WIRING BOARD WITH BUILT-IN SEMICONDUCTOR ELEMENT
1 Assignment
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Accused Products
Abstract
A wiring board including a built-in semiconductor element includes the semiconductor element, a peripheral insulating layer covering an outer peripheral side surface of the semiconductor element, an upper surface-side wiring provided on an upper surface side of the wiring board, and a lower surface-side wiring provided on a lower surface side of the wiring board. The semiconductor element includes a first wiring structure layer including a first wiring and a first insulating layer alternately provided on a semiconductor substrate, and a second wiring structure layer including a second wiring and a second insulating layer alternately provided on the first wiring structure layer. The upper surface-side wiring includes a wiring electrically connected to the first wiring via the second wiring. The second wiring is thicker than the first wiring and thinner than the upper surface-side wiring. The second insulating layer is formed of a resin material and is thicker than the first insulating layer.
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Citations
56 Claims
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1-28. -28. (canceled)
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29. A wiring board including a built-in semiconductor element, the wiring board comprising:
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the semiconductor element; a peripheral insulating layer covering at least an outer peripheral side surface of the semiconductor element; an upper surface-side wiring provided on an upper surface side of the wiring board; and a lower surface-side wiring provided on a lower surface side of the wiring board, wherein the semiconductor element comprises; a semiconductor substrate; a first wiring structure layer including a first wiring and a first insulating layer alternately provided on the semiconductor substrate; and a second wiring structure layer including a second wiring and a second insulating layer alternately provided on the first wiring structure layer, the upper surface-side wiring includes a wiring electrically connected to the first wiring via the second wiring, the second wiring is thicker than the first wiring and thinner than the upper surface-side wiring, and the second insulating layer is formed of a resin material and is thicker than the first insulating layer. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56)
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Specification