ORGANIC LIGHT EMITTING DIODE DISPLAY AND METHOD FOR MANUFACTURING ORGANIC LIGHT EMITTING DIODE DISPLAY

• US 20120305981A1
• Filed: 11/18/2011
• Published: 12/06/2012
• Est. Priority Date: 06/01/2011
• Status: Active Grant

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Samsung Mobile Display Company Limited (Samsung Electronics Co. Ltd.)
• Inventors: Park, Yong-Hwan, Seo, Sang-Joon, Lee, Jae-Seob, Kim, Seung-Hun, Kim, Jin-Kwang
• Granted Patent: US 8,987,043 B2
• Time in Patent Office: Days
• US Class Current: 257/100
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 50/8426 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 59/1201 Manufacture or treatment
• CPC Class Codes: H10K 59/8722 Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/873 Encapsulations
• CPC Class Codes: H10K 71/80 using temporary substrates

Abstract

A method of manufacturing an OLED display includes: forming an organic light emitting element on a first substrate; forming, on the organic light emitting element, a thin film encapsulation layer that seals the organic light emitting element with the first substrate; providing a second substrate; forming a flexible protection layer on the second substrate; attaching the first substrate and the second substrate to each other; and separating the second substrate from the flexible protection layer.

Claims

1. A method of manufacturing an organic light emitting diode (OLED) display, the method comprising:

forming an organic light emitting element on a first substrate;

forming, on the organic light emitting element, a thin film encapsulation layer that seals the organic light emitting element with the first substrate;

providing a second substrate;

forming a flexible protection layer on the second substrate;

attaching the first substrate and the second substrate to each other; and

separating the second substrate from the flexible protection layer.

2. The method of manufacturing of claim 1, wherein the flexible protection layer comprises resin.

3. The method of manufacturing of claim 1, wherein forming the flexible protection layer on the second substrate comprises forming a sacrificial layer between the second substrate and the flexible protection layer, and wherein separating the second substrate from the flexible protection layer comprises removing the sacrificial layer.

4. The method of manufacturing of claim 1, further comprising forming the first substrate on a mother board and separating the mother board from the first substrate, wherein the first substrate comprises flexible resin.

5. The method of manufacturing of claim 1, wherein the thin film encapsulation layer comprises a single-layered inorganic layer.

6. An organic light emitting diode (OLED) display manufactured by the method of manufacturing of claim 1.

7. The OLED display of claim 6, wherein the flexible protection layer has a thickness in a range between about 1 um to about 100 um.