POWER ELECTRONICS INTERCONNECTION FOR ELECTRIC MOTOR DRIVES

• US 20120305283A1
• Filed: 05/31/2011
• Published: 12/06/2012
• Est. Priority Date: 05/31/2011
• Status: Active Grant

• Current Assignee: Tesla Inc.
• Original Assignee: Tesla Motors Incorporated (Tesla Inc.)
• Inventors: Kalayjian, Nicholas Robert, Dettmann, Benjamin David, Kubba, Michael Raj, Ferguson, Joshua Willard, Kroeze, Ryan Carter, Chi, William Thomas
• Granted Patent: US 8,686,288 B2
• Time in Patent Office: Days
• US Class Current: 174/68.2
• CPC Class Codes: H01B 13/0036 Details
• CPC Class Codes: H01G 9/26 Structural combinations of electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices with each other
• CPC Class Codes: H02G 5/00 Installations of bus-bars
• CPC Class Codes: H02G 5/005 Laminated bus-bars
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14329 specially adapted for the configuration of power bus bars
• CPC Class Codes: Y02T 10/70 Energy storage systems for electromobility, e.g. batteries
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49174 Assembling terminal to elongated conductor
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

The bus bar includes a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor; a first dielectric layer overlying a top surface of the first bus bar layer; and a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of the first dielectric layer and the top surface of the first bus bar layer wherein: the first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of the electrical component and wherein: the first dielectric layer and the second bus bar layer each include a via aligned with the first via wherein the first electrical lead is extendable from beneath the first bus bar layer through the first dielectric layer and through the second bus bar layer.

Claims

1. A bus bar, comprising:

a first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor;

a first dielectric layer overlying a top surface of said first bus bar layer; and

a second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer wherein;

said first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of said electrical component and wherein;

said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer.

2. The bus bar of claim 1 wherein a first portion of said first bus bar layer includes said second via and wherein said second bus bar layer does not overlay said first portion of said first bus bar layer.

3. The bus bar of claim 1 wherein said via of said second bus bar layer includes a first electrical communication tab formed from said second bus bar layer and interacting with said first electrical lead when it extends into said via of said second bus bar layer.

4. The bus bar of claim 3 wherein said first tab includes a first tab portion extending generally parallel to a longitudinal axis of a portion of said first electrical lead extending through said via of said second bus bar layer.

5. The bus bar of claim 4 wherein said first tab portion extends above a surface of said second bus bar layer away from said first bus bar layer.

6. The bus bar of claim 3 wherein said first tab includes a first structure to guide said first electrical lead within said via of said second bus bar layer as said first electrical lead enters into said via of said second bus bar layer.

7. The bus bar of claim 6 wherein said first structure includes said first tab portion extending from a periphery of said via of said second bus bar layer towards a center of said via of said second bus bar layer.

8. The bus bar of claim 7 wherein said first tab includes a second tab portion starting at a second point on said periphery and extending towards said center.

9. The bus bar of claim 6 wherein said via of said first bus bar layer includes a second structure to guide said first electrical lead within said via of said first bus bar layer as said first electrical lead enters into said via of said first bus bar layer.

10. The bus bar of claim 2 wherein said via of said second bus bar layer includes a first electrical communication tab formed from said second bus bar layer and interacting with said first electrical lead when it extends into said via of said second bus bar layer.

11. The bus bar of claim 10 wherein said second via of said first bus bar layer includes a second electrical communication tab formed from said first bus bar layer and interacting with said second electrical lead when it extends into said second via of said first bus bar layer.

12. The bus bar of claim 11 wherein each said tab includes a first tab portion extending generally parallel to a longitudinal axis of a portion of said respective electrical lead extending therethrough.

13. The bus bar of claim 12 wherein each said first tab portion extends above a surface of said respective bus bar layer.

14. The bus bar of claim 11 wherein each said tab includes a first structure to guide said respective electrical lead within said respective via of said respective bus bar layer as said respective electrical lead enters into said respective via.

