configured to electromagnetically receive the transmitted electromagnetic EHF signal, extract a received electrical signal from the received electromagnetic EHF signal, and apply the received electrical signal to the second electrical signal path. A dielectric element may conduct the electromagnetic EHF signal between the first and second EHF communication units.

Claims

1. A system for transferring electrical signals while providing electrical isolation, comprising:

a first circuit providing a first electrical signal path for conveying a transmit electrical signal and including a first EHF communication unit configured to receive the transmit electrical signal and to electromagnetically transmit an electromagnetic EHF signal representative of the electrical signal; and

a second circuit electrically isolated from the first circuit, the second circuit providing a second electrical signal path and including a second EHF communication unit configured to electromagnetically receive the transmitted electromagnetic EHF signal, extract a received electrical signal from the received electromagnetic EHF signal, and apply the received electrical signal to the second electrical signal path.

2. The system of claim 1, wherein the first EHF unit is configured to modulate a transmit electrical EHF signal based on the received transmit electrical signal.

3. The system of claim 2, wherein the second EHF unit is configured to demodulate the received electromagnetic EHF signal to produce a receive electrical signal representative of the transmit electrical signal.

4. The system of claim 1, wherein the first circuit and the second circuit are both disposed on a single printed circuit board (PCB).

5. The system of claim 4, further comprising a dielectric material extending along the PCB between the first and second circuits.

6. The system of claim 5, wherein a portion of the PCB between the first and second circuits has a lower dielectric constant than a portion of the PCB on which the first and second circuits are mounted.

7. The system of claim 6, wherein the portion of the PCB between the first and second circuits is a void filled with air and the dielectric material extending along the PCB between the first and second circuits is suspended over the void.

8. The system of claim 4, wherein the dielectric material extending along the PCB between the first and second circuits is a dielectric guide having a rectangular cross-section.

9. The system of claim 8, wherein the first and second circuits are formed as separate IC packages, and the dielectric guide is separate from the IC packages.

10. The system of claim 8, wherein the dielectric guide is coplanar with the PCB.

11. The system of claim 10, wherein the PCB includes opposing channels formed in the PCB and extending between the first and second circuits.

12. The system of claim 11, wherein the PCB includes U-shaped channels including the opposing channels and connecting channel portions extending between the opposing channels proximate to the first and second circuits.

13. The system of claim 5, wherein the first EHF communication unit and the second EHF communication unit are disposed in a common integrated circuit (IC) package.

14. The system of claim 13, wherein the first circuit and the second circuit are both disposed in the common IC package.

15. The system of claim 13, wherein the first EHF communication unit includes a first antenna for converting a transmit electrical EHF signal representative of the transmit electrical signal into the electromagnetic EHF signal and directing the electromagnetic EHF signal in a given direction along the PCB, and the second EHF communication unit includes a second antenna disposed in the given direction from the first antenna for receiving the transmitted electromagnetic EHF signal and for converting the received electromagnetic EHF signal into a received electrical EHF signal.

16. The system of claim 15, wherein the common IC package includes a dielectric portion covering and extending continuously between the first and second antennas.

17. The system of claim 16, wherein the PCB includes a first ground plane aligned with the first EHF communication unit and a second ground plane physically spaced from and electrically isolated from the first ground plane, the second ground plane being aligned with the second EHF communication unit.

18. The system of claim 17, wherein a distance between the first and second ground planes is longer than a distance between the first and second antennas.

19. The system of claim 1, wherein the first circuit is disposed on a first PCB and the second circuit is disposed on a second PCB.

20. The system of claim 1, further comprising a dielectric portion, wherein the dielectric portion is disposed between the first EHF communication unit and the second EHF communication unit.

21. The system of claim 1, wherein each of the first and second EHF communication units includes an integrated circuit (IC) package having a chip, insulating material, and an antenna located in the IC package and held in a fixed location by the insulating material.

22. The system of claim 21, wherein each of the first and second EHF communication units further includes a lead frame and has a ground plane operatively connected to the IC.

23. The system of claim 22, wherein the antenna is configured to operate at a predetermined wavelength and the lead frame includes a plurality of separate conductor elements arranged sufficiently close together to reflect electromagnetic energy having the predetermined wavelength.

24. The system of claim 1, wherein the first circuit has a first power supply and the second circuit has a second power supply electrically isolated from the first power supply.

26. The system of claim 1, wherein at least one of the first and second EHF communication units is configured as a transceiver.

25. The system of paragraph 1, wherein the first circuit has a first electrical ground and the second circuit has a second electrical ground electrically isolated from the first electrical ground.

