LED LIGHTING DEVICE

• US 20120314440A1
• Filed: 11/29/2010
• Published: 12/13/2012
• Est. Priority Date: 12/18/2009
• Status: Abandoned Application

• Current Assignee: OSRAM Licht AG (Ams-Osram AG)
• Original Assignee: OSRAM Licht AG (Ams-Osram AG)
• Inventors: Hellinger, Leopold, Neumann, Gerhard, Vogt, Gerald
• Application Number:
  US13/516,247
• Publication Number:
  US 20120314440A1
• Time in Patent Office: Days
• US Class Current: 362/516
• CPC Class Codes: F21S 41/141 Light emitting diodes [LED]
• CPC Class Codes: F21S 41/192 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 43/195 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21V 15/01 Housings, e.g. material or assembling of housing parts F21V15/02 takes precedence housings forming signs or letters G09F13/04
• CPC Class Codes: F21V 19/0035 the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
• CPC Class Codes: F21V 19/005 by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
• CPC Class Codes: F21V 23/005 the substrate is supporting also the light source
• CPC Class Codes: F21V 29/713 in direct thermal and mechanical contact of each other to form a single system
• CPC Class Codes: F21V 29/87 Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]

Abstract

A lighting device may include a circuit board, at least one light emitting diode fastened to the circuit board, and a housing, wherein the circuit board is a wall segment of the housing.

Claims

1. A lighting device, comprising:

a circuit board;

at least one light emitting diode fastened to the circuit board; and

a housing;

wherein the circuit board is a wall segment of the housing.

2. The lighting device as claimed in claim 1, wherein the circuit board is or has a more or less flat surface.

3. The lighting device as claimed in claim 1, wherein the circuit board and the housing consist of a uniform plastic or thermoplastic.

4. The lighting device as claimed in claim 1,

wherein the circuit board is inserted into a recess of a wall of the housing, and

wherein the circuit board has borders or edges via which the circuit board is firmly bonded to the wall.

5. The lighting device as claimed in claim 4,

wherein the borders or edges of the circuit board are bonded to the wall via a friction welding process or an ultrasonic welding process, or by means of adhesive.

6. The lighting device as claimed in claim 5,

wherein at least two of the borders or edges of the circuit board are more or less parallel.

7. The lighting device as claimed in claim 1,

which is a headlamp or a daytime running lamp of a vehicle.

8. The lighting device as claimed in claim 7, further comprising:

a reflector arrangement which has a plurality of reflectors,

wherein the circuit board, when the vehicle headlight is installed, is disposed above the reflector arrangement, and

wherein each reflector is assigned a light emitting diode or a power light emitting diode.

9. The lighting device as claimed in claim 1,

wherein the circuit board has conducting paths and cooling surfaces of copper.

10. The lighting device as claimed in claim 1,

wherein the circuit board has recesses which are filled with solder.

11. A method for producing a lighting device, the lighting device comprising:

a circuit board;

at least one light emitting diode fastened to the circuit board; and

a housing;

wherein the circuit board is a wall segment of the housing;

the method comprising;

chemical application of copper onto the PCB;

phototechnical deposition of a conductive pattern in the copper;

release etching of the areas of the conductive pattern that are not required;

conventional mounting on the circuit board of the light emitting diodes or power light emitting diodes and of other electronic components; and

bonding of the housing to the circuit board by means of friction welding, ultrasound bonding or adhesion.

12. The method as claimed in claim 11,

wherein the conductive pattern is galvanically copper-plated after the release etching of the surfaces that are not required.

13. The method as claimed in claim 11, wherein the circuit board is assembled using an automatic SMD placement system and a reflow oven.

14. The method as claimed in claim 13,

wherein the recesses of the circuit board are filled with solder before the circuit board is assembled.

15. The method as claimed in claim 11,

wherein the conductive pattern is galvanically copper-plated to a thickness of 50-100 μ

m.