SUBSTRATES WITH TRANSFERABLE CHIPLETS

• US 20120314388A1
• Filed: 06/07/2012
• Published: 12/13/2012
• Est. Priority Date: 06/08/2011
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: Semprius, Inc.
• Inventors: Bower, Christopher, Carr, Joseph
• Granted Patent: US 8,934,259 B2
• Time in Patent Office: Days
• US Class Current: 361/760
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 2221/68318 Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/6834 used to protect an active side of a device or wafer
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2224/11002 for supporting the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/13013 being rectangular or square
• CPC Class Codes: H01L 2224/13017 being non uniform along the bump connector
• CPC Class Codes: H01L 2224/13018 comprising protrusions or indentations
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/13184 Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/29026 : relative to the bonding area, e.g. bond pad, of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/2919 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/75303 : of the pressing surface
• CPC Class Codes: H01L 2224/75312 : Material
• CPC Class Codes: H01L 2224/7565 : Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/7698 : specially adapted for batch processes
• CPC Class Codes: H01L 2224/81 : using a bump connector
• CPC Class Codes: H01L 2224/81005 : being a temporary or sacrificial substrate
• CPC Class Codes: H01L 2224/8114 : Guiding structures outside the body
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81201 : Compression bonding
• CPC Class Codes: H01L 2224/81203 : Thermocompression bonding, e.g. diffusion bonding, pressure joining, thermocompression welding or solid-state welding
• CPC Class Codes: H01L 2224/81395 : having an external coating, e.g. protective bond-through coating
• CPC Class Codes: H01L 2224/81411 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81901 : Pressing the bump connector against the bonding areas by means of another connector detachable pressure contact H01L2224/72
• CPC Class Codes: H01L 2224/83 : using a layer connector
• CPC Class Codes: H01L 2224/83192 : wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83855 : Hardening the adhesive by curing, i.e. thermosetting
• CPC Class Codes: H01L 2224/9211 : Parallel connecting processes
• CPC Class Codes: H01L 2224/95001 : involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95136 : involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3157 : Partial encapsulation or coating mask layer used as insulation layer H01L21/31
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/92 : Specific sequence of method steps
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/04 : the devices not having separate containers
• CPC Class Codes: H01L 25/0655 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/1205 : Capacitor
• CPC Class Codes: H01L 2924/1304 : Transistor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H05K 1/18 : Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: Y10T 156/1039 : Surface deformation only of sandwich or lamina [e.g., embossed panels]
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base

Abstract

A method for fabricating a substrate having transferable chiplets includes forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate. The intermediate substrate is brought into contact with the source substrate to adhere the active components on the process side to the patterned side of the intermediate substrate via the photo-sensitive adhesive layer therebetween. Portions of the source substrate opposite the process side thereof are removed to singulate the active components. Portions of the photo-sensitive adhesive layer are selectively exposed to electromagnetic radiation through the intermediate substrate to alter an adhesive strength thereof. Portions of the photo-sensitive adhesive layer having a weaker adhesive strength are selectively removed to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength. The breakable tethers physically secure the active components to the intermediate substrate.

Claims

1. A method of printing transferable components, the method comprising:

forming a photo-sensitive adhesive layer on a process side of a source substrate including active components or on a patterned side of a transparent intermediate substrate;

contacting the transparent intermediate substrate with the source substrate to adhere the active components on the process side to the patterned side of the transparent intermediate substrate via the photo-sensitive adhesive layer therebetween;

removing portions of the source substrate opposite the process side to singulate the active components;

selectively exposing portions of the photo-sensitive adhesive layer to electromagnetic radiation through the transparent intermediate substrate to alter an adhesive strength thereof; and

then

selectively removing portions of the photo-sensitive adhesive layer having a weaker adhesive strength to define breakable tethers comprising portions of the adhesive layer having a stronger adhesive strength, wherein the breakable tethers physically secure the active components to the transparent intermediate substrate.

2. The method of claim 1, wherein selectively exposing comprises:

forming a mask pattern on the transparent intermediate substrate; and

exposing the transparent intermediate substrate to the electromagnetic radiation,

wherein the mask pattern comprises a material configured to block transmission of the electromagnetic radiation therethrough such that the portions of the photo-sensitive adhesive layer exposed by the mask pattern are selectively exposed to the electromagnetic radiation.

