SEMICONDUCTOR APPARATUS
1 Assignment
0 Petitions
Accused Products
Abstract
The disclosure relates to integrated circuit fabrication, and more particularly to a semiconductor apparatus with a metallic alloy. An exemplary structure for an apparatus comprises a first silicon substrate; a second silicon substrate; and a contact connecting each of the first and second substrates, wherein the contact comprises a Ge layer adjacent to the first silicon substrate, a Cu layer adjacent to the second silicon substrate, and a metallic alloy between the Ge layer and Cu layer.
4 Citations
31 Claims
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1-11. -11. (canceled)
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12. A method of fabricating a semiconductor apparatus comprising:
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providing a first silicon substrate having a first contact, wherein the first contact comprises a Ge layer interposed between the substrate and an Al layer; providing a second silicon substrate having a second contact, wherein the second contact comprises a Cu layer as an outmost layer; placing the first contact in contact with the second contact; and heating the first and second contacts to form a metallic alloy, wherein the heating is performed at a temperature of about 420°
to 500°
C. and under a compressive force of about 45 to 55 kN. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of fabricating a semiconductor apparatus comprising:
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forming a first contact over a first substrate, the first contact comprising Al and Ge; forming a second contact over a second substrate, the second contact comprising a Cu-containing layer; placing the first contact in contact with the second contact; and heating the first and second contacts to form a metallic alloy structure, wherein the heating is performed in a chamber at a temperature within a range from about 420°
C. to 500°
C. - View Dependent Claims (22, 23, 24, 25, 26, 27, 28, 29)
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30. A method of fabricating a semiconductor apparatus comprising:
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forming a first contact over a first substrate, the first contact comprising an Al-containing layer and a Ge layer between the Al-containing layer and the first substrate; forming a second contact over a second substrate, the second contact comprising a Cu-containing layer; placing the first contact in contact with the second contact; and heating the first and second contacts to form a metallic alloy structure, wherein the heating is performed at a temperature within a range, and the range is greater than a eutectic temperature of the Ge layer of the first contact and less than a eutectic temperature of the Cu-containing layer of the second contact. - View Dependent Claims (31)
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Specification