INJECTION MOLDED CONTROL PANEL WITH IN-MOLDED DECORATED PLASTIC FILM

• US 20120314348A1
• Filed: 10/06/2011
• Published: 12/13/2012
• Est. Priority Date: 06/10/2011
• Status: Active Grant

• Current Assignee: E2IP Technologies Incorporated
• Original Assignee: Canyon Graphics
• Inventors: Moncrieff, Scott
• Granted Patent: US 8,804,344 B2
• Time in Patent Office: Days
• US Class Current: 361/679.01
• CPC Class Codes: B29C 2045/14532 injecting between two sheets
• CPC Class Codes: B29C 45/14467 Joining articles or parts of a single article B29C45/14377, B29C45/14385, B29C45/14581, B29C45/14614 and B29C45/006 take precedence
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: B29C 45/14688 Coating articles provided with a decoration
• CPC Class Codes: D06F 34/28 Arrangements for program selection, e.g. control panels therefor; Arrangements for indicating program parameters, e.g. the selected program or its progress
• CPC Class Codes: G02B 6/0001 specially adapted for lighting devices or systems lighting or signalling on vehicles using light guides B60Q1/00; lighting devices for vehicle dashboards B60Q3/10; lighting devices for vehicle interior using light guides B60Q3/62; lighting devices mounted on the vehicle rear part using light guides F21S43/235; measuring arrangements having light conducting pointers G01D13/265; illumination of liquid crystal displays G02F1/1336; illuminated signs G09F13/00
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 1/16 incorporating printed electric components, e.g. printed resistor, capacitor, inductor
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/10507 Involving several components
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/12 using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 3/30 Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 5/0017 with operator interface units
• CPC Class Codes: H05K 5/0243 for decorative purposes
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part

Abstract

Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.

Claims

1. A control assembly comprising:

a first film that is in-molded to the front surface of a resin core that includes decorative graphics, a front surface and a rear surface; and

a second film molded to the rear surface of the resin core having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.

2. The control assembly of claim 1, wherein the printed circuit includes at least one of capacitive touch sensors, proximity sensors, water detect sensor, functional antennas, with surface mounted electronic components such as LEDS, resistors, capacitors, transistors, programmable integrated circuits and other electronic sensors.

3. The control assembly of claim 1, further comprising a layer of resin between the first and second films.

4. The control assembly of claim 1, further comprising a plastic panel mounted on the rear surface of the second film.

5. The control assembly of claim 1, wherein the second film is further comprised of surface mounted electronic components.

6. The control assembly of claim 1, wherein the second film further comprises in-molded lighting and associated components with light guide features.

7. The control assembly of claim 1, wherein the second film further comprises a display.

8. The control assembly of claim 7, wherein the display includes a touch screen.

9. The control assembly of claim 1, wherein the first or second films comprise one or more of a flat film, a preformed film, or a film formed in the mold tool.

10. A method comprising:

printing the first film and forming, trimming and applying decorative graphics to the first film;

printing the second film and forming, trimming and placing a printed circuit frame on the second film;

mounting components to the printed circuit and programming and testing the printed circuit on the second film;

placing the first and second film together in a mold and injecting the mold with molding resin between the films; and

inspecting the finished panel and packaging and shipping the finished panel once it has been tested.

11. The method of claim 10, wherein the process used to print the first and second film and to mount the printed circuit to the second film comprises silkscreen, offset, flaxo, digital, gravure, sheet methods, roll to roll methods, and any combination of the listed.

12. The method of claim 10, wherein the process used to form the first and second film comprises hydroform, high pressure forming, thermoforming, trimming using 2D or 3D trim tools, laser cutting, digital knife methods.

13. The method of claim 10, wherein the process used to mount the printed circuit on the second film include PCB mounting methods, FPC mounting methods and adhesion.

14. The method of claim 10, wherein printing the first film and forming, trimming and applying a decorative application to the first film further comprises:

depositing a film substance, the film substance comprising plastic, wood veneer, flocked products, leather, denim, pseudo suede synthetic imitations;

depositing a decoration film substance, the decoration film substance comprising plastic, wood veneer, flocked products, leather, denim pseudo suede synthetic imitations, metal, anti-microbial materials, anti-scratch hard-coat materials, mar-resistant coated materials, and texture treatments of finishes.

15. The method of claim 10, wherein printing the second film and forming, trimming and placing a printed circuit frame on the second film further comprises:

depositing a film substance, the film substance comprising plastic, wood veneer, flocked products, leather, denim, pseudo suede synthetic imitations.

16. The method of claim 10, wherein mounting components of a printed circuit into the printed circuit frame and programming and testing the printed circuit on the second film further comprises:

(a) depositing a layer of conductive silver ink onto a substrate, the substrate comprising a polyethylene terephthalate (PET) substrate or other suitable substrate;

(b) applying dielectric bridges with the conductive silver ink if a crossover circuit is required;

(c) applying conductive silver bridges with the conductive silver ink;

(d) applying carbon resistor pads and conductor tips;

(e) printing entire circuit area except for circuit tips with a di-electric coating;

(f) printing entire circuit area except for circuit tips and the area adjacent to the tips making up a tail of a free connector with a molding binder resin;

(e) applying polydioctyl-bithiophene (PDOT) conductive polymer onto the printed substrate;

(f) repeating steps (b)-(f) with PDOT instead of conductive silver ink;

(g) printing a touchscreen; and

(h) complete printing all areas.

17. The method of claim 10, wherein mounting components of a printed circuit into the printed circuit frame and programming and testing the printed circuit on the second film further comprises:

applying conductive silver epoxy aligned to component mounting pads;

dispensing glue at every component location to insure solid bonding with the second film;

placing components either manually or using conventional automated pick-and-place robotic placement equipment; and

curing conductive epoxy and glue at a manufacturer'"'"'s recommended time and temperature if required.

18. The method of claim 10, wherein placing the first and second film together in a mold and injecting the mold with molding resin further comprises:

cutting holes in the printed circuit of the second film near the core of the first and second films; and

shooting resin through the cut holes directly into the decorative layer of the first film.

19. The method of claim 10, wherein the first and second film comprises:

in-molded decorated film, in-molded flexible film circuits, printed silver circuits, printed copper circuits, Indium Tin Oxide (ITO), and Polydioctyl-bithiophene (PDOT).

20. The method of claim 10, wherein the components to be mounted comprises:

in-mold capacitive switches, printed sensors, transparent or opaque touch-screen sensors, in-mold LED lighting, in-mold light guides to control and direct molded in LEDs, in-molded and normally printed;

resistors, OLEDs, capacitors, transistors, antennas integrated with the printed circuit board, component sensors, and camera lenses.