SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

• US 20120319150A1
• Filed: 03/07/2012
• Published: 12/20/2012
• Est. Priority Date: 06/17/2011
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: KOMATSU, Tetsuro, SHIMOMURA, Kenji
• Granted Patent: US 8,753,907 B2
• Time in Patent Office: Days
• US Class Current: 257/98
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12035 Zener diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

According to one embodiment, a method for manufacturing a semiconductor light emitting device includes: preparing a metal plate including first frames and second frames, the first frames and the second frames being alternately arranged and spaced from each other, a light emitting element being fixed to each of the first frames, the light emitting element being connected to an adjacent one of the second frames via a metal wire; molding a first resin on the metal plate, the first resin covering the first frame, the second frame, and the light emitting element; forming in the first resin a groove defining a resin package including the first frame, the second frame, and the light emitting element; filling a second resin inside the groove; and forming the resin package with an outer edge of the first resin covered with the second resin by cutting the second resin along the groove.

Claims

1. A method for manufacturing a semiconductor light emitting device, comprising:

preparing a metal plate including a plurality of first frames and a plurality of second frames, the first frames and the second frames being alternately arranged and spaced from each other, a light emitting element being fixed to each of the first frames, the light emitting element being connected to an adjacent one of the second frames via a metal wire;

molding a first resin on the metal plate, the first resin covering the first frame, the second frame, and the light emitting element;

forming in the first resin a groove defining a resin package including the first frame, the second frame, and the light emitting element;

filling a second resin inside the groove; and

forming the resin package with an outer edge of the first resin covered with the second resin by cutting the second resin along the groove.

2. The method according to claim 1, further comprising:

affixing a sacrificial sheet on a surface of the first resin; and

removing the second resin formed on the first resin together with the sacrificial sheet while leaving the second resin filled in the groove.

3. The method according to claim 1, further comprising:

exposing a surface of the first resin by polishing or grinding a surface of the second resin.

4. The method according to claim 1, further comprising:

affixing a dicing sheet to a back surface of the metal plate with the first resin formed thereon, the back surface being on opposite side from the first resin,

wherein the groove is formed so as to extend from a surface of the first resin to the dicing sheet.

5. The method according to claim 4, wherein the second resin is filled in the groove having a width widened by expanding the dicing sheet.

6. The method according to claim 1, wherein the groove is formed from a surface of the first resin to a depth not reaching the metal plate.

7. The method according to claim 1, wherein

the groove is formed from a surface of the first resin to a depth reaching the metal plate, and

the metal plate is half-cut at bottom of the groove.

8. The method according to claim 1, wherein the groove is provided only in a portion extending in one direction of an outer periphery of the resin package.

9. The method according to claim 1, wherein the second resin includes a reflective material reflecting light emitted by the light emitting element.

10. The method according to claim 9, wherein light distribution characteristics are controlled by changing amount of the reflective material included in the second resin.

11. The method according to claim 9, wherein light distribution characteristics are controlled by changing thickness of the second resin.

12. The method according to claim 1, wherein the first resin includes a same material as the second resin.

13. The method according to claim 1, wherein the first resin and the second resin include silicone resin.

14. The method according to claim 1, wherein the first resin includes at least one of silicate-based phosphor, YAG-based phosphor, and sialon-based phosphor.

15. The method according to claim 1, wherein the groove is formed by cutting at least part of the first resin with a dicing blade.

16. The method according to claim 1, wherein the second resin is cut with a dicing blade having a narrower width than the groove.

17. A semiconductor light emitting device comprising:

a first frame;

a light emitting element fixed to the first frame;

a second frame spaced from the first frame and electrically connected to an electrode of the light emitting element via a metal wire; and

a resin package including a first resin covering the light emitting element, the first frame, and the second frame, and a second resin covering an outer edge of the first resin and reflecting light emitted by the light emitting element,

a back surface of the first frame on opposite side from a front surface with the light emitting element fixed thereto, and a back surface of the second frame on opposite side from a front surface with the metal wire connected thereto, being exposed at one major surface of the resin package,

an end surface of the first frame and an end surface of the second frame being exposed at a plurality of side surfaces crossing the major surface,

thickness of the first frame being thinner at the end surface than in a portion with the light emitting element fixed thereto, and

thickness of the second frame being thinner at the end surface than in a portion with the metal wire connected thereto.

18. The device according to claim 17, wherein the first resin includes at least one of silicate-based phosphor, YAG-based phosphor, and sialon-based phosphor.

19. A semiconductor light emitting device comprising:

a first frame;

a light emitting element fixed to the first frame;

a second frame spaced from the first frame and electrically connected to an electrode of the light emitting element via a metal wire; and

a resin package including a first resin covering the light emitting element, the first frame, and the second frame, and a second resin covering an outer edge of the first resin and reflecting light emitted by the light emitting element,

a back surface of the first frame on opposite side from a front surface with the light emitting element fixed thereto, and a back surface of the second frame on opposite side from a front surface with the metal wire connected thereto, being exposed at one major surface of the resin package, and

in plan view parallel to the major surface, the first frame and the second frame being located inside an outer edge of the resin package.

20. The device according to claim 19, wherein the first resin includes at least one of silicate-based phosphor, YAG-based phosphor, and sialon-based phosphor.