×

SEMICONDUCTOR DEVICE STRUCTURES AND THE SEPARATING METHODS THEREOF

  • US 20120313249A1
  • Filed: 06/07/2012
  • Published: 12/13/2012
  • Est. Priority Date: 06/09/2011
  • Status: Active Grant
First Claim
Patent Images

1. A method of separating semiconductor device structures, comprising:

  • providing a substrate, comprising a first surface and a second surface opposite to the first surface;

    forming a plurality of semiconductor epitaxial stacks on the first surface;

    forming a patterned resist layer covering the semiconductor epitaxial stacks and exposing part of the first surface, or covering the second surface corresponding to the semiconductor epitaxial stacks;

    performing a physical etching process to directly sever the substrate apart from an area of the first surface or the second surface not covered by the patterned resist layer; and

    separating the semiconductor epitaxial stacks to form a plurality of semiconductor device structures.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×