Modular Heating and/or Cooling System with a Vertical Manifold and Method of Making Same

• US 20120298226A1
• Filed: 03/26/2012
• Published: 11/29/2012
• Est. Priority Date: 03/24/2011
• Status: Abandoned Application

• Current Assignee: Jake Jared Struempler
• Original Assignee: Jake Jared Struempler
• Inventors: Struempler, Jake Jared
• Application Number:
  US13/430,559
• Publication Number:
  US 20120298226A1
• Time in Patent Office: Days
• US Class Current: 137/561.A
• CPC Class Codes: F24D 3/1066 Distributors for heating liquids
• CPC Class Codes: F24F 3/06 characterised by the arrangements for the supply of heat-exchange fluid for the subsequent treatment of primary air in the room units
• CPC Class Codes: Y10T 137/85938 Non-valved flow dividers

Abstract

A heating/cooling manifold is presented. The manifold includes a first segment configured to vertical mount to a surface. The first segment comprises a first end and a second end, each comprising a coupling configured to releasably attach to a second segment; and between 2 and 4 ports disposed along the length of the first segment. The spacing between adjacent ports is less than 4 times an interior diameter of the first segment. The manifold further includes a second segment releasably attached to the first segment.

Claims

1. A manifold, comprising:

a first segment configured to vertical mount to a surface, wherein said first segment comprises;

a first end and a second end, each comprising a coupling configured to releasably attach to a second segment; and

between 2 and 4 ports disposed along the length of the first segment, wherein the spacing between adjacent ports is less than 4 times an interior diameter of the first segment; and

a second segment releasably attached to the first segment.