COATED ELECTRONIC DEVICES AND ASSOCIATED METHODS
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Accused Products
Abstract
The present disclosure provides an electronic device and related method, wherein the device has a polymeric coating with low toxicity. The polymeric coating formed by exposing the electronic device to continuous plasma comprising a compound of CH2═C(R1)—COO—R2, where R1 includes —H or —CH3; and where R2 includes —(CH2)2—(CF2)m—CF3 and m is 3 or 5.
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Citations
71 Claims
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1-34. -34. (canceled)
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35. A method of coating a surface of an electronic device, comprising:
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exposing the surface of the electronic device to a plasma comprising a compound with the following chemical formula;
CH2═
C(R1)—
COO—
R2where R1 includes —
H or —
CH3, R2 includes —
(CH2)2—
(CF2)m—
CF3, and m is 3 or 5, so as to form a polymeric coating on the surface, the polymeric coating having an oleophobicity level of at least 5.- View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
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39. The method of claim 35, further comprising introducing the compound in a plasma chamber at a flow rate from about 30 cm3/min to about 50 cm3/min, prior to exposing the surface of the electronic device to the plasma comprising the compound.
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40. The method of claim 35, wherein the plasma is a low pressure plasma of less than 1000 mTorr.
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41. The method of claim 35, wherein at least a portion of the device is opened prior to exposing the surface to the plasma.
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42. The method of claim 35, further comprising cleaning, etching, or activating the electronic device prior to exposing the surface to the plasma.
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43. The method of claim 35, further comprising degassing the electronic device prior to exposing the surface to the plasma.
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44. The method of claim 35, wherein the plasma is formed at a pressure between about 10 mTorr and about 1000 mTorr, at a temperature of about 5°
- C. to about 200°
C., and at a frequency of about 20 kHz to about 2.45 GHz, and at a power setting from about 5 W and about 5000 W.
- C. to about 200°
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45. The method of claim 35, wherein the plasma is formed at a pressure between about 20 mTorr and about 60 mTorr.
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46. The method of claim 35, wherein the plasma is formed at a temperature of about 40°
- C. to about 50°
C.
- C. to about 50°
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47. The method of claim 35, wherein the plasma is formed at a frequency of about 12 MHz to about 15 MHz.
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48. The method of claim 35, wherein the plasma is formed at a power setting ranging from about 0.017 to 0.023 W per cm2 of electrode.
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49. The method of claim 35, wherein the polymeric coating is formed at a rate of about 25 to 75 nm of thickness on the electronic device per minute.
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50. The method of claim 35, wherein the electronic device is selected from a group consisting of a cellular phone, a personal digital assistants (PDA), a computer, a tablet computer, a music player, a camera, a video recorder, a battery, an e reader, a radio device, and a gaming device.
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51. The method of claim 35, wherein the step of exposing comprises the steps of:
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placing the electronic device in a plasma chamber; forming a continuous plasma in the plasma chamber in the presence of the compound to form a vaporized compound; and contacting the vaporized compound with the surface of the electronic device, thereby forming the polymeric coating thereon.
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52. A method of coating a surface of an electronic device, comprising:
exposing the surface of the electronic device to a plasma to form a polymeric coating comprising a polymer selected from a group consisting of; - View Dependent Claims (53, 54, 55, 56, 57)
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58. An electronic device having an oil and water repellant coating, formed by exposing a surface of the electronic device to a plasma comprising a compound with the following chemical formula:
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CH2═
C(R1)—
COO—
R2where R1 includes —
H or —
CH3, R2 includes —
(CH2)2—
(CF2)m—
CF3, and m is 3 or 5, so as to form the coating on the surface, the coating having an oleophobicity level of at least 5.- View Dependent Claims (59, 60, 61, 62, 63, 64, 65, 66)
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65. The electronic device of claim 58, wherein the polymeric coating has a water contact angle of at least 100°
- .
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66. The electronic device of claim 58, wherein the polymeric coating has a water contact angle of at least 110°
- .
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67. An electronic device having a water repellant coating, formed by exposing a surface of the electronic device to a plasma comprising a compound with the following chemical formula:
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CH2═
C(R1)—
COO—
R2where R1 includes —
H or —
CH3, R2 includes —
(CH2)2—
(CF2)m—
CF3, and m is 3 or 5, so as to form the coating on the surface, the coating having a low toxicity level with a perfluorooctane sulfonate (PFOS) level of less than 0.2 parts per billion (ppb).
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68. An electronic device having a water repellant coating, formed by exposing a surface of the electronic device to a plasma comprising a compound with the following chemical formula:
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CH2═
C(R1)—
COO—
R2where R1 includes —
H or —
CH3;
R2 includes —
(CH2)2—
(CF2)m—
CF3, and m is 3 or 5, so as to form the coating on the surface, the coating having a low toxicity level with a perfluorooctanoic acid (PFOA) level of less than 0.1 parts per billion (ppb).
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69. An electronic device having an oil and water repellant coating, the coating comprising a polymer selected from a group consisting of:
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70. An electronic device having a water repellant coating, the coating comprising a polymer selected from a group consisting of:
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71. An electronic device having a water repellant coating, the coating comprising a polymer selected from a group consisting of:
Specification