Reaction chip, reaction method, temperature controlling unit for gene treating apparatus and gene treating apparatus

• US 20120322110A1
• Filed: 08/23/2012
• Published: 12/20/2012
• Est. Priority Date: 10/26/2007
• Status: Abandoned Application

• Current Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Original Assignee: Toppan Printing Co., Ltd. (TOPPAN Holdings, Inc.)
• Inventors: GOMI, Sayaka, AKASHI, Shuichi, NUMAI, Daisuke, IMAGAWA, Ryoko, CHINO, Masaaki, KAWATA, Eiji, AMANO, Masahiko
• Application Number:
  US13/573,138
• Publication Number:
  US 20120322110A1
• Time in Patent Office: Days
• US Class Current: 435/91.2
• CPC Class Codes: B01L 2200/0642 Filling fluids into wells by specific techniques
• CPC Class Codes: B01L 2200/0684 Venting, avoiding backpressure, avoid gas bubbles
• CPC Class Codes: B01L 2200/16 Reagents, handling or storing thereof
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/087 Multiple sequential chambers
• CPC Class Codes: B01L 2300/123 Flexible; Elastomeric
• CPC Class Codes: B01L 2400/0655 pinch valves
• CPC Class Codes: B01L 2400/0677 phase change valves; Meltable, freezing, dissolvable plugs; Destructible barriers
• CPC Class Codes: B01L 2400/084 Passive control of flow resistance
• CPC Class Codes: B01L 3/5025 for parallel transport of multiple samples
• CPC Class Codes: B01L 3/502723 characterised by venting arrangements
• CPC Class Codes: B01L 3/50851 specially adapted for heating or cooling samples laboratory heating apparatus B01L7/00; incubators C12M
• CPC Class Codes: B01L 3/527 for a plurality of reagents
• CPC Class Codes: B01L 7/52 with provision for submitting samples to a predetermined sequence of different temperatures, e.g. for treating nucleic acid samples amplification or hybridisation processes per se C12Q1/68; controlling sequential reactions for synthesis B01J19/0046
• CPC Class Codes: G01N 2035/00158 Elements containing microarrays, i.e. "biochip"
• CPC Class Codes: G01N 2035/00366 Several different temperatures used

Abstract

The reaction chip of the present invention has a plurality of recesses 6 constituting a part of a reaction container and a groove constituting a part of a channel formed on at least one of one face of a first base material (resin base material 2) and one face of a second base material (metallic base material) and a notch 15 showing a gradual increase in width and a gradual increase in depth from one face 2d of the base material toward an inner wall surface 6d of the recess is formed on an edge of at least one recess in an extending direction of the groove. One face of the first base material and one face of the second base material are stuck together opposite to each other to form the plurality of reaction containers and the channel.

Claims

1. A reaction method using a reaction chip having a plurality of reaction containers constituted by a pair of base materials and a channel that mutually communicates with the plurality of reaction containers, the method comprising the steps of:

arranging a reagent inside a recess of a first base material of the pair of base materials, the recess constituting a part of one of the reaction containers formed in the first base material;

sealing the reagent with a hot-melt sealing compound;

producing the reaction chip, having the reaction containers in which the reagent is arranged and the channel, by sticking together the first base material and a second base material of the pair of base materials, the second base material constituted by a material whose thermal conductivity is higher than that of the first base material;

feeding a reagent solution into the reaction containers through the channel; and

causing a reaction of the reagent and the reagent solution to proceed while heat is added from a side of the second base material, after the reagent and the reagent solution are brought into contact with each other by heating the reaction chip from the side of the second base material to melt the sealing compound.

2. The reaction method according to claim 1, wherein the first base material and the second base material are stuck together through thermal welding of a sealant layer provided on at least one side of the first base material and the second base material by adding heat from the side of the second base material.

3. The reaction method according to claim 1, wherein the recess in the first base material and a recess in the second base material constitute the one reaction container.

4. The reaction method according to claim 1, wherein a resin material is used as the first base material and a metallic material is used as the second base material.

5. The reaction method according to claim 1, wherein the sealing compound is constituted by a material that is soluble in neither the reagent nor the reagent solution.

6. The reaction method according to claim 1, wherein the one reaction container is a reaction container for enzyme reaction.