Phosphor Layer Arrangement for Use With Light Emitting Diodes

• US 20120319573A1
• Filed: 12/19/2011
• Published: 12/20/2012
• Est. Priority Date: 09/10/2008
• Status: Abandoned Application

• Current Assignee: Bridgelux Incorporated
• Original Assignee: Bridgelux Incorporated
• Inventors: Shi, Wei
• Application Number:
  US13/330,393
• Publication Number:
  US 20120319573A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21L 4/027 the light sources being a LED
• CPC Class Codes: F21S 8/08 with a standard F21S6/00 takes precedence
• CPC Class Codes: F21W 2131/103 of streets or roads
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

Phosphor layer arrangement for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, the lens positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation. In an aspect, a light emitting diode lamp is provided that includes a package, a least one light emitting diode, an encapsulation covering the at least one light emitting diode, a lens having a phosphor layer formed upon a bottom surface, wherein the lens is positioned to cover at least part of the encapsulation, and an air gap between the phosphor layer and the encapsulation.

Claims

1. A device comprising:

at least one light emitting diode;

a lower layer formed proximate the at least one light emitting diode;

an upper layer formed upon the lower layer;

a plurality of conductors disposed between the upper layer and the lower layer and configured to provide current to the at least one light emitting diode; and

a reflector formed upon the upper layer and the lower layer.

2. The device as recited in claim 1, wherein the reflector comprises two sloped reflector portions having the conductors therebetween.

3. The device as recited in claim 1, further comprising a lens having a phosphor layer formed upon a bottom surface of the lens, wherein the lens is configured to receive light from the at least one light emitting diode.

4. The lamp of claim 3, wherein the phosphor layer comprises an inorganic dye.

5. The lamp of claim 3, wherein the phosphor layer has a uniform thickness.

6. The lamp of claim 3, wherein the phosphor layer has a varying thickness.

7. The lamp of claim 3, wherein the phosphor layer has a thickness in the range of approximately 5 to 500 microns.

8. The lamp of claim 3, further comprising an encapsulation covering the at least one light emitting diode and an air gap between the phosphor layer and the encapsulation wherein the air gap has a thickness in the range of approximately 5 to 1000 microns.

9. A device comprising:

at least one light emitting diode;

a lower layer formed proximate the at least one light emitting diode;

an upper layer formed upon the lower layer;

a lead frame disposed between the upper layer and the lower layer; and

a stepped reflector formed upon the upper layer and the lower layer.

10. A device comprising:

at least one light emitting diode;

a lower layer of plastic formed proximate the at least one light emitting diode;

an upper layer of plastic formed upon the lower layer of plastic;

a plurality of conductors disposed between the upper layer of plastic and the lower layer of plastic; and

a stepped reflector formed upon the upper layer of plastic and the lower layer of plastic, the stepped reflector comprising two sloped reflector portions having a wire bonding region of the conductors therebetween.