15. The bus bar of claim 14 wherein each said first structure includes said first tab portion extending from a periphery of said respective via towards a center of said respective via.

16. The bus bar of claim 15 wherein each said first tab includes a second tab portion starting at a second point on said respective periphery and extending towards said respective center.

17. The bus bar of claim 14 wherein said via of said first bus bar layer includes a third structure to guide said first electrical lead within said first via of said first bus bar layer as said first electrical lead enters into said first via of said first bus bar layer.

18. The bus bar of claim 1 further comprising an electrical component coupled to a surface of said first bus bar layer not coupled to said dielectric layer and including said first lead extending through said vias of said first and second bus bar layers and including said second lead extending through said second via of said first bus bar layer.

19. The bus bar of claim 1 wherein said second bus bar layer includes a first plurality of electrically conductive mounting tabs formed from said second bus bar layer and extending generally perpendicular to said second bus bar layer and extending away from said first bus bar layer and wherein said first bus bar layer includes a second plurality of electrically conductive mounting tabs formed from said first bus bar layer and extending generally perpendicular to said first bus bar layer and through apertures in said dielectric layer and said second bus bar layer with said first and second plurality of mounting tabs extending about an equal distance from a top surface of said second bus bar layer.

20. The bus bar of claim 19 wherein said mounting tabs each include a mounting slot extending generally perpendicular to said second bus bar layer.

21. The bus bar of claim 20 wherein each said mounting slot is sized for receiving a plurality of connection studs of a DC-Link capacitor used in a high-power converter, with said mounting tabs mechanically and electrically supporting said DC-Link capacitor when mounted into said mounting slots using said plurality of connection studs wherein said DC-Link capacitor includes said first plurality of connection studs having a first polarity coupled to said first plurality of mounting tabs and said second plurality of connection studs having a second polarity coupled to said second plurality of mounting tabs.

22. The bus bar of claim 21 further comprising a DC-Link capacitor including said first plurality of connection studs and said second plurality of connection studs with said first plurality of connection studs mechanically secured to and electrically communicated to said first plurality of mounting tabs and said second plurality of connection studs mechanically secured to and electrically communicated to said second plurality of mounting tabs and further comprising an electrical component coupled to a surface of said first bus bar layer not coupled to said dielectric layer and including said first lead extending through said vias of said first and second bus bar layers and including said second lead extending through said second via of said first bus bar layer wherein said first electrical lead is electrically fused to said via of said second bus bar layer and wherein said second electrical lead is electrically fused to said second via of said first bus bar layer wherein said first electrical lead is coupled by said second bus bar layer to said first plurality of connection studs and wherein said second electrical lead is coupled by said first bus bar layer to said second plurality of connection studs.

23. The bus bar of claim 22 further comprising a first plurality of connection couplers engaged with said first plurality of connection studs and a second plurality of connection couplers engaged with said second plurality of connection studs when said DC-Link capacitor is unmounted from said pluralities of mounting tabs and wherein said pluralities of connection couplers are biased away from a body of said DC-Link capacitor by a biasing structure to maintain an installation distance between said connection couplers and said body sufficient to permit said DC-Link capacitor to be mounted into said mounting tabs with said connection couplers installed and without interference of said connection couplers with said mounting tabs when said DC-Link capacitor is installed.

24. The bus bar of claim 23 wherein said biasing structure includes a pair of wave springs, a first wave spring coupled to said first plurality of connection studs and a second wave spring coupled to said second plurality of connection studs.

25. The bus bar of claim 1 further comprising:

a second dielectric layer overlying said second bus bar layer; and

a printed circuit board assembly (PCBA) overlying said second dielectric layer;

wherein said second dielectric layer and said PCBA each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said dielectric layers, through said second bus bar layer and into and through said PCBA.

26. The bus bar of claim 25 wherein said PCBA includes a bus bar connection via and further comprising a bus bar layer connection tab formed from a portion of one of said bus bar layers with said connection tab engaging said bus bar connection via when said PCBA overlies said bus bar layers.