3. The method of claim 2, wherein the patterned side of the transparent intermediate substrate includes a plurality of structures protruding therefrom, and wherein the mask pattern is formed on surfaces of the protruding structures.

4. The method of claim 1, wherein the tethers extend in a direction perpendicular to the transparent intermediate layer and are shaped to break in a desired manner.

5. The method of claim 1, wherein the active components have respective primary surfaces including conductive elements thereon adjacent the process side of the source substrate and respective secondary surfaces opposite the primary surfaces, and

wherein the portions of the adhesive layer defining the tethers physically connect the respective the primary surfaces of the active components to the transparent intermediate substrate.

6. The method of claim 5, further comprising:

pressing a stamp having pillars protruding therefrom against the active components on the transparent intermediate substrate and separating the stamp from the transparent intermediate substrate to break the tethers and adhere the respective secondary surfaces of the active components to respective transfer surfaces of the pillars of the stamp; and

contacting the stamp including the active components on the pillars thereof with a destination substrate to adhere the respective primary surfaces of the active components including the conductive elements thereon to a receiving surface of the destination substrate.

7. The method of claim 6, wherein the conductive elements on the respective primary surfaces of the active components are adhered to respective electrical contacts on the receiving surface of the destination substrate.

8. The method of claim 6, wherein the primary surfaces of the active components respectively include a photo-adhesive layer residue thereon comprising respective portions of the breakable tethers, wherein the residue is below respective surfaces of the conductive elements.

9. The method of claim 1, wherein selectively exposing comprises:

selectively exposing the portions of the photo-sensitive adhesive layer to differentially adhere ones of the active components to the transparent intermediate substrate.

10. An active component array, comprising:

at least one printable electronic component comprising a conductive element on a primary surface thereof, the conductive element being configured to provide an electrical coupling to at least one active element on the primary surface, wherein the at least one electronic component includes a photo-adhesive layer residue on the primary surface thereof, wherein the residue comprises a broken portion of a tether configured to adhere the at least one electronic component to a transparent intermediate substrate, wherein the photo-adhesive layer residue comprises a material configured to provide altered adhesive strength responsive to exposure to electromagnetic radiation; and

a destination substrate including one or more electrical contacts on a surface thereof, wherein the at least one electronic component is printed on the destination substrate such that the conductive element on the primary surface thereof is in contact with a respective one of the electrical contacts on the receiving surface of the destination substrate.

11. A method for fabricating a substrate having transferable chiplets, comprising:

providing a source substrate having a process side and a plurality of active components adjacent the process side of the source substrate;

providing a transparent intermediate substrate having a patterned side;

providing a photo-sensitive adhesive layer on the patterned side of the transparent intermediate wafer or on the active components;

adhering the patterned side of the transparent intermediate substrate to the process side of the source substrate via the photo-sensitive adhesive layer;

removing portions of the source substrate to singulate the active components and adhere the singulated active components to the patterned side of the transparent intermediate substrate;

selectively exposing the photo-sensitive adhesive layer to electromagnetic radiation to alter an adhesive strength thereof such that portions of the photo-sensitive adhesive layer have a weaker adhesive strength than other portions thereof; and

selectively removing the portions of the photo-sensitive adhesive layer having the weaker adhesive strength to define breakable tethers comprising the other portions of the photo-sensitive adhesive layer that physically connect the singulated active components to the transparent intermediate substrate.

12. The method of claim 11, further including forming an optical mask on the patterned side of the transparent intermediate substrate and selectively exposing the photo-sensitive adhesive layer to electromagnetic radiation through the optical mask.

13. The method of claim 11, further including selectively exposing the photo-sensitive adhesive layer to electromagnetic radiation with a patterned laser beam.

14. The method of claim 13, further including selectively exposing the photo-sensitive adhesive layer to differentially adhere ones of the active components.

15. The method of claim 14, further including selectively exposing the photo-sensitive adhesive layer to differentially adhere electrically defective ones of the active components.

