VARIABLE-THICKNESS ELECRIPLAST MOLDABLE CAPSULE AND METHOD OF MANUFACTURE

• US 20120321836A1
• Filed: 08/10/2012
• Published: 12/20/2012
• Est. Priority Date: 02/15/2001
• Status: Abandoned Application

• Current Assignee: Integral Technologies, Inc.
• Original Assignee: Integral Technologies, Inc.
• Inventors: Aisenbrey, Thomas
• Application Number:
  US13/572,163
• Publication Number:
  US 20120321836A1
• Time in Patent Office: Days
• US Class Current: 428/80
• CPC Class Codes: B29B 11/16 comprising fillers or reinforcement non-woven fabrics per se D04H1/00, D04H3/00
• CPC Class Codes: B29B 7/90 Fillers or reinforcements , e.g. fibres
• CPC Class Codes: B29C 2793/0027 Cutting off
• CPC Class Codes: B29C 48/0022 combined with cutting
• CPC Class Codes: B29C 48/05 Filamentary, e.g. strands
• CPC Class Codes: B29C 48/06 Rod-shaped
• CPC Class Codes: B29C 48/08 flexible, e.g. films
• CPC Class Codes: B29C 48/12 Articles with an irregular circumference when viewed in cross-section, e.g. window profiles
• CPC Class Codes: B29C 48/15 incorporating preformed parts or layers, e.g. extrusion moulding around inserts
• CPC Class Codes: B29C 48/154 Coating solid articles, i.e. non-hollow articles
• CPC Class Codes: B29C 48/287 Raw material pre-treatment while feeding B29C48/78 takes precedence
• CPC Class Codes: B29C 48/2883 of preformed parts, e.g. inserts fed and transported generally uninfluenced through the extruder or inserts fed directly to the die
• CPC Class Codes: B29C 48/2886 of fibrous, filamentary or filling materials, e.g. thin fibrous reinforcements or fillers
• CPC Class Codes: B29C 48/297 at several locations, e.g. using several hoppers or using a separate additive feeding
• CPC Class Codes: B29C 48/34 Cross-head annular extrusion nozzles, i.e. for simultaneously receiving moulding material and the preform to be coated
• CPC Class Codes: B29C 48/355 Conveyors for extruded articles
• CPC Class Codes: B29C 48/832 Heating
• CPC Class Codes: B29C 70/521 and impregnating the reinforcement before the die
• CPC Class Codes: B29C 70/523 and impregnating the reinforcement in the die
• CPC Class Codes: B29K 2105/12 of short lengths, e.g. chopped filaments, staple fibres or bristles
• CPC Class Codes: B29K 2105/16 : Fillers
• CPC Class Codes: B29K 2995/0005 : Conductive
• CPC Class Codes: B29K 2995/0011 : Electromagnetic wave shielding material
• CPC Class Codes: B29L 2031/3456 : Antennas, e.g. radomes

Abstract

A moldable capsule device (1) includes a bundle of micron conductive fiber (3) and a resin-based material layer (5) overlying the bundle along the length (L) of the capsule wherein thickness of the resin-based material layer is not uniform (T1 and T2), A method (100) to form a moldable capsule (1) including extruding/pultruding a resin-based material layer (5) onto the length (L) of a bundle of micron conductive fiber (3), The resin-based material layer (5) has a first thickness (T1) and a second thickness (T2), The first thickness (T1) is disposed around multiple first surfaces (7) of the bundle. The second thickness (T2) is disposed around multiple second surfaces (9) of the bundle. The second thickness (T2) is at least twice that of the first thickness (T1). The extruded/pultruded resin-based material and bundle are section into moldable capsules.

Claims

1. A moldable capsule device comprising:

a bundle of micron conductive fiber; and

a resin-based material layer overlying the bundle along the length of the capsule wherein thickness of the resin-based material layer is not uniform.

2. The device according to claim 1 wherein the resin-based material layer has a first thickness and a second thickness and wherein the second thickness is at least twice that of the first thickness.

3. The device according to claim 2 wherein the first thickness is disposed around a first surface of the bundle and the second thickness is disposed around a second surface of the bundle.