27. The bus bar of claim 2 further comprising:

a second dielectric layer overlying said second bus bar layer; and

a printed circuit board assembly (PCBA) overlying said dielectric layers and said first portion of said first bus bar layer;

wherein said second dielectric layer and said PCBA each include a first via aligned with said first via of said first bus bar layer wherein said first electrical lead is extendable from beneath said first bus bar layer through said dielectric layers, said second bus bar layer, and said PCBA and wherein said PCBA includes a second via aligned with said second via of said first bus bar layer wherein said second electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and said PCBA.

28. The bus bar of claim 27 wherein said PCBA includes a bus bar connection via and further comprising a bus bar layer connection tab formed from a portion of one of said bus bar layers with said connection tab engaging said bus bar connection via when said PCBA overlies said bus bar layers.

29. The bus bar of claim 1 wherein said first bus bar layer includes a generally planar connector portion extending outwardly from said first bus bar layer and wherein said second bus bar layer includes a generally planar connector portion extending outwardly from said second bus bar layer and generally matching and parallelly overlying said connector portion of said first bus bar layer and wherein said connector portions include a connector dielectric disposed therebetween with a bottom surface of said connector portion of said first bus bar layer and a top surface of said connector portion of said second bus bar layer free from an insulating layer.

30. The bus bar of claim 29 further comprising a connector coupled to said connector portions, said connector having a first low inductance planar coupler with an uninsulated bottom surface and an insulating dielectric disposed on a top surface and having a second low inductance planar coupler with an uninsulated top surface and an insulating dielectric disposed on a bottom surface wherein said uninsulated bottom surface of said first coupler engages said top surface of said connector portion of said second bus bar layer and said uninsulated top surface of said second coupler engages said bottom surface of said connector portion of said first bus bar layer;

and

a maintainer holding said couplers engaged with said connector portions.

31. The bus bar of claim 30 wherein said maintainer includes a high contact pressure clip squeezing said couplers together with said connector portions therebetween.

32. The bus bar of claim 1 wherein said second bus bar layer includes a first plurality of electrically conductive mounting tabs extending generally perpendicular to said second bus bar layer and extending away from said first bus bar layer and wherein said first bus bar layer includes a second plurality of electrically conductive mounting tabs extending generally perpendicular to said first bus bar layer and through apertures in said dielectric layer and said second bus bar layer with said first and second plurality of mounting tabs extending about an equal distance from a top surface of said second bus bar layer.

33. A method, the method comprising the steps of:

a) forming a first bus bar layer into a desired three-dimensional form factor, said first bus bar layer formed of a first generally uniform thickness of a first bus bar conductor;

b) overlying a first dielectric layer over a top surface of said first bus bar layer; and

c) forming a second bus bar layer conforming to said desired three-dimensional form factor, said second bus bar layer formed of a second generally uniform thickness of a second bus bar conductor overlying a top surface of said first dielectric layer and said top surface of said first bus bar layer wherein;

said first bus bar layer includes a first via for receipt of a first electrical lead of an electrical component and a second via for receipt of a second electrical lead of said electrical component and wherein;

said first dielectric layer and said second bus bar layer each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and through said second bus bar layer.

34. The method of claim 33 wherein a first portion of said first bus bar layer includes said second via and wherein said second bus bar layer does not overlay said first portion of said first bus bar layer.

35. The method of claim 33 further comprising the steps of:

d) forming, at said via of said second bus bar layer, a first electrical communication tab from said second bus bar layer; and

e) interacting with said first electrical lead, using said first electrical communication tab, when said first electrical lead extends into said via of said second bus bar layer.

36. The method of claim 35 further comprising the step of:

f) extending a first tab portion of said first tab generally parallel to a longitudinal axis of a portion of said first electrical lead extending through said via of said second bus bar layer.

37. The method of claim 36 wherein said first tab portion extends above a surface of said second bus bar layer away from said first bus bar layer.

