Flip Chip Type Light Emitting Diode and Manufacturing Method Thereof
First Claim
1. A light emitting diode (LED), comprising:
- a substrate that comprises;
a body having a first surface and a second surface opposite to the first surface;
a plurality of third pads disposed on the first surface;
a fourth pad disposed on the first surface;
a first electrode disposed on the second surface;
a second electrode disposed on the second surface;
a plurality of first vias traversing through the body and electrically coupling the third pads and the first electrode;
a second via traversing through the body and electrically coupling the fourth pad and the second electrode; and
a plurality of third vias; and
an LED chip that is flip-chip bonded to the substrate, the LED chip comprising;
a transparent substrate;
a first type semiconductor layer disposed on the transparent substrate;
an active semiconductor layer disposed on the first type semiconductor layer;
a second type semiconductor layer disposed on the active semiconductor layer;
a first pad disposed on the second type semiconductor layer and electrically coupled to the third pads; and
a second pad disposed on the second type semiconductor layer and electrically coupled to the fourth pad;
wherein the plurality of third vias traverse through the second type semiconductor layer and the active semiconductor layer, and wherein the plurality of third vias electrically couple the first pad and the first type semiconductor layer.
1 Assignment
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Accused Products
Abstract
The present disclosure provides a flip chip type light emitting diode which comprises a substrate and a light emitting diode chip. The substrate comprises a body, a plurality of third pads, a fourth pad, a first electrode, a second electrode, a plurality of first vias, and a second via. The body has a first surface and a second surface opposite to the first surface. The third pads and the fourth pad are disposed on the first surface of the body. The first electrode and the second electrode are disposed on the second surface of the body. The first vias traverse through the body and are each electrically coupled to a respective one of the third pads and the first electrode. The second via traverses through the body and is electrically coupled to the fourth pad and the second electrode.
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Citations
40 Claims
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1. A light emitting diode (LED), comprising:
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a substrate that comprises; a body having a first surface and a second surface opposite to the first surface; a plurality of third pads disposed on the first surface; a fourth pad disposed on the first surface; a first electrode disposed on the second surface; a second electrode disposed on the second surface; a plurality of first vias traversing through the body and electrically coupling the third pads and the first electrode; a second via traversing through the body and electrically coupling the fourth pad and the second electrode; and a plurality of third vias; and an LED chip that is flip-chip bonded to the substrate, the LED chip comprising; a transparent substrate; a first type semiconductor layer disposed on the transparent substrate; an active semiconductor layer disposed on the first type semiconductor layer; a second type semiconductor layer disposed on the active semiconductor layer; a first pad disposed on the second type semiconductor layer and electrically coupled to the third pads; and a second pad disposed on the second type semiconductor layer and electrically coupled to the fourth pad; wherein the plurality of third vias traverse through the second type semiconductor layer and the active semiconductor layer, and wherein the plurality of third vias electrically couple the first pad and the first type semiconductor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A light emitting diode (LED), comprising:
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a substrate that comprises a body having a first surface and a second surface opposite to the first surface; a transparent substrate; a first type semiconductor layer disposed on the transparent substrate; an active semiconductor layer disposed on the first type semiconductor layer; a second type semiconductor layer disposed on the active semiconductor layer; a plurality of first vias traversing through the body of the substrate, the second type semiconductor layer, and the active semiconductor layer; and a second via traversing through the body of the substrate. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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24. A method of manufacturing a light emitting diode (LED), the method comprising:
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providing a substrate that comprises; a body having a first surface and a second surface opposite to the first surface; a plurality of third pads disposed on the first surface; a fourth pad disposed on the first surface; a first electrode disposed on the second surface; a second electrode disposed on the second surface; a plurality of first vias traversing through the body, each of the first vias electrically coupling a respective one of the third pads and the first electrode; a second via traversing through the body and electrically coupling the fourth pad and the second electrode; and a plurality of third vias; providing an LED chip that comprises; a transparent substrate; a first type semiconductor layer disposed on the transparent substrate; an active semiconductor layer disposed on the first type semiconductor layer; a second type semiconductor layer disposed on the active semiconductor layer; a first pad disposed on the second type semiconductor layer; and a second pad disposed on the second type semiconductor layer, wherein the plurality of third vias traverse through the second type semiconductor layer and the active semiconductor layer;
wherein the plurality of third vias electrically couple the first pad and the first type semiconductor layer; andbonding the substrate and the LED chip such that the first pad and the second pad are electrically coupled to the third pads and the fourth pad, respectively. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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35. A method of manufacturing a light emitting diode (LED), the method comprising:
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providing a transparent substrate; forming a first type semiconductor layer on the transparent substrate; forming an active semiconductor layer on the first type semiconductor substrate; forming a second type semiconductor layer on the active semiconductor substrate; providing a substrate that comprises a body having a first surface and a second surface opposite to the first surface; forming a plurality of first vias that traverse through the body of the substrate, the second type semiconductor layer, and the active semiconductor layer; and forming a second via that traverses through the body of the substrate. - View Dependent Claims (36, 37, 38, 39, 40)
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Specification