27. A method for transferring electrical signals while providing electrical isolation, the method comprising:

conveying a transmit electrical signal on a first electrical signal path of a first circuit;

receiving the transmit electrical signal in a first EHF communication unit of the first circuit;

transmitting a first electromagnetic EHF signal representative of the transmit electrical signal;

receiving the transmitted electromagnetic EHF signal in a second EHF communication unit of a second circuit electrically isolated from the first circuit;

extracting a received electrical signal from the received electromagnetic EHF signal, the received electrical signal being representative of the transmit electrical signal; and

applying the extracted received electrical signal to a second electrical signal path of the second circuit.

28. The method of claim 27, further including converting the transmit electrical signal into a transmit electrical EHF signal, and modulating by the first EHF communication unit the transmit electrical EHF signal based on the transmit electrical signal.

29. The method of claim 28, further including converting the received electromagnetic EHF signal into a received electrical EHF signal, and demodulating by the second EHF communication unit the received electrical EHF signal to recreate the received electrical signal.

30. The method of claim 27, wherein transmitting an electromagnetic EHF signal includes transmitting an electromagnetic EHF signal between the first circuit and the second circuit on a single printed circuit board (PCB).

31. The method of claim 30, wherein transmitting an electromagnetic EHF signal includes transmitting an electromagnetic EHF signal between the first circuit and the second circuit through a dielectric material extending along the PCB between the first and second circuits.

32. The method of claim 31, further comprising suspending the dielectric material extending along the PCB between the first and second circuits over a void in the PCB.

33. The method of claim 30, wherein transmitting an electromagnetic EHF signal between the first circuit and the second circuit through a dielectric material extending along the PCB between the first and second circuits includes transmitting the electromagnetic EHF signal between the first and second circuits through a dielectric guide that is coplanar with the PCB.

34. The method of claim 33, further comprising forming the dielectric guide by forming opposing channels in the PCB that extend between the first and second circuits.

35. The method of claim 34, wherein forming opposing channels in the PCB that extend between the first and second circuits. includes forming U-shaped channels including the opposing channels and connecting channel portions extending between the opposing channels proximate to the first and second circuits.

36. The method of claim 30, wherein transmitting an electromagnetic EHF signal between the first circuit and the second circuit includes transmitting an electromagnetic EHF signal between the first EHF communication unit and the second EHF communication unit through a solid dielectric covering and extending continuously between the first EHF communication unit and the second EHF communication unit.

37. The method of claim 27, wherein transmitting an electromagnetic EHF signal includes transmitting an electromagnetic EHF signal between the first circuit disposed on a first PCB and the second circuit disposed on a second PCB.

38. The method of claim 27, wherein transmitting an electromagnetic EHF signal includes transmitting an electromagnetic EHF signal through a solid dielectric portion extending continuously between the first EHF communication unit and the second EHF communication unit.

39. The method of claim 27, wherein transmitting an electromagnetic EHF signal includes transmitting an electromagnetic EHF signal having a predetermined wavelength, and reflecting the electromagnetic EHF signal from a lead frame of the first EHF communication unit, the lead frame having a plurality of separate conductor elements arranged sufficiently close together to reflect electromagnetic energy having the predetermined wavelength.

40. The method of claim 27, further including powering the first circuit with a first power supply and powering the second circuit with a second power supply electrically isolated from the first power supply.

41. The method of claim 27, further including grounding the first circuit with a first electrical ground, and grounding the second circuit with a second electrical ground electrically isolated from the first electrical ground.

42. The method of claim 27, further including transmitting a second electromagnetic EHF signal from the second EHF communication unit, and receiving the transmitted second electromagnetic EHF signal in the first EHF communication unit.

43. A communication system for communicating along a communication pathway between first and second EHF communication units using an electromagnetic EHF signal, the communication system comprising a dielectric element having opposite ends, the dielectric element conducting an electromagnetic EHF signal when positioned to extend between the first EHF communication unit and the second EHF communication unit with the ends proximate respective ones of the EHF communication units and in the communication pathway, the dielectric element receiving the electromagnetic EHF signal in one end and conducting the electromagnetic EHF signal through the dielectric element to the other end.

44. The system of claim 43, where the first and second EHF communication units are disposed on a single printed circuit board (PCB) and wherein the dielectric element extends along the PCB between the first and second EHF communication units.

45. The system of claim 44, wherein the system includes the first and second EHF communication units and the PCB, a portion of the PCB between the first and second EHF communication units has a lower dielectric constant than a portion of the PCB on which the first and second EHF communication units are mounted.

46. The system of claim 45, wherein the portion of the PCB between the first and second circuits is a void filled with air and the dielectric element extending along the PCB between the first and second circuits is suspended over the void.