38. The method of claim 35 further comprising the step of:

f) guiding, using a first structure of said first tab, said first electrical lead within said via of said second bus bar layer as said first electrical lead enters into said via of said second bus bar layer.

39. The method of claim 38 further comprising the step of:

g) extending said first tab portion from a periphery of said via of said second bus bar layer towards a center of said via of said second bus bar layer.

40. The method of claim 39 wherein said first tab includes a second tab portion starting at a second point on said periphery and step g) further includes extending said second tab portion from said periphery towards said center.

41. The method of claim 38 further comprising the step of:

g) guiding, using a second structure of said first via of said first bus bar layer, said first electrical lead within said first via of said first bus bar layer as said first electrical lead enters into said first via before said first electrical lead extends into said via of said second bus bar layer.

42. The method of claim 34 further comprising the steps of:

d) forming, at said via of said second bus bar layer, a first electrical communication tab from said second bus bar layer; and

e) interacting with said first electrical lead, using said first electrical communication tab, when said first electrical lead extends into said via of said second bus bar layer.

43. The method of claim 42 further comprising the steps of:

f) forming, at said second via of said first bus bar layer, a second electrical communication tab from said first bus bar layer; and

g) interacting with said second electrical lead, using said second electrical communication tab, when said second electrical lead extends into said via of said second bus bar layer.

44. The method of claim 43 wherein each said tab includes a first tab portion extending generally parallel to a longitudinal axis of a portion of said respective electrical lead extending therethrough.

45. The method of claim 44 wherein each said first tab portion extends above a surface of said respective bus bar layer.

46. The method of claim 43 further comprising the step of:

f) guiding, using a first structure of each said first tab, said respective electrical lead within said respective via of said respective bus bar layer as said respective electrical lead enters into said respective via.

47. The method of claim 46 further comprising the step of:

g) extending each said first structure of each said first tab from a periphery of said respective via towards a center of said respective via.

48. The method of claim 47 wherein each said first tab includes a second tab portion starting at a second point on said respective periphery and wherein said step g) further comprises:

g1) extending each said second tab portion from said respective periphery towards said respective center.

49. The method of claim 46 wherein said via of said first bus bar layer includes a third structure to guide said first electrical lead within said first via of said first bus bar layer as said first electrical lead enters into said first via of said first bus bar layer.

50. The method of claim 33 further comprising the steps of:

d) coupling an electrical component to a surface of said first bus bar layer opposite a surface coupled to said dielectric layer;

e) extending said first lead through both said first via of said first bus bar layer and said via of said second bus bar layer; and

f) extending said second lead through said second via of said first bus bar layer.

51. The method of claim 33 further comprising the steps of:

d) forming a first plurality of electrically conductive mounting tabs from said second bus bar layer with said first plurality of tabs extending generally perpendicular to said second bus bar layer and extending away from said first bus bar layer; and

e) forming a second plurality of electrically conductive mounting tabs from said first bus bar layer with said second plurality of tabs extending generally perpendicular to said first bus bar layer and extending through a second plurality of apertures in both said dielectric layer and said second bus bar layer;

wherein said first and second plurality of mounting tabs extending about an equal distance away from a top surface of said second bus bar layer.

52. The method of claim 51 wherein said mounting tabs each include a mounting slot extending generally perpendicular to said second bus bar layer.

53. The method of claim 52 wherein each said mounting slot is sized for receiving a plurality of connection studs of a DC-Link capacitor used in a high-power converter, with said mounting tabs mechanically and electrically supporting said DC-Link capacitor when mounted into said mounting slots using said plurality of connection studs;

wherein the method further comprises the steps of;

f) mounting a first plurality of connection studs of said DC-Link capacitor having a first polarity to said first plurality of mounting tabs; and

g) mounting a second plurality of connection studs of said DC-Link capacitor having a second polarity to said second plurality of mounting tabs.

54. The method of claim 53 further comprising the steps of:

h) coupling an electrical component to a surface of said first bus bar layer opposite a surface coupled to said dielectric layer;

i) extending said first lead through both said first via of said first bus bar layer and said via of said second bus bar layer; and

j) extending said second lead through said second via of said first bus bar layer.

