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Semiconductor Component and Method for Producing a Semiconductor Component

  • US 20120309147A1
  • Filed: 08/14/2012
  • Published: 12/06/2012
  • Est. Priority Date: 12/22/2009
  • Status: Active Grant
First Claim
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1. A method for producing a semiconductor component, the method comprising:

  • forming a trench in a semiconductor region, the trench having an upper trench region and a lower trench region, the upper trench region being wider than the lower trench region such that a step is formed in the semiconductor region; and

    introducing a dopant into the step to form a locally delimited dopant region in the semiconductor region.

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