47. The system of claim 44, wherein the dielectric element extending along the PCB between the first and second EHF communication units is a dielectric guide having a rectangular cross-section.

48. The system of claim 47, wherein the first and second EHF communication units are formed as separate IC packages, and the dielectric element is separate from the IC packages.

49. The system of claim 47, wherein the dielectric element is coplanar with the PCB.

50. The system of claim 49, wherein the PCB includes opposing channels formed in the PCB and extending between the first and second EHF communication units.

51. The system of claim 50, wherein the PCB includes U-shaped channels including the opposing channels and connecting channel portions extending between the opposing channels proximate to the first and second circuits.

52. The system of claim 44, wherein the first EHF communication unit and the second EHF communication unit are disposed in a common integrated circuit (IC) package including the dielectric element.

53. The system of claim 52, wherein the first EHF communication unit includes a first antenna for converting a transmit electrical EHF signal representative of the transmit electrical signal into the electromagnetic EHF signal and directing the electromagnetic EHF signal in a first given direction along the PCB, and the second EHF communication unit includes a second antenna disposed in the first given direction from the first antenna, with the dielectric element extending along the first direction.

54. The system of claim 53, wherein the PCB includes a first ground plane aligned with the first EHF communication unit and a second ground plane physically spaced from and electrically isolated from the first ground plane, the second ground plane being aligned with the second EHF communication unit.

55. The system of claim 54, wherein a distance between the first and second ground planes is longer than a distance between the first and second antennas.

56. The system of claim 43, wherein the first circuit is disposed on a first PCB and the second circuit is disposed on a second PCB.

57. The system of claim 43, wherein the first EHF communication unit includes a first antenna for converting a transmit electrical EHF signal representative of the transmit electrical signal into the electromagnetic EHF signal and directing the electromagnetic EHF signal in a first given direction along the PCB, and the second EHF communication unit includes a second antenna disposed in a second given direction, one end of the dielectric element being disposed in the first given direction from the first antenna and the other end of the dielectric element being disposed in the second given direction from the second antenna.

58. The system of claim 43, wherein each of the first and second EHF communication units includes an integrated circuit (IC) package having a chip, insulating material, and an antenna located in the IC package and held in a fixed location by the insulating material.

59. The system of claim 43, wherein at least one of the first and second EHF communication units is configured as a transceiver.

60. A method for communicating comprising:

positioning a dielectric element having opposite ends between first and second EHF communication units with each of the ends proximate a respective one of the EHF communication units;

producing an electromagnetic EHF signal from the first EHF communication unit;

conducting the electromagnetic EHF signal in the dielectric element between the first EHF communication unit and the second EHF communication unit and in the communication pathway, the dielectric element receiving the electromagnetic EHF signal in one end and conducting the electromagnetic EHF signal through the dielectric element to the other end; and

outputting the conducted electromagnetic EHF signal from the dielectric element to the second EHF communication unit.

61. The method of claim 60, wherein positioning a dielectric element between first and second EHF communication units includes positioning the dielectric element between first and second EHF communication units mounted on a single printed circuit board (PCB).

62. The method of claim 61, wherein positioning a dielectric element between first and second EHF communication units includes suspending the dielectric element along the PCB between the first and second circuits over a void in the PCB.

63. The method of claim 61, wherein positioning a dielectric element between first and second EHF communication units includes positioning a dielectric element having opposite ends between first and second EHF communication units coplanar with the PCB.

64. The method of claim 63, further comprising forming the dielectric guide by forming opposing channels in the PCB that extend between the first and second circuits.

65. The method of claim 63, wherein forming opposing channels in the PCB that extend between the first and second circuits. includes forming U-shaped channels including the opposing channels and connecting channel portions extending between the opposing channels proximate to the first and second circuits.

66. The method of claim 61, wherein positioning a dielectric element between first and second EHF communication units includes positioning a dielectric element as a solid dielectric covering and extending continuously between the first EHF communication unit and the second EHF communication unit.

67. The method of claim 60, wherein positioning a dielectric element between first and second EHF communication units includes positioning a dielectric element between the first EHF communication unit disposed on a first PCB and the second EHF communication unit disposed on a second PCB.

68. The method of claim 60, further including producing an electromagnetic EHF signal from the second EHF communication unit;

conducting the electromagnetic EHF signal in the dielectric element between the second EHF communication unit and the first EHF communication unit and in the communication pathway, the dielectric element receiving the electromagnetic EHF signal in other end and conducting the electromagnetic EHF signal through the dielectric element to the one end; and

outputting the conducted electromagnetic EHF signal from the dielectric element to the first EHF communication unit.