16. The method of claim 11, further including:

providing a destination substrate having a receiving side;

providing a patterned stamp having a plurality of pillars, each pillar spatially corresponding to an active component;

pressing the stamp pillars against the active components to detach the active components from the transparent intermediate substrate, thereby adhering the active components to the stamp pillars; and

pressing the active components against the receiving side of the destination substrate with the stamp to adhere the active components to the destination substrate.

17. The method of claim 16, further including:

removing remaining portions of the photo-sensitive adhesive layer from the transparent intermediate substrate.

18. The method of claim 17, further including:

coating a second photo-sensitive adhesive layer on the patterned side of the transparent intermediate wafer; and

adhering the process side of a second source substrate to the patterned side of the transparent intermediate substrate.

19. The method of claim 16, further including breaking the tethers.

20. The method of claim 11, further including providing a source substrate that is a semiconductor wafer, a silicon wafer, or a gallium arsenide wafer.

21. The method of claim 11, further including providing active components that include a crystalline, a microcrystalline, a polycrystalline, or an amorphous semiconductor material.

22. The method of claim 11, further including first removing the majority of the source substrate in a first step and removing a minority of the source substrate in a second step different from the first step.

23. The method of claim 22, further including removing a portion of the source substrate before the transparent intermediate substrate is adhered to the source substrate.

24. The method of claim 11, further including exposing the photo-sensitive adhesive layer to patterned electromagnetic radiation before the source substrate is adhered to the transparent intermediate substrate, after the source substrate is adhered to the transparent intermediate substrate, after portions of the source substrate are removed, or after a first portion of the source substrate is removed but before a second portion of the source substrate is removed.

25. The method of claim 11, further including grinding or etching back the source substrate leaving the active components on the process side adhered to the patterned side of the transparent intermediate substrate.

26. The method of claim 11, wherein the tethers physically connect the active components in a component layer to the transparent intermediate substrate in a substrate layer, wherein the tethers are formed in a tether layer that is between the component layer and the substrate layer, and wherein the component layer, the tether layer, and the substrate layer are all different layers.

27. The method of claim 11, further including coating the photosensitive adhesive layer from an adhesive carrier.

28. The method of claim 11, further including providing a transparent intermediate substrate with protruding structures on the patterned side.

29. The method of claim 11, further including using chemical processes or laser ablation to shape the tethers.

30. A transfer device, comprising:

a transparent intermediate substrate having a patterned side;

a patterned photo-sensitive adhesive layer adhered to the patterned side of the transparent intermediate substrate, the patterned adhesive layer comprising a material configured to provide altered adhesive strength responsive to exposure to electromagnetic radiation; and

a plurality of singulated active components adhered to the patterned adhesive layer, the patterned adhesive layer located between the patterned side of the transparent intermediate substrate and the singulated active components, the patterned adhesive layer forming breakable tethers physically connecting the singulated active components to the patterned side of the transparent intermediate substrate.

31. The transfer device of claim 30, further including a mask on the patterned side of the transparent intermediate substrate.

32. The transfer device of claim 30, wherein the patterned adhesive layer is a photo-sensitive polymer.

33. The transfer device of claim 30, wherein the tethers are breakable tethers.

34. The transfer device of claim 30, wherein the transparent intermediate substrate is a quartz substrate.

35. The transfer device of claim 30, wherein the active components form a component layer, the transparent intermediate substrate forms a substrate layer, and the tethers form a tether layer that is between the component layer and the substrate layer, and wherein the component layer, the tether layer, and the substrate layer are all different layers.

36. The transfer device of claim 30, wherein the active components have a process side and a different back side, the active components have connection pads formed on the process side, and the process side is adhered to the patterned adhesive layer.

37. The transfer device of claim 30, wherein the patterned side of the transparent intermediate substrate is structured to increase a distance between portions of the transparent intermediate substrate and the active components.

38. The transfer device of claim 30, wherein the tethers are shaped to control a manner in which the tethers breaks when mechanically stressed or to control particulate residue when the tether breaks.

39. The transfer device of claim 30, further including conductive or adhesive materials located on the connection pads.