4. The device according to claim 2 wherein the first thickness is disposed around multiple first surfaces of the bundle and the second thickness is disposed around multiple second surfaces of the bundle.

5. The device according to claim 4 wherein the cross-section of the moldable capsule is “

bowtie-shaped”

.

6. The device according to claim 4 wherein the cross-section of the moldable capsule is “

gear-shaped”

.

7. The device according to claim 4 wherein the cross-section of the moldable capsule is “

star-shaped”

.

8. The device of claim 1 wherein the resin-based material further comprises a micron conductive powder.

9. The device of claim 1 wherein the bundle further comprises micron conductive powder.

10. The device of claim 1 wherein the bundle is between about 5% and 50% of the weight of the moldable capsule.

11. The device of claim 1 wherein the bundle is between about 20% and 50% of the weight of the moldable capsule.

12. The device of claim 1 wherein the bundle is between about 1% and 50% of the volume of the moldable capsule.

13. The device of claim 1 wherein the bundle is between about 4% and 10% of the weight of the moldable capsule.

31. The moldable capsule of claim 1 wherein the bundle is between about 20% and 50% of the weight of the moldable capsule.

14. A moldable capsule device comprising:

a bundle of micron conductive fiber; and

a resin-based material layer overlying the bundle along the length of the capsule wherein the resin-based material layer has a first thickness and a second thickness, wherein the first thickness is disposed around multiple first surfaces of the bundle and the second thickness is disposed around multiple second surfaces of the bundle, and wherein the second thickness is at least twice that of the first thickness.

15. The device according to claim 14 wherein the cross-section of the moldable capsule is “

bowtie-shaped”

.

16. The device according to claim 14 wherein the cross-section of the moldable capsule is “

gear-shaped”

.

17. The device according to claim 14 wherein the cross-section of the moldable capsule is “

star-shaped”

.

18. The device of claim 14 wherein the resin-based material further comprises a micron conductive powder.

19. The device of claim 14 wherein the bundle further comprises micron conductive powder.

20. The device of claim 14 wherein the bundle is between about 5% and 50% of the weight of the moldable capsule.

22. The device of claim 14 wherein the bundle is between about 1% and 50% of the volume of the moldable capsule.

23. The device of claim 14 wherein the bundle is between about 4% and 10% of the weight of the moldable capsule.

21. The device of claim 54 wherein the bundle is between about 20% and 50% of the weight of the moldable capsule.

24. A method to form a moldable capsule comprising:

extruding/pultruding a resin-based material layer onto the length of a bundle of micron conductive fiber wherein the resin-based material layer has a first thickness and a second thickness, wherein the first thickness is disposed around multiple first surfaces of the bundle and the second thickness is disposed around multiple second surfaces of the bundle, and wherein the second thickness is at least twice that of the first thickness; and

sectioning said extruded/pultruded resin-based material and said bundle into moldable capsules.

25. The method according to claim 24 wherein the cross-section of the moldable capsule is “

bowtie-shaped”

.

26. The method according to claim 24 wherein the cross-section of the moldable capsule is “

gear-shaped”

.

27. The method according to claim 24 wherein the cross-section of the moldable capsule is “

star-shape”

.

28. The method of claim 24 wherein the resin-based material further comprises a micron conductive powder.

29. The moldable capsule of claim 24 wherein the bundle further comprises micron conductive powder.

30. The method of claim 24 wherein, the bundle is between about 5% and 50% of the weight of the moldable capsule,

32. The moldable capsule of claim 24 wherein the bundle is between about 1% and 50% of the volume of the moldable capsule,

33. The moldable capsule of claim 24 wherein the bundle is between about 4% and 10% of the weight of the moldable capsule.

34. The method according to claim 24 further comprising the step of compressing the bundle of micron conductive fiber strands prior to the step of extruding/pultruding.

35. The method according to claim 24 farther comprising the step of pre-treating said bundle prior to the step of extruding/pultruding.

36. The method according to claim 35 wherein the step of pre-treating comprises forming a chemically inert coupling agent onto the bundle.

37. The method according to claim 35 wherein the step of pre-treating comprises anodizing the bundle.