LIGHT EMITTER DEVICE PACKAGES, MODULES AND METHODS

• US 20120313115A1
• Filed: 02/07/2012
• Published: 12/13/2012
• Est. Priority Date: 02/07/2011
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Joo, Sung Chul, Hussell, Christopher P.
• Granted Patent: US 9,583,681 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

Light emitter device packages, modules and methods are disclosed having a body and a cavity that can be formed from a single substrate of material. The material can be thermally conductive and/or metallic. A light emitter device package can have at least one isolating layer creating at least a first isolated portion of the body and/or first isolated portion of the cavity. The isolating layer can be formed from the same material as the single substrate which forms the package body and cavity, and can be a layer which is thermally and electrically isolated. A light emitter or light emitter device, such as an LED chip can be mounted upon a surface of the cavity and upon at least a portion of the isolating layer.

Claims

1. A light emitter device package, the package comprising:

a body having a cavity;

at least one light emitter device mounted to a surface of the cavity; and

wherein the body and the surface of the cavity upon which the at least one light emitter device is mounted are formed from a single substrate of material

2. The light emitter device package according to claim 1, wherein the at least one light emitter device comprises at least one light emitting diode (LED) chip.

3. The light emitter device package according to claim 1, wherein the single substrate of material comprises a thermally conductive material.

4. The light emitter device package according to claim 1, wherein the light emitter device package comprises at least one isolating layer.

5. The light emitter device package according to claim 4, wherein the single substrate of material comprises aluminum.

6. The light emitter device package according to claim 5, wherein the isolating layer comprises anodized aluminum.

7. The light emitter device package according to claim 2, wherein the LED chip is mounted to the surface of the cavity using flip chip bonding, and wherein the LED chip is mounted on at least a portion of an isolating layer of the cavity.

8. The light emitter device package according to claim 2, wherein the LED chip is mounted to a first portion of the surface of the cavity and the LED chip comprises a top surface which is electrically connected to a second portion of the surface of the cavity by wirebonding, wherein the first portion is thermally and electrically isolated from the second portion.

9. A light emitter device package comprising:

a body having at least one cavity, the cavity comprising an isolating layer disposed between a first isolated portion of the cavity and adjacent a second isolated portion of the cavity;

at least one light emitter device mounted on at least a portion of the isolating layer; and

wherein the first isolated portion and the second isolated portion are thermally and electrically isolated.

10. The light emitter device package according to claim 9, wherein the isolating layer is anodized aluminum.

11. The light emitter device package according to claim 9, wherein the light emitter device comprises a light emitting diode (LED) chip mounted to at least a portion of the isolating layer using flip chip bonding.

12. The light emitter device package according to claim 9, wherein the body comprises more than one cavity to form a panel array.

13. The light emitter device package according to claim 9, wherein the body and cavity are formed from a single substrate of material.

14. The light emitter device package according to claim 12, wherein the single substrate of material is a thermally conductive material.

15. The light emitter device package according to claim 12, wherein the single substrate of material is aluminum.

16. The light emitter device package according to claim 14, wherein the isolating layer comprises anodized aluminum.

17. The light emitter device package according to claim 9, wherein the at least one light emitter device is mounted on at least a portion of the first and second isolated portions of the cavity.

18. A method of forming a light emitting diode (LED) package from a single substrate of material, the method comprising:

providing the single substrate of material;

forming at least one cavity within the single substrate of material;

electrically isolating at least one portion of the cavity to form a first isolated portion; and

mounting a LED chip at least partially upon a first isolated portion of the cavity.

19. The method according to claim 18, wherein forming the body and cavity comprises a step selected from the group consisting of extruding, pressing, stamping, punching, milling, etching, and machining.

20. The method according to claim 18, wherein mounting the LED chip comprises using flip chip bonding.

21. The method according to claim 18, further comprising wirebonding a top surface of the LED chip to a second isolated portion of the body, wherein an isolating layer is disposed between the first and second isolated portions.

22. The method according to claim 21, wherein the isolating layer is thermally and electrically insulating.

23. The method according to claim 18, further comprising singulating the LED package from a panel array of LED packages.

24. The method according to claim 23, wherein singulating the LED packages comprises a step selected from the group consisting of sawing, dicing, breaking, and shearing.

25. A light emitter device package, the package comprising:

a body comprising a thermally conductive material, and the body defining a cavity;

at least one light emitter device disposed within the cavity; and

wherein the light emitter device is electrically connected to the thermally conductive material of the body.

26. The light emitter device package according to claim 25, wherein the at least one light emitter device comprises at least one light emitting diode (LED) chip.

27. The light emitter device package according to claim 26, wherein the LED chip is mounted upon a mounting surface of the body.

28. The light emitter device package according to claim 25, wherein the body and cavity are formed integrally from a single substrate of thermally conductive material.

29. The light emitter device package according to claim 25, wherein the light emitter device package further comprises at least one isolating layer disposed a first isolated portion of the cavity and a second isolated portion of the cavity.

30. The light emitter device package according to claim 29, wherein the at least one light emitter device is mounted on at least a portion of the isolating layer and at least a portion of the first and second isolated portions of the cavity.

31. The light emitter device package according to claim 30, wherein the light emitter device comprises a LED chip mounted to at least a portion of the isolating layer using flip chip bonding.

32. The light emitter device package according to claim 25, wherein the thermally conductive material comprises aluminum.