METHOD FOR FORMING PATTERNED CONDUCTIVE FILM

• US 20120298402A1
• Filed: 01/26/2011
• Published: 11/29/2012
• Est. Priority Date: 01/28/2010
• Status: Active Grant

• Current Assignee: Japan Science And Technology Agency, JSR Corporation
• Original Assignee: Japan Science And Technology Agency, JSR Corporation
• Inventors: Shimoda, Tatsuya, Matsuki, Yasuo, Shen, Zhongrong
• Granted Patent: US 8,828,555 B2
• Time in Patent Office: Days
• US Class Current: 174/126.2
• CPC Class Codes: C23C 18/06 Coating on selected surface areas, e.g. using masks
• CPC Class Codes: C23C 18/08 characterised by the deposition of metallic material
• CPC Class Codes: C23C 18/10 Deposition of aluminium only
• CPC Class Codes: C23C 18/1603 coating on selected surface areas
• CPC Class Codes: C23C 18/42 Coating with noble metals
• CPC Class Codes: C23C 22/73 characterised by the process
• CPC Class Codes: H05K 2203/0709 Catalytic ink or adhesive for electroless plating
• CPC Class Codes: H05K 2203/1105 Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
• CPC Class Codes: H05K 3/182 characterised by the patterning method
• CPC Class Codes: Y10T 428/12028 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
• CPC Class Codes: Y10T 428/12493 Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
• CPC Class Codes: Y10T 428/1275 Next to Group VIII or IB metal-base component
• CPC Class Codes: Y10T 428/24917 including metal layer

Abstract

The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C.

According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.

Claims

1. A method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120°

C.

2. The method for forming a patterned conductive film according to claim 1, wherein the platinum microcrystal particles have an average particle diameter of 15 nm or less.

3. The method for forming a patterned conductive film according to claim 1, wherein the platinum microcrystal particles are crystalline platinum cubes obtained by bringing a platinum complex compound,

an acid,

a primary alcohol having 2 to 12 carbon atoms, and a hydrophilic polymer, into contact with each other in a polar solvent.

4. A patterned conductive film characterized by being formed by the method for forming a patterned conductive film according to any one of claims 1 to 3.

5. The patterned conductive film according to claim 4, wherein the conductive film is a two-layered film comprising:

a first layer made of platinum microcrystal particles formed on a substrate, and

a second layer made of aluminum formed on the first layer.