55. The method of claim 53 further comprising the steps of:

h) engaging, when said DC-Link capacitor is unmounted from said pluralities of mounting tabs, a first plurality of connection couplers with said first plurality of connection studs and a second plurality of connection couplers with said second plurality of connection studs; and

i) biasing said pluralities of connection couplers away from a body of said DC-Link capacitor to maintain an installation distance between said connection couplers and said body sufficient to permit said DC-Link capacitor to be mounted into said mounting tabs with said connection couplers installed without interference between said connection couplers and said mounting tabs.

56. The method of claim 55 wherein said biasing step i) uses a biasing structure and wherein said biasing structure includes a pair of wave springs, a first wave spring coupled to said first plurality of connection studs and a second wave spring coupled to said second plurality of connection studs.

57. The method of claim 33 further comprising:

d) overlying a second dielectric layer over said second bus bar layer; and

e) overlying a printed circuit board assembly (PCBA) over said second dielectric layer;

wherein said second dielectric layer and said PCBA each include a via aligned with said first via wherein said first electrical lead is extendable from beneath said first bus bar layer through said dielectric layers, said second bus bar layer, and through said PCBA.

58. The method of claim 57 wherein said PCBA includes a bus bar connection via and the method further comprises the steps of:

f) forming a bus bar layer connection tab from a portion of one of said bus bar layers; and

g) communicating electrically said connection tab with said bus bar connection via when said PCBA overlies said second dielectric layer.

59. The method of claim 34 further comprising:

d) overlying a second dielectric layer over said second bus bar layer; and

e) overlying a printed circuit board assembly (PCBA) over said dielectric layers and overlying said first portion of said first bus bar layer;

wherein said second dielectric layer and said PCBA each include a first via aligned with said first via of said first bus bar layer wherein said first electrical lead is extendable from beneath said first bus bar layer through said dielectric layers, said second bus bar layer, and through said PCBA; and

wherein said PCBA includes a second via aligned with said second via of said first bus bar layer wherein said second electrical lead is extendable from beneath said first bus bar layer through said first dielectric layer and said PCBA.

60. The method of claim 59 wherein said PCBA includes a bus bar connection via and the method further comprises the steps of:

f) forming a bus bar layer connection tab from a portion of one of said bus bar layers; and

g) communicating electrically said connection tab with said bus bar connection via when said PCBA overlies said dielectric layers.

61. The method of claim 33 wherein said forming step a) further includes:

a1) forming said first bus bar layer with a generally planar first connector portion extending outwardly from said first bus bar layer; and

wherein said forming step c) further includes;

c1) forming said second bus bar layer with a generally planar second connector portion extending outwardly from said second bus bar layer and generally matching and parallelly overlying said connector portion of said first bus bar layer; and

further comprising the step of;

d) electrically insulating said connector portions from each other while electrically exposing both a bottom surface of said first connector portion and a top surface of said second connector portion.

62. The method of claim 61 further comprising the steps of:

e) coupling electrically a connector to both said exposed surfaces of said connector portions, said connector having a pair of low inductance planar coupling surfaces sandwiching said connector portions; and

f) maintaining said connector portions sandwiched between said coupling surfaces.

63. The method of claim 62 wherein said maintaining step f) includes the steps of:

f1) squeezing said connector portions between said coupling surfaces using a high contact pressure clip.

64. The method of claim 33 further comprising the steps of:

d) attaching a first plurality of electrically conductive mounting tabs to said second bus bar layer with said first plurality of tabs extending generally perpendicular to said second bus bar layer and extending away from said first bus bar layer; and

e) attaching a second plurality of electrically conductive mounting tabs to said first bus bar layer with said second plurality of tabs extending generally perpendicular to said first bus bar layer and extending through a second plurality of apertures in both said dielectric layer and said second bus bar layer;

wherein said first and second plurality of mounting tabs extending about an equal distance away from a top surface of said second bus bar layer.