GRID FOR RADIATION IMAGING AND METHOD FOR PRODUCING THE SAME
First Claim
Patent Images
1. A grid for radiation imaging comprising:
- a plurality of radiation absorbing sections extending in an extending direction;
a plurality of radiation transmitting sections extending in the extending direction, the radiation absorbing sections and the radiation transmitting sections being alternately arranged in an arranging direction orthogonal to the extending direction; and
a plurality of transmitting-section bridging portions for coupling the radiation transmitting sections.
1 Assignment
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Accused Products
Abstract
A conductive substrate (18) and an etching substrate (20) are bonded to each other. An etch mask (25) is formed on the etching substrate (20) using a photolithography technique. On the etching substrate (20), grooves (20a) and X-ray transmitting sections (14b) are formed by dry etching using Bosch process. The grooves (20a) are filled with Au (27) by an electroplating method using the conductive substrate (18) as an electrode. Thus, X-ray absorbing sections (14a) are formed.
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Citations
70 Claims
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1. A grid for radiation imaging comprising:
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a plurality of radiation absorbing sections extending in an extending direction; a plurality of radiation transmitting sections extending in the extending direction, the radiation absorbing sections and the radiation transmitting sections being alternately arranged in an arranging direction orthogonal to the extending direction; and a plurality of transmitting-section bridging portions for coupling the radiation transmitting sections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 32, 33, 34)
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17. A grid for radiation imaging comprising:
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a radiation absorbing section for absorbing radiation; and a radiation transmitting section made of a semiconductor of one conductivity type doped with an impurity. - View Dependent Claims (18, 19, 20, 30, 31)
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21. A grid for radiation imaging comprising:
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a semiconductor substrate of one conductivity type doped with an impurity; and a radiation absorbing section provided on the semiconductor substrate. - View Dependent Claims (22)
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23. A grid for radiation imaging comprising:
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a grid layer having a radiation absorbing section and a radiation transmitting section; a support layer bonded to the grid layer; and a plurality of depression portions provided on at least one of bonding surfaces of the grid layer and the support layer. - View Dependent Claims (24, 25)
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26. A grid for radiation imaging comprising:
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a radiation absorbing section for absorbing radiation; a radiation transmitting section for passing the radiation; and an anchor layer having a rough supporting surface for supporting the radiation absorbing section and the radiation transmitting section.
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27. A grid for radiation imaging comprising:
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a grid layer having a radiation absorbing section and a radiation transmitting section; and a support layer for supporting the grid layer, the grid layer and the support layer being bonded to a curved surface provided on a radiation-transmissive holding member and bent. - View Dependent Claims (28, 29)
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35. A method for producing a grid for radiation imaging comprising the steps of:
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bonding a radiation-transmissive first substrate and an electrically conductive and radiation-transmissive second substrate; etching the first substrate through an etch mask to form grooves and a plurality of radiation transmitting sections disposed between the grooves; and plating the grooves by filling of a radiation absorbing material to form a plurality of radiation absorbing sections by an electroplating method using the second substrate as an electrode. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70)
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Specification