VARIABLE-THICKNESS ELECRIPLAST MOLDABLE CAPSULE AND METHOD OF MANUFACTURE
First Claim
1. A moldable capsule device comprising:
- a bundle of micron conductive fiber; and
a resin-based material layer overlying the bundle along the length of the capsule wherein thickness of the resin-based material layer is not uniform.
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Accused Products
Abstract
A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2), A method (100) to form a moldable capsule (1) including extruding/pultruding a resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3), The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2), The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extruded/pultruded resin-based material and bundle are section into moldable capsules.
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Citations
37 Claims
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1. A moldable capsule device comprising:
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a bundle of micron conductive fiber; and a resin-based material layer overlying the bundle along the length of the capsule wherein thickness of the resin-based material layer is not uniform. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 31)
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14. A moldable capsule device comprising:
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a bundle of micron conductive fiber; and a resin-based material layer overlying the bundle along the length of the capsule wherein the resin-based material layer has a first thickness and a second thickness, wherein the first thickness is disposed around multiple first surfaces of the bundle and the second thickness is disposed around multiple second surfaces of the bundle, and wherein the second thickness is at least twice that of the first thickness. - View Dependent Claims (15, 16, 17, 18, 19, 20, 22, 23)
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21. The device of claim 54 wherein the bundle is between about 20% and 50% of the weight of the moldable capsule.
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24. A method to form a moldable capsule comprising:
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extruding/pultruding a resin-based material layer onto the length of a bundle of micron conductive fiber wherein the resin-based material layer has a first thickness and a second thickness, wherein the first thickness is disposed around multiple first surfaces of the bundle and the second thickness is disposed around multiple second surfaces of the bundle, and wherein the second thickness is at least twice that of the first thickness; and sectioning said extruded/pultruded resin-based material and said bundle into moldable capsules. - View Dependent Claims (25, 26, 27, 28, 29, 30, 32, 33, 34, 35, 36, 37)
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Specification