LED LAMP AND METHOD OF MAKING THE SAME

• US 20120313518A1
• Filed: 06/13/2011
• Published: 12/13/2012
• Est. Priority Date: 06/13/2011
• Status: Active Grant

• Current Assignee: Epistar Corporation
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Sun, Chih-Hsuan, Yeh, Wei-Yu, Lin, Tien-Ming
• Granted Patent: US 8,414,160 B2
• Time in Patent Office: Days
• US Class Current: 315/32
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A lighting device includes a multi-faceted heat sink with facets in a center portion facing outward. The facets form a central enclosed portion, and the heat sink further has a plurality of fins, where each of the fins is placed between adjacent facets and protrudes outwardly from the heat sink. The lighting device also has a plurality of circuit boards with semiconductor emitters mounted thereon. Each of the circuit boards is mounted on a respective facet of the heat sink. The lighting device also has a light-diffusion housing covering the plurality of circuit boards, a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters, and a power connector assembly in electrical communication with the power module.

Claims

1. A lighting device comprising:

a multi-faceted heat sink with facets in a center portion facing outward, the facets forming a central semi-enclosed portion, the heat sink further including a plurality of fins, each of the fins placed between adjacent facets and protruding outwardly from the heat sink;

a plurality of circuit boards with semiconductor emitters mounted thereon, each of the circuit boards being mounted on a respective facet of the heat sink;

a light-diffusion housing covering the plurality of circuit boards;

a power module in communication with the circuit boards and operable to convert power to be compatible with the semiconductor emitters; and

a power connector assembly in electrical communication with the power module.

2. The lighting device of claim 1 conforming to a form factor of an A-lamp.

3. The lighting device of claim 1 in which the power connector assembly comprises an E27 fitting.

4. The lighting device of claim 1 in which the plurality of circuit boards comprise Metal Core Printed Circuit Boards (MCPCBs).

5. The lighting device of claim 1 in which each of the fins comprises two fin structures with a recess therebetween.

6. The lighting device of claim 5 in which the recess between the fin structures is exposed to ambient air and is not covered by the light-diffusion housing.

7. The lighting device of claim 1 in which a profile of the fins conforms to an A-lamp shape.

8. The lighting device of claim 1 in which the heat sink includes three facets spaced apart by 120 degrees.

9. The lighting device of claim 1 in which the central semi-enclosed portion encloses the power module.

10. The lighting device of claim 1 in which the central semi-enclosed portion has two oppositely positioned openings, a first opening at the power connector, and a second opening distal the power connector.

11. A lamp comprising:

a heat sink with a plurality of fins and facets, the facets arranged around a central axis and facing outwardly from the central axis, each of the fins placed between adjacent ones of the facets and extending outwardly from the central axis;

a plurality of circuit boards, each one of the circuit boards mounted on a respective facet, each one of the circuit boards including an array of semiconductor emitters thereon;

a light diffusing housing covering each of the facets and exposing the fins;

a power conversion module in communication with the semiconductor emitters; and

a power connector in communication with the power conversion module.

12. The lamp of claim 11 in which the plurality of facets forms an enclosed portion with two openings, where the first opening is at the power connector, and where the second opening is capped by a heat spreading structure.

13. The lamp of claim 11 in which the lamp conforms to an A-lamp shape.

14. The lamp of claim 12 in which the power conversion module receives AC power and converts the AC power to current-regulated DC power.

15. The lamp of claim 11 in which each of the circuit boards comprises a Metal Core Printed Circuit Board (MCPCB).

16. The lamp of claim 11 in which the semiconductor emitters comprise Light Emitting Diodes (LEDs).

17. The lamp of claim 11 in which each of the fins comprises a double-fin structure with each portion of the double-fin structure exposed to ambient air.

18. A method for making a lamp, the method comprising:

providing a heat sink, the heat sink comprising a plurality of fins and facets, the facets arranged around a central axis and facing outwardly from the central axis, each of the fins placed between adjacent ones of the facets and extending outwardly from the central axis;

disposing a plurality of circuit boards on the plurality of facets, each of the circuit boards including an array of semiconductor emitters;

electrically connecting the semiconductor emitters to a power conversion device;

enclosing the facets with a light diffusing housing; and

coupling a power connector to the heat sink and electrically connecting the power connector to the power conversion device.

19. The method of claim 18 in which each of the fins are exposed to ambient air.

20. The method of claim 18 in which each of the fins comprises two fin portions separated